Patent classifications
G01B7/20
STRAIN SENSOR FIXING DEVICE AND TORQUE SENSOR USING SAME
A strain sensor fixing device includes a fixing member including a first side, a second side parallel to the first side, and a surface provided between the first side and the second side and including an opening part, the first side being brought into contact with the first structure, the second side being brought into contact with an end part of the flexure body constituting the strain sensor provided on the first structure, a screw inserted into the opening part and screwed into the first structure, and a rotation stopping part bringing the fixing member into line contact or point contact with the other part to prevent rotation of the fixing member.
Distributed Sensor Networks Deployed Using Soft Growing Robots
A distributed sensor network for soft growing robots is provided. Sensor bands are distributed at discrete intervals along the length of the flexible tube, and the sensor bands each are wrapped circumferentially around the diameter of the flexible tube. Each sensor band has one or more sensors and one or more semi-rigid islands containing a self-contained microcontroller, and one or more communication lines to an aggregator microcontroller located at the base of the soft growing robot communicatively connecting signals from the sensor bands. A casing laminates the distributed sensor network. In one example the encasing has cavities or a tooth geometry to allow bending. The casing is flexible to not hinder the growth of the soft growing robot, yet protecting the distributed sensor network.
STRAIN GAUGE AND METHOD FOR MANUFACTURING STRAIN GAUGE
Provided is a strain gauge including a substrate, a resistive body, and a metal sheet. The resistive body includes a sensing portion, a first connection portion, and a second connection portion. The metal sheet covers at least the substrate that is exposed between two connection sites to which wirings to an external circuit are respectively connected and provided respectively in the first connection portion and the second connection portion and the sensing portion.
Piezoresistive ink, methods and uses thereof
The present disclosure relates to a piezoresistive ink composition for sensors production. This ink, change linearly their electrical resistivity with an applied deformation and can easily recover when the external applied stress is released. The composition comprises flexible polymers as thermoplastic elastomers from the styrene-butadiene-styrene family (SBS, SEBS or others), nanostructures of carbon or metal, polar solvents and dispersive agents. With this ink, the user can print the sensor with any desired geometry and use different printing techniques, including drop casting, spray, screen and inkjet printing.
Sensor system, method of production, and sensor deployment system
A sensor system includes a plant growth sensor, an environmental sensor device, and processing electronics. The plant growth sensor includes a strain sensor arranged on a first stretchable and flexible substrate. The environmental sensor device includes first and second environmental sensors arranged on a second stretchable and flexible substrate. The processing electronics are electrically coupled to the plant growth sensor and the environmental sensor device. The processing electronics include a wireless communication transceiver.
Strain gauge with improved temperature effect detection
A strain gauge includes a strain detecting unit and a temperature detecting unit that are formed on or above a flexible substrate. The strain detecting unit includes a resistor formed as a film containing Cr, CrN, and Cr.sub.2N, on one surface of a functional layer. A first metallic layer formed of a material of which a gauge factor is less than that of the resistor is laminated on a folded portion, and a resistance value of the first metallic layer on the folded portion is less than a resistance value of the folded portion. The temperature detecting unit is a thermocouple including a second metallic layer formed of a same material as the resistor, on or above the substrate; and a third metallic layer formed of a same material as the first metallic layer, on the second metallic layer.
Strain measurement device and overall device with such a strain measurement device
A strain measurement device (10) for electrically determining a strain of a basic body, having a carrier film (12) which can be applied to the basic body (40), an electric measuring loop (14) printed onto the carrier film (12) of conductive printing paste/printing ink, which has a measuring element (16) for generating an electrical signal based on the strain and which has four conducting tracks (18) connected to the measuring element (16) for four-wire sensing, the four conducting tracks (18) each having an electrical conductor connection (22), the conducting tracks (18), the conductor connections (22) and the measuring element (16) being printed with the same printing paste. Furthermore, an overall device (38) with such a strain measurement device (10), the strain measurement device (10) being connected to a base unit (44) which has an evaluation unit (46) and an energy supply unit (48).
MEASURING DEVICE AND MEASURING SYSTEM
Provided is a measuring device capable of enhancing convenience. The measuring device 1 comprises a first sensor 2 provided on a surface of an object 11 to be measured, an elastic body 3 that clamps the first sensor 2 between the elastic body 3 and the object 11 to be measured, a protective sheet 4 provided on the surface of the elastic body 3 on the side of the object 11 to be measured, a case 5 provided on the surface of the elastic body 3 on a side opposite from the object 11 to be measured, and a processing circuit 8 which is provided inside the case 5 and processes an output signal from the first sensor 2. The first sensor 2 is provided between the elastic body 3 and the protective sheet 4. The first sensor 2 is a strain sensor and includes a thin film piezoelectric element. The elastic body 3 is made of foamed rubber.
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.
FOLDABLE DISPLAY
A foldable display including a bendable region, the bendable region comprising a first surface functioning as a display surface of the display and a second surface disposed opposite to the first surface. The foldable display has an unfolded state and a folded state. The foldable display includes a state detecting unit disposed in the bendable region for detecting a deformation state of a surface of the bendable region and generating an electrical signal indicating a corresponding deformed state.