A semiconductor memory device disposed over a substrate includes a common electrode, a selector material layer surrounding the common electrode, and a plurality of phase change material layers in contact with the selector material layer.

Methods and apparatuses for a cross-point memory array and related fabrication techniques are described. The fabrication techniques described herein may facilitate concurrently building two or more decks of memory cells disposed in a cross-point architecture. Each deck of memory cells may include a plurality of first access lines (e.g., word lines), a plurality of second access lines (e.g., bit lines), and a memory component at each topological intersection of a first access line and a second access line. The fabrication technique may use a pattern of vias formed at a top layer of a composite stack, which may facilitate building a 3D memory array within the composite stack while using a reduced number of processing steps. The fabrication techniques may also be suitable for forming a socket region where the 3D memory array may be coupled with other components of a memory device.

The present disclosure relates to a method for accessing an array of memory cells, including storing a set of user data in a plurality of memory cells, storing, in a portion of the array, additional information representative of a voltage difference between a first threshold voltage and a second threshold voltage of the memory cells programmed to a first logic state, applying to the array a read voltage to activate a first group of memory cells corresponding to a preset number of memory cells, determining that the first group of memory cells has been activated based on applying the read voltage, wherein the read voltage is equal to the first threshold voltage when the first group of memory cells has been activated, and based on the additional data information, applying the voltage difference to the array to activate a second group of memory cells programmed to the first logic state.

A resistive memory device includes: conductive layers and interlayer insulating layers, which are alternatively stacked; a vertical hole vertically penetrating the conductive layers and the interlayer insulating layers; a gate insulating layer disposed over an inner wall of the vertical hole; a charge trap layer disposed over an inner wall of the gate insulating layer; a channel layer disposed over an inner wall of the charge trap layer; and a variable resistance layer disposed over an inner wall of the channel layer.

A semiconductor device, the device including: a first silicon layer including first single crystal silicon; an isolation layer disposed over the first silicon layer; a first metal layer disposed over the isolation layer; a second metal layer disposed over the first metal layer; a first level including a plurality of transistors, the first level disposed over the second metal layer, where the isolation layer includes an oxide to oxide bond surface, where the plurality of transistors include a second single crystal silicon region; and a third metal layer disposed over the first level, where a typical first thickness of the third metal layer is at least 50% greater than a typical second thickness of the second metal layer.

Some embodiments include a memory device and methods of forming the memory device. One such memory device includes a first group of memory cells, each of the memory cells of the first group being formed in a cavity of a first control gate located in one device level of the memory device. The memory device also includes a second group of memory cells, each of the memory cells of the second group being formed in a cavity of a second control gate located in another device level of the memory device. Additional apparatus and methods are described.

A control method to operate a memory device, a control method to operate a memory system and a control system are provided. The control method includes providing a first voltage to a memory device for accessing a memory element of the memory device; obtaining an aging information of the memory device; and providing a second voltage to the memory device according to the aging information, wherein the first voltage and the second voltage are reverse biased voltages.

Embodiments of three-dimensional (3D) memory devices with embedded dynamic random-access memory (DRAM) and methods for forming the 3D memory devices are disclosed. In an example, a method for operating a 3D memory device is disclosed. The 3D memory device includes an input/output circuit, an array of embedded DRAM cells, and an array of 3D NAND memory strings in a same chip. Data is transferred through the input/output circuit to the array of embedded DRAM cells. The data is buffered in the array of embedded DRAM cells. The data is stored in the array of 3D NAND memory strings from the array of embedded DRAM cells.

Three-dimensional (3D) memory devices with 3D phase-change memory (PCM) and methods for forming and operating the 3D memory devices are disclosed. In an example, a 3D memory device includes a first semiconductor structure including an array of NAND memory cells, and a first bonding layer including first bonding contacts. The 3D memory device also further includes a second semiconductor structure including a second bonding layer including second bonding contacts, a semiconductor layer and a peripheral circuit and an array of PCM cells between the second bonding layer and the semiconductor layer. The 3D memory device further includes a bonding interface between the first and second bonding layers. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.

The present disclosure includes three dimensional memory arrays. An embodiment includes a first plurality of conductive lines separated from one another by an insulation material, a second plurality of conductive lines arranged to extend substantially perpendicular to and pass through the first plurality of conductive lines and the insulation material, and a storage element material formed between the first and second plurality of conductive lines where the second plurality of conductive lines pass through the first plurality of conductive lines. The storage element material is between and in direct contact with a first portion of each respective one of the first plurality of conductive lines and a portion of a first one of the second plurality of conductive lines, and a second portion of each respective one of the first plurality of conductive lines and a portion of a second one of the second plurality of conductive lines.