A variable resistance element according to an embodiment serves to change to a low resistance state or a high resistance state. The variable resistance element includes a first transition metal compound layer, a second transition metal compound layer, and a lithium ion conductor layer. The first transition metal compound layer is connected to a first electrode. The first transition metal compound layer is a metal compound containing lithium ions in lattice interstices. The second transition metal compound layer is connected to a second electrode. The second transition metal compound layer is a metal compound containing lithium ions in lattice interstices. The lithium ion conductor layer is provided between the first transition metal compound layer and the second transition metal compound layer. The lithium ion conductor layer is a solid substance that is permeable to lithium ions and is less permeable to electrons.

A ferroelectric component includes a first electrode, a tunnel barrier layer disposed on the first electrode to include a ferroelectric material, a tunneling control layer disposed on the tunnel barrier layer to control a tunneling width of electric charges passing through the tunnel barrier layer, and a second electrode disposed on the tunneling control layer.

A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured.

A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric field effective to cause oxygen ionic motion.

An apparatus for high density memory with integrated logic. Specifically, a three terminal resistive random access memory (ReRAM) device having Schottky barriers that can switch from a low resistive state to a high resistive state is provided. The Schottky transistor memory device includes an insulating layer, a source region disposed on the insulating layer, a drain region disposed on the insulating layer, a binary or complex oxide memory material, a gate dielectric layer, and a gate electrode. As voltage is applied the Schottky barrier breaks down leading to the formation of a conductive anodic filament (CAF). The CAF is non-volatile and short-circuits the reverse-biased barrier thus keeping the device in a low resistance state. Removing the CAF switches the device back to a high resistance state. Thus, a new type of semiconductor device advantageously combines computation and memory further providing for very high density NAND chains.

The present disclosure relates to an integrated circuits device having an RRAM cell, and an associated method of formation. In some embodiments, the integrated circuit device has a lower metal interconnect line disposed within a lower inter-level dielectric (ILD) layer and an upper metal interconnect line disposed within an upper inter-level dielectric (ILD) layer. The integrated circuit device also has a memory cell array disposed between the lower metal interconnect line and the upper metal interconnect line, including memory cells arranged in rows and columns, the memory cells respectively includes a bottom electrode and a top electrode separated by a RRAM dielectric having a variable resistance. A bottom contact structure is disposed on the lower metal interconnect line and along sidewalls of the bottom electrode, electrically coupling the lower metal interconnect line and the bottom electrode.

A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.

According to one embodiment, a memory device includes first to third interconnects, memory cells, and selectors. The first to third interconnects are provided along first to third directions, respectively. The memory cells includes variable resistance layers formed on two side surfaces, facing each other in the first direction, of the third interconnects. The selectors couple the third interconnects with the first interconnects. One of the selectors includes a semiconductor layer provided between associated one of the third interconnects and associated one of the first interconnects, and gates formed on two side surfaces of the semiconductor layer facing each other in the first direction with gate insulating films interposed therebetween.

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Methods, systems, and devices related to 3D self-selecting-memory array of memory cells are described. The method relates to a solution for improving the fault-tolerant capability of memory devices, including: applying a triple-modular-redundancy calculation in a programming phase of the memory cells of a memory array, and adopting a sequence of two opposite dual polarity algorithms applied along a selected bit line and in parallel on the at least three selected word lines of the memory array.