A write voltage generator is connected with a magnetoresistive random access memory. The write voltage generator provides a write voltage during a write operation. A storage state of a selected memory cell in a write path of the magnetoresistive random access memory is changed in response to the write voltage. The write voltage generator includes a temperature compensation circuit and a process corner compensation circuit. The temperature compensation circuit generates a transition voltage according to an ambient temperature. The transition voltage decreases with the increasing ambient temperature. The process corner compensation circuit receives the transition voltage and generates the write voltage.

A memory device includes a well, a poly layer, a dielectric layer, an alignment layer and an active area. The poly layer is formed above the well. The dielectric layer is formed above the poly layer. The alignment layer is formed on the dielectric layer, used to receive an alignment layer voltage and substantially aligned with the dielectric layer in a projection direction. The active area is formed on the well. The dielectric layer is thicker than the alignment layer. A first overlap area of the poly layer and the active area is smaller than a second overlap area of the poly layer and the dielectric layer excluding the first overlap area.

A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.

Techniques described herein generally relate to the fabrication of a P-type metal-oxide-semiconductor (PMOS) flash memory cell in a semiconductor substrate. The PMOS flash memory cell may include a P-substrate layer formed above the semiconductor substrate, a N-well formed in the P-substrate layer, a floating-gate formed above the N-well. Further, the PMOS memory cell may include a control-gate formed above the floating-gate, a select-gate formed above the N-well and extending over at least a portion over the floating-gate, a P-source formed in the N-well, and a P-Drain. The P-source is formed adjacent to the floating-gate, and the P-drain is formed adjacent to the select-gate.

A self-biased sense amplification circuit includes a local bit line, a reset unit, a main bit lie, a pre-amplifier, a data line, a sample reference unit, and a sense amplifier. The local bit line receives a cell current generated by a memory cell during a sense operation. The reset unit resets the local bit line to a first system voltage during a sample operation. The pre-amplifier generates a read current on the main bit line according to a voltage of the local bit line during the sample operation and the sense operation. The data line is coupled to the main bit line. The sample reference unit generates a first reference current and a second reference current during the sample operation, and generates the first reference current during the sense operation. The sense amplifier senses a voltage of the data line.

A memory cell array of a multi-time programmable non-volatile memory includes plural memory cells. The memory cell has the structure of 1T1C cell, 2T1C cell or 3T1C cell. Moreover, the floating gate transistors of the memory cells in different rows of the memory cell array are constructed in the same well region. Consequently, the chip size is reduced. Moreover, by providing proper bias voltages to the memory cell array, the program action, the erase action or the read action can be performed normally.

A differential sensing device includes two reference cells, four path selectors, and four sample circuits. The first path selector is coupled to a first sensing node, the second reference cell, and a first memory cell. The second path selector is coupled to a second sensing node, the first reference cell, and the first memory cell. The third path selector is coupled to a third sensing node, the first reference cell, and a second memory cell. The fourth path selector is coupled to a fourth sensing node, the second reference cell, and the second memory cell. During a sample operation, the first sample circuit samples a first cell current, the second sample circuit samples the first reference current, the third sample circuit samples a second cell current, and the fourth sample circuit samples the second reference current.

A selective non-volatile memory programming method for a selected memory cell in a memory array is described so as to reduce or avoid program disturbance on an unselected memory cell. This selective programming method comprises: applying a programming pulse to a selected memory cell to be programmed and an unselected memory cell, wherein the programming pulse allows a change of the unselected memory cell within a range specified; boosting a region of the unselected memory cell; and setting a threshold time of the programming pulse, wherein the threshold time is defined when an absolute magnitude of a voltage difference between a floating gate of the unselected memory cell and the boosted region of the unselected memory cell reaches a threshold value defined.

A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.

A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.