The present disclosure generally relates to the fabrication of metal-oxide-semiconductor (MOS) select transistors in a vertical orientation such that the transistor pair fits within the footprint of a 4F.sup.2 memory cell. The present disclosure further relates to the simultaneous fabrication of a vertical stack of transistors in which each transistor is distinct, as opposed to being serially connected in a NAND-like string. An initial stack of materials is built to include silicon layers to act as source and drain regions as well as to serve as epitaxial growth seed points. As such, the transistor disclosed may be utilized in conjunction with memory elements such as Phase Change, Resistive, or Magnetic RAM memory within array designs, among others.

Building programmable resistive devices in contact holes at the crossover of a plurality of conductor lines in more than two vertical layers is disclosed. There are plurality of first conductor lines and another plurality of second conductor lines that can be substantially perpendicular to each other, though in two different vertical layers. A diode and/or a programmable resistive element can be fabricated in the contact hole between the first and second conductor lines. The programmable resistive element can be coupled to another programmable resistive device or shared between two programmable devices whose diodes conducting currents in opposite directions and/or coupled to a common conductor line. The programmable resistive memory can be configured to be programmable by applying voltages to conduct current flowing through the programmable resistive element to change its resistance for a different logic state.

In one example, a volatile selector is switched from a low conduction state to a first high conduction state with a first voltage level and then the first voltage level is removed to activate a relaxation time for the volatile selector. The relaxation time is defined as the time the first volatile selector transitions from the high conduction state back to the low conduction state. The volatile selector is switched with a second voltage level of opposite polarity to the first voltage level to significantly reduce the relaxation time of the volatile selector.

A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).

An integrated circuit is provided. In an example, the integrated circuit includes a first address line, a selector device electrically coupled to the first address lines, and a memory device electrically coupled between the selector device and a second address line. The selector device has a first I-V response in a first current direction and a second I-V response in a second current direction that is different from the first I-V response.

The present disclosure generally relates to a memory cell and methods for generating a pulse within the memory cell. As such, a geometric arrangement of transistors is disclosed that allows the transistor pulse signal generator circuit to precharge both sides of the memory cell and, subsequently, bring opposite sides of the memory cell quickly to different voltages. The circuit and wiring fabrication provided, when combined with a related transistor manufacturing process, yields pulse generating logic at the memory cell to enable the formation of a well-defined pulse while fitting within the 4F.sup.2 footprint of the memory cell. As such, the speed and pulse shape requirements of PCM, MRAM, other such cross-point memory technologies, sensor arrays, and/or pixel displays may take advantage of the reduced RC circuitry delays.

A memory device comprises a first selector and a storage capacitor in series with the first selector. A second selector is in parallel with the storage capacitor coupled between the first selector and zero volts. A plurality of memory devices form a 2S-1C cross-point DRAM array with 4F2 or less density.

In some embodiments, a semiconductor device is provided. The semiconductor device includes a semiconductor substrate having a first semiconductor material layer separated from a second semiconductor material layer by an insulating layer. A first access transistor is arranged on the first semiconductor material layer, where the first access transistor has a pair of first source/drain regions having a first doping type. A second access transistor is arranged on the first semiconductor material layer, where the second access transistor has a pair of second source/drain regions having a second doping type opposite the first doping type. A resistive memory cell having a bottom electrode and an upper electrode is disposed over the semiconductor substrate, where one of the first source/drain regions and one of the second source/drain regions are electrically coupled to the bottom electrode.

A cell array structure includes a first resistive memory cell. The first resistive memory cell includes a well region, a first doped region, a merged region, a first gate structure, a second gate structure and a first metal layer. The first doped region is formed under a surface of the well region. The merged region is formed under the surface of the well region. The first gate structure is formed over the surface of the well region between the first doped region and the merged region. The first gate structure includes a first insulation layer and a first conductive layer. The second gate structure is formed over the merged region. The second gate structure includes a second insulation layer and a second conductive layer. The first metal layer is connected with the first doped region.

A device includes a non-volatile analog resistive memory cell. The non-volatile analog resistive memory device includes a resistive memory device and a select transistor. The resistive memory device includes a first terminal and a second terminal. The resistive memory device has a tunable conductance. The select transistor is a ferroelectric field-effect transistor (FeFET) device which includes a gate terminal, a source terminal, and a drain terminal. The gate terminal of the FeFET device is connected to a word line. The source terminal of the FeFET device is connected to a source line. The drain terminal of the FeFET device is connected to the first terminal of the resistive memory device. The second terminal of the resistive memory device is connected to a bit line.