A process is provided to trim PCRAM cells to have consistent programming curves. Initial programming curves of PCRAM cells are measured. A target programming curve is set up for the PCRAM cells. Each PCRAM cell is then modulated individually to meet the target programming curve.

Provided are embodiments for method of fabricating a dual damascene crossbar array. The method includes forming a bottom electrode layer on a substrate and forming a first memory device on the bottom electrode layer. The method also includes forming a dual damascene structure on the first memory device, wherein the dual damascene structure includes a top electrode layer and a first via, wherein the first via is formed between the first memory device and the top electrode layer. Also provided are embodiments for the dual damascene crossbar and embodiments for disabling memory devices of the dual damascene crossbar array.

A semiconductor memory device includes a first electrode and a second electrode, a phase change layer disposed between the first electrode and the second electrode, and a first layer disposed between the first electrode and the phase change layer. The phase change layer contains at least one of germanium (Ge), antimony (Sb), and tellurium (Te). The first layer contains aluminum (Al) and antimony (Sb), or tellurium (Te) and at least one of zinc (Zn), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu).

An embodiment of the present invention provides a method for implementing Boolean functionality to create AND, OR, NAND, NOR, or NOT logic gates using a single memristor. In an embodiment, a first voltage is applied to the memristor within a predetermined range of one of the prescribed Boolean functions to be performed by the memristor. A second voltage is then applied within the predetermined range of the prescribed Boolean function. The memristor then provides an output based on the Boolean function that has been prescribed. In an embodiment, the resistance value of the memristor is then reset by a reset pulse, wherein the reset pulse is another applied voltage.

Disclosed is a nonvolatile memory device including a plurality of memory cells operable to store data, each memory cell structured to include a resistance change layer exhibiting different resistance states with different resistance values for representing data, a write circuit suitable for generating a write pulse in a write mode to write data in a memory cell of the plurality of memory cells, and a read circuit suitable for generating a read pulse in a read mode to read data from a memory cell of the plurality of memory cells, wherein the memory cells are each structured to be operable in writing or reading data when a range of a voltage level change of the read pulse corresponding to a pulse width change of the read pulse is within a range of a voltage level change of the write pulse corresponding to a pulse width change of the write pulse.

According to one embodiment, a memory device includes a memory cell including a resistance change memory portion and a switching portion, and a voltage applying circuit carrying out, at a time of writing data to the memory cell, an operation of applying a voltage of a first polarity to the memory cell and applying a first voltage to the memory cell, an operation of applying a voltage of a second polarity to the memory cell and applying a second voltage to the memory cell, an operation of applying a voltage of the first polarity to the memory cell and applying a third voltage to the memory cell, or an operation of applying a voltage of the second polarity to the memory cell and applying a fourth voltage to the memory cell.

An electronic device includes a semiconductor memory. The semiconductor memory includes a word line, a bit line, and a memory cell coupled to and disposed between the word line and the bit line, the memory cell including a variable resistance layer that remains in an amorphous state regardless of a value of data stored in the memory cell. In a reset operation, the memory cell is programmed to a high-resistance amorphous state by applying, to the memory cell, a sub-threshold voltage that is greater than 0.7 time of a threshold voltage of the memory cell and is smaller than 0.95 time of the threshold voltage.

A switch device includes a first electrode, a second electrode, and a switch layer. The second electrode is disposed to face the first electrode. The switch layer is provided between the first electrode and the second electrode. The switch layer contains an amorphous material made of at least germanium (Ge) and one of nitrogen (N) and oxygen (O).

A method of obtaining a dot product includes applying a number of first voltages to a corresponding number of row lines within a memristive cross-bar array to change the resistive values of a corresponding number of memristors located a junctions between the row lines and a number of column lines. The first voltages define a corresponding number of values within a matrix, respectively. The method further includes applying a number of second voltages to a corresponding number of the row lines within the memristive cross-bar array. The second voltages define a corresponding number of vector values. The method further includes collecting the output currents from the column lines. The collected output currents define the dot product.

A memory device includes at least one memory cell which contains a resistive memory element having a conductive metal oxide located between a first electrode and a second electrode. The conductive metal oxide has a concentration of free electrons in thermodynamic equilibrium in a range from 1.0×10.sup.20/cm.sup.3 to 1.0×10.sup.21/cm.sup.3. A method of operating the memory device includes redistributing electron density to set and reset the device. An oxide barrier layer may be located between the conductive metal oxide and the second electrode.