G11C2213/81

SEMICONDUCTOR DEVICE

According to one embodiment, the first lines extend in a first direction. The first gate electrodes extend in a second direction intersecting with the first direction. The second lines extend in a third direction orthogonal to the first direction and the second direction. The semiconductor portion is disposed between the first gate electrodes, and between one of the first lines and one of the second lines, and connected to the first line and the second line. The semiconductor portion has a column shape. The semiconductor portion includes a plurality of channels isolated in a direction orthogonal to the third direction. The second gate electrode is provided between the channels. The insulating film is provided between the semiconductor portion and the first gate electrode, and between the semiconductor portion and the second gate electrode.

Methods of forming nanotube films and articles
10096363 · 2018-10-09 · ·

Nanotube films and articles and methods of making the same are disclosed. A conductive article or a substrate comprises at least two unaligned nanotubes extending substantially parallel to the substrate and each contacting end points of the article but each unaligned relative to the other, the nanotubes providing a conductive pathway within a predefined space.

Nanoshell, method of fabricating same and uses thereof

A method of fabricating a nanoshell is disclosed. The method comprises coating a nanometric core made of a first material by a second material, to form a core-shell nanostructure and applying non-chemical treatment to the core-shell nanostructure so as to at least partially remove the nanometric core, thereby fabricating a nanoshell. The disclosed nanoshell can be used in the fabrication of transistors, optical devices (such as CCD and CMOS sensors), memory devices and energy storage devices.

Provision of structural integrity in memory device
09608202 · 2017-03-28 · ·

Embodiments of the present disclosure are directed towards techniques to provide structural integrity for a memory device comprising a memory array. In one embodiment, the device may comprise a memory array having at least a plurality of wordlines disposed in a memory region of a die, and a first fill layer deposited between adjacent wordlines of the plurality of wordlines in the memory region, to provide structural integrity for the memory array. At least a portion of a periphery region of the die adjacent to the memory region may be substantially filled with a second fill layer that is different than the first fill layer. Other embodiments may be described and/or claimed.

CONNECTIBLE NANOTUBE CIRCUIT

Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.