A resistive processing unit (RPU) includes a circuit including at least two current mirrors connected in series, and a capacitor connected with the at least two current mirrors, the capacitor providing a weight based on a charge level of the capacitor. The capacitor is charged or discharged by one of the at least two current mirrors.

A method for implementing nonvolatile memory array logic includes configuring a crosspoint memory array in a first configuration and applying an input voltage to the crosspoint array in the first configuration to produce a setup voltage. The crosspoint array is configured in a second configuration and an input voltage is applied to the crosspoint array in the second configuration to produce a sense voltage. The setup voltage and the sense voltage compared to perform a logical operation on data stored in the crosspoint array. A system for performing nonvolatile memory array logic is also provided.

The disclosed technology generally relates to semiconductor devices and more particularly to memory or storage devices based on resistive switching, and to methods of making and using such devices. In one aspect, a resistive switching memory device includes a first electrode and a second electrode having interposed therebetween a first inner region and a second inner region, where the first and second inner regions contacting each other. The first inner region includes one or more metal oxide layers and the second inner region consists of a plurality of layers, where each of the layers of the second inner region is an insulating, a semi-insulating or a semiconducting layer. The second inner region comprises one or more layers having a stoichiometric or off-stoichiometric composition of a material selected from the group consisting of SiGe.sub.x, SiN.sub.x, AlO.sub.x, MgO.sub.x, AlN.sub.x, SiN.sub.x, HfO.sub.x, HfSiO.sub.x, ZrO.sub.x, ZrSiO.sub.x, GdAlO.sub.x, DyScO.sub.x, TaO.sub.x and combinations thereof. The second inner region comprises one or more silicon-containing layers, such that one of the one or more silicon-containing layers contacts the first inner region.

A memory includes first lines arrayed along a surface of a substrate. Second lines are arrayed along the surface of the substrate either above or below the first lines and intersecting with the first lines. Resistance change memory cells are provided to correspond to intersection regions between the first lines and the second lines, respectively. First switching elements are arranged on a side of first ends of the first lines and transmitting a first voltage for writing or reading data to at least one memory cell among the memory cells. Second switching elements are arranged on a side of second ends of the first lines on an opposite side to the first ends and transmitting the first voltage to at least another one memory cell among the memory cells. The first switching elements and the second switching elements are connected to different ones of the first lines, respectively.

A neuromorphic apparatus includes a three-dimensionally-stacked synaptic structure, and includes a plurality of unit synaptic modules, each of the plurality of unit synaptic modules including a plurality of synaptic layers, each of the plurality of synaptic layers including a plurality of stacked layers, and each of the plurality of unit synaptic modules further including a first decoder interposed between two among the plurality of synaptic layers. The neuromorphic apparatus further includes a second decoder that provides a level selection signal to the first decoder included in one among the plurality of unit synaptic modules to be accessed, and a third decoder that generates an address of one among a plurality of memristers to be accessed in a memrister array of one among the plurality of synaptic layers included in the one among the plurality of unit synaptic modules to be accessed.

Devices and methods for determining resistive states of resistive change elements in resistive change element arrays are disclosed. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements by sensing current flow. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements without the need for in situ selection devices or other current controlling devices. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can reduce the impact of sneak current when determining resistive states of resistive change elements.

A nonvolatile memory device includes a resistance switching layer, a gate on the resistance switching layer, a gate oxide layer between the resistance switching layer and the gate, and a source and a drain, spaced apart from each other, on the resistance switching layer. A resistance value of the resistance switching layer is changed based on an illumination of light irradiated onto the resistance switching layer and is maintained as a changed resistance value.

Devices and methods for determining resistive states of resistive change elements in resistive change element arrays are disclosed. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements by sensing current flow. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements without the need for in situ selection devices or other current controlling devices. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can reduce the impact of sneak current when determining resistive states of resistive change elements.

A memory device according to an embodiment includes first and second interconnects, memory cells, and a control circuit. In a first process, the control circuit applies a write voltage of a first direction to a memory cell coupled to selected first and second interconnects, and applies a write voltage of a second direction to a memory cell coupled to the selected first interconnect and a non-selected second interconnect. In second processes of first to m-th trial processes, the control circuit applies the write voltage of the second direction to the memory cell coupled to the selected first and second interconnects, and omits a write operation in which the memory cell coupled to the selected first interconnect and the non-selected second interconnect is targeted.

A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured.