A switch element includes a first wiring line that is provided in a first insulating film and extends in a first direction; a second wiring line that is provided in a second insulating film and extends in a second direction that intersects the first direction; an ion conductive layer sandwiched between the first wiring line and the second wiring line and directly in contact with the second wiring line in an intersection region where the first wiring line and the second wiring line intersect, and enabled to conduct metal ions supplied from the second wiring line; and a metal oxide film sandwiched between the first wiring line and the ion conductive layer.

Provided are embodiments for method of fabricating a dual damascene crossbar array. The method includes forming a bottom electrode layer on a substrate and forming a first memory device on the bottom electrode layer. The method also includes forming a dual damascene structure on the first memory device, wherein the dual damascene structure includes a top electrode layer and a first via, wherein the first via is formed between the first memory device and the top electrode layer. Also provided are embodiments for the dual damascene crossbar and embodiments for disabling memory devices of the dual damascene crossbar array.

A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.

An apparatus is provided that includes a plurality of data arrays each comprising first memory cells, a plurality of read reference arrays each comprising second memory cells, a plurality of write reference arrays each comprising third memory cells, an access block comprising a memory cell from each of the plurality of data arrays, each of the plurality of read reference arrays, and each of the plurality of write reference arrays, and a memory controller. The memory controller is configured to determine a read threshold voltage to compensate a drift of a threshold voltage of the first memory cells, wherein the read threshold voltage is determined based on threshold voltages of a plurality of second memory cells, and a read offset voltage to compensate an offset voltage of the first memory cells, wherein the read offset voltage is determined based on offset voltages of a plurality of second memory cells.

Approaches for fabricating RRAM stacks with reduced forming voltage, and the resulting structures and devices, are described. In an example, a resistive random access memory (RRAM) device includes a conductive interconnect in an inter-layer dielectric (ILD) layer above a substrate. An RRAM element is on the conductive interconnect, the RRAM element including a first electrode layer on the uppermost surface of the conductive interconnect. A resistance switching layer is on the first electrode layer, the resistance switching layer including a first metal oxide material layer on the first electrode layer, and a second metal oxide material layer on the first metal oxide material layer, the second metal oxide material layer including a metal species not included in the first metal oxide material layer. An oxygen exchange layer is on the second metal oxide material layer of the resistance switching layer. A second electrode layer is on the oxygen exchange layer.

A memory cell includes a first resistive memory element, a second resistive memory element electrically coupled with the first resistive memory element at a common node, and a switching element comprising an input terminal electrically coupled with the common node, the switching element comprising a driver configured to float during one or more operations.

Apparatuses, methods, and systems for generating patterns for memory using threshold voltage difference are disclosed. An embodiment includes circuitry and a memory array including a plurality of memory cells. The circuitry can select a group of memory cells from the plurality of memory cells, program each memory cell of the group to a first data state, determine a first threshold voltage of each memory cell of the group, program each memory cell of the group to a second data state, perform a number of snapback events on each memory cell of the group, program each memory cell of the group to the first data state, determine a second threshold voltage of each memory cell of the group having the first data state, and generate a pattern for the memory array based, at least in part, on a difference between the first threshold voltage and the second threshold voltage.

The present disclosure includes apparatuses, methods, and systems for increase of a sense current in memory. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to apply, prior to sensing a data state of a memory cell of the plurality of memory cells, a voltage to an access line to which the memory cell is coupled, determine whether an amount of current on the access line in response to the applied voltage meets or exceeds a threshold amount of current, and determine whether to increase a magnitude of a current used to sense the data state of the memory cell based on whether the amount of current on the access line in response to the applied voltage meets or exceeds the threshold amount of current.

The present invention provides a method for reading a current for processing analog information in a memory array for a synaptic device. To this end, the present invention provides a method for reading a memory array including a two-terminal switching material, including (a) selecting at least one cell by applying a voltage to the memory array and (b) simultaneously measuring the sum of currents from the at least one cell selected. The voltage applied to the at least one cell selected in operation (a) is higher than a voltage applied to at least one cell not selected while being within a range in which all of the selected at least one cell is not turned on.

This disclosure describes a self-selective multi-terminal memtransistor suitable for use in crossbar array circuits. In particular, the memtransistor comprises a sapphire substrate that has a single-layer of polycrystalline molybdenum disulphide (MoS2) thin film formed on the surface of the substrate, wherein the MoS2 thin film comprise MoS2 grains that are oriented along terraces provided on the surface of the substrate. The memtransistor has a drain electrode and a source electrode that is formed on the MoS2 thin film such that a channel is defined in the MoS2 thin film between the drain and source electrodes, and a gate electrode formed above the channel, whereby the gate electrode is isolated from the channel by a gate dielectric layer.