A method for measuring the diameter of filament diffraction fringes by frequency domain calculation comprising: building a set of diffraction optical path measurement system and capturing diffraction fringe images; determining the starting point of the imaging range; Simulating the electromagnetic field propagation process in Fraunhofer diffraction, and determining the optimal fringe range considering the noise caused by the difference in CCD sensitivity; Finally calculating the filament diameter by Fourier transform for different lengths of fringe. The final value of the calculated filament diameter is obtained by fitting an envelope to the variation of the diameter. The invention is simple in calculation and has little dependence on the experimental device, which means the superiority of using the frequency domain for parameter measurement, and the measurement accuracy is in the sub-nanometer level. In addition, the invention proves the feasibility of extracting the fringe period information in the frequency domain.

A system (1) for generating a signal from a surface (22) having a speed V in a direction U, comprising: a light source (2) emitting a Gaussian beam of light along a first optical path (11); a sensor (3) able to evaluate the effects of the electromagnetic interference of the first beam; an optical splitter (4) located upstream of the sensor (3), generating, from the first beam of light, a second beam of light along a second optical path (12); a focusing lens (5, 6) located on the first and/or the second optical path (11, 12), focusing the beam of light at a distance f and defining an upstream optical path (11′, 12′), and a means (7) for routing the second beam, comprising a mirror redirecting the second path such that the lengths of the first (11′) and second (12′) paths are different.

A method of improving axial resolution of interferometric measurements of a 3D feature of a sample may comprise illuminating the feature using a first limited number of successively different wavelengths of light at a time; generating an image of at least the 3D feature based on intensities of light reflected from the feature at each of the successively different wavelengths of light; measuring a fringe pattern of intensity values for each corresponding pixel of the generated images; resampling the measured fringe patterns as k-space interferograms; estimating interference fringe patterns for a spectral range that is longer than available from the generated images using the k-space interferograms; appending the estimated interference fringe patterns to the respective measured fringe patterns; and measuring the height or depth of the 3D feature using the measured interference fringe patterns and appended estimated fringe patterns.

The present invention relates to an apparatus and a method for measuring a thickness and a refractive index of a multilayer thin film using an angle-resolved spectral interference image according to polarization. More specifically, the present invention relates to an apparatus for measuring a thickness and a refractive index of a multilayer thin film using an angle-resolved spectral interference image according to polarization in an apparatus for measuring a thickness and a refractive index of a measurement object coated with the multilayer thin film, the apparatus including: an illumination optical module having a light source emitting light; a first beam splitter configured to reflect some of the light emitted from the illumination optical module; an objective lens configured to input some of the light reflected from the first beam splitter to the measurement object constituted by the multilayer thin film and reflect the remaining light to a reference plane to form interference light on a back focal plane; a second beam splitter in which interference light where the reflected light incident and reflected to the measurement object interferes with the reflected light reflected from the reference plane is incident, wherein some of the interference light is reflected and the remaining interference light is transmitted; a first angle-resolved spectral image acquiring unit configured to receive interference light reflected from the second beam splitter and first-polarize the interference light located in the back focal plane of the objective lens to acquire a first polarized interference image; and a second angle-resolved spectral image acquiring unit configured to receive interference light transmitted from the second beam splitter and second-polarize the interference light located in the back focal plane of the objective lens to acquire a second polarized interference image.

Disclosed is a method of determining a complex-valued field relating to a sample measured using an imaging system. The method comprises obtaining image data relating to a series of images of the sample, imaged at an image plane of the imaging system, and for which at least two different modulation functions are imposed in a Fourier plane of the imaging system; and determining the complex-valued field from the imaging data based on the imposed modulation functions.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The interference signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

Provided is an optical interference measuring apparatus including a measuring unit configured to acquire an interferogram of an interference wave by irradiating a measurement target and a reference surface with electromagnetic waves and causing a reflected wave from a reflecting surface of the measurement target to interfere with a reflected wave from the reference surface and a signal processing unit configured to configure an intensity profile in a depth direction by performing Fourier transform of the interferogram. The signal processing unit includes at least one of a first noise removal unit to remove noise with filtering by deleting data in regions other than a pass region which is a region set with reference to a measurement target installation position from the intensity profile and a second noise removal unit to remove noise by performing singular value decomposition of the interferogram to delete noise component.

Multi-spectral feature sensing techniques and sensor and related digital signal processing circuitry and methods. A method of operating a digital signal processing circuitry includes acquiring optical frequency domain reflectometry (OFDR) data from an interferometer operably coupled to a tunable laser and a sensing fiber, separating sensor signals corresponding to sensors of the sensing fiber from the OFDR data, and inferring a relative shift of a separated sensor signal. A digital signal processing circuitry includes a front end circuitry and a back end circuitry. The front end circuitry is configured to isolate sensor responses from an input signal including OFDR data. The back end circuitry is configured to determine a phase shift corresponding to each isolated sensor response.

Aspects of the disclosure relate to systems, methods, and algorithms to perform wavenumber linearization and dispersion correction in optical systems without the need for hardware modifications, empirical adjustments, precise mirror alignment, and which can be conducted at low computational costs and in real-time. A one-time calibration process can generate spectra or calibration criteria, including wavenumber-linearization criteria, dispersion correction, and spectral flattening spectra, which can be used to correct an optical coherence tomogram in real time.

Apparatus and methods are presented for enhancing the acquisition speed or performance of Fourier domain optical coherence tomography. In preferred embodiments a plurality of wavelength combs containing interleaved selections of wavelengths from a multi-wavelength optical source are generated and projected onto a sample. In certain embodiments the wavelength combs are projected simultaneously onto a plurality of regions of the sample, while in other embodiments the wavelength combs are projected sequentially onto the sample. Light in the wavelength combs reflected or scattered from the sample is detected in a single frame of a sensor array, and the detected light processed to obtain a tomographic profile of the sample. In preferred embodiments the wavelength comb generator comprises a wavelength interleaver in the form of a retro-reflective prism array for imparting different displacements to different selections of wavelengths from the optical source.