A memory circuit configured to perform multiply-accumulate (MAC) operations for performance of an artificial neural network includes a series of synapse cells arranged in a cross-bar array. Each cell includes a memory transistor connected in series with a memristor. The memory circuit also includes input lines connected to the source terminal of the memory transistor in each cell, output lines connected to an output terminal of the memristor in each cell, and programming lines coupled to a gate terminal of the memory transistor in each cell. The memristor of each cell is configured to store a conductance value representative of a synaptic weight of a synapse connected to a neuron in the artificial neural network, and the memory transistor of each cell is configured to store a threshold voltage representative of a synaptic importance value of the synapse connected to the neuron in the artificial neural network.

A memory device includes a bit line (BL); a source line (SL); and a plurality of non-volatile memory cells operatively coupled between the BL and SL, respectively. Each of the plurality of non-volatile memory cells includes a resistor with a variable resistance, a first transistor, and a second transistor that are coupled to each other in series. In response to a first one of the non-volatile memory cell not being read and a second one of the non-volatile memory cell being read, a voltage level at a first node connected between the first and second transistors of the first non-volatile memory cell is greater than zero.

A circuit system for weight modulation and image recognition of a memristor array includes a personal computer (PC), a field-programmable gate array (FPGA) chip, a digital-to-analog conversion unit, a switch unit, a memristor array unit, an integration and signal amplification circuit, and an analog-to-digital converter. The circuit system selects a to-be-realized function such as array reading and writing, weight modulation or image recognition, converts a command or an RGB value of an image collected by the PC into a corresponding grayscale value, and sends the grayscale value to the FPGA chip. The FPGA chip controls and selects a to-be-modulated memristor array unit through the digital-to-analog conversion unit and the switch unit. An application program of the PC controls the FPGA chip in real time to realize array reading and writing, weight modulation, and image recognition, and then the FPGA chip displays a result on the PC in real time.

Technologies relating to crossbar array circuits with parallel grounding lines are disclosed. An example crossbar array circuit includes: a word line; a bit line; a first selector line, a grounding line; a first transistor including a first source terminal, a first drain terminal, a first gate terminal, and a first body terminal; and an RRAM device connected in series with the first transistor. The grounding line is connected to the first body terminal and is grounded and the grounding line parallel to the bit line. The first selector line is connected to the first gate terminal. In some implementations, the RRAM device is connected between the first transistor via the first drain terminal and the word line, and the first source terminal is connected to the bit line.

The present invention discloses a computing array based on 1T1R device, operation circuits and operating methods thereof. The computing array has 1T1R arrays and a peripheral circuit; the 1T1R array is configured to achieve operation and storage of an operation result, and the peripheral circuit is configured to transmit data and control signals to control operation and storage processes of the 1T1R arrays; the operation circuits are respectively configured to implement a 1-bit full adder, a multi-bit step-by-step carry adder and optimization design thereof, a 2-bit data selector, a multi-bit carry select adder and a multi-bit pre-calculation adder; and in the operating method corresponding to the operation circuit, initialized resistance states of the 1T1R devices, word line input signals, bit line input signals and source line input signals are controlled to complete corresponding operation and storage processes.

A vertical nonvolatile memory device including memory cell strings using a resistance change material is provided. Each of the memory cell strings of the nonvolatile memory device includes a semiconductor layer extending in a first direction; a plurality of gates and a plurality of insulators alternately arranged in the first direction; a gate insulating layer extending in the first direction between the plurality of gates and the semiconductor layer and between the plurality of insulators and the semiconductor layer; and a resistance change layer extending in the first direction on a surface of the semiconductor layer. The resistance change layer includes a metal-semiconductor oxide including a mixture of a semiconductor material of the semiconductor layer and a transition metal oxide.

Disclosed is a memory device including a magnetic storage element. The memory device includes a memory cell array, a voltage generator, and a write driver. The memory cell array includes a first region and a second region. The memory device is configured to store a value of a first read current determined based on a value of a reference resistance for distinguishing a parallel state and an anti-parallel state of a programmed memory cell. The sensing circuit is configured to generate the first read current based on the value of the first read current and to perform a read operation on the first region based on the first read current.

Disclosed herein are related to a memory array. In one aspect, the memory array includes a set of resistive storage circuits including a first subset of resistive storage circuits connected between a first local line and a second local line in parallel. The first local line and the second local line may extend along a first direction. In one aspect, for each resistive storage circuit of the first subset of resistive storage circuits, current injected at a first common entry point of the first local line exits through a first common exit point of the second local line, such that each resistive storage circuit of the first subset of resistive storage circuits may have same or substantial equal resistive loading.

A resistive random-access memory (RRAM) circuit includes an RRAM device configured to output a cell current responsive to a bit line voltage, and a current limiter including an input terminal coupled to the RRAM device, first and second parallel current paths configured to conduct the cell current between the input terminal and a reference voltage node, and an amplifier configured to generate a first signal responsive to a voltage level at the input terminal and a reference voltage level. Each of the first and second current paths includes a switching device configured to selectively conduct a portion of the cell current responsive to the first signal.

A memory device includes a plurality of resistive random access memory (RRAM) cells commonly connected between a bit line (BL) and a source line (SL). Each of the RRAM cells includes a resistor, a first transistor, and a second transistor coupled to each other in series, with the resistor connected to the BL and the second transistor connected to the SL. The first transistor has a first threshold voltage, and the second transistor has a second threshold voltage, the first threshold voltage being less than the second threshold voltage.