A measurement, calibration and compensation system for machine tool includes a first positioning base; two first speckle image sensors for sensing speckle positions of an object holding unit at a first XY plane and a first XZ plane of the first positioning base before and after the machine tool is started for machining; a second positioning base; two second speckle image sensors for sensing speckle positions of a cutter holding unit at a second XY plane and a second YZ plane of the second positioning base before and after the machine tool is started for machining. Thus, the thermal expansion at all axes of the machine tool can be measured in a simplified and low-cost way, and the absolute positioning coordinates of all axes of the machine tool can be calibrated in real time to avoid reduced positioning accuracy due to the thermal expansion of the multi-axis machine tool.

Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate. The techniques include obtaining, using optical inspection data, a profile of the out-of-plane deformation of the substrate and identifying, using the obtained profile, one or more parameters characterizing a saddle-shaped stress of the substrate. The techniques further include computing, using the one or more identified parameters, one or more characteristics of a stress-compensation layer (SCL) for the substrate and causing the SCL to be deposited on the substrate. The techniques further include causing a stress-mitigation beam to be applied to a plurality of edge regions of the SCL, wherein settings of the stress-mitigation beam are determined using the one or more identified parameters.

Disclosed systems and techniques are directed to mitigating stresses in substrate-to-substrate bonding processes. Disclosed techniques include obtaining a first substrate supporting transferred feature(s) (TFs) and transferring TFs from the first substrate to a second substrate, transferring TFs from the first substrate to the second substrate, and applying stress mitigation to a target substrate. The target substrate can be the first substrate, an auxiliary substrate supporting TFs prior to transferring TFs from the auxiliary substrate to the first substrate, or the second substrate. Applying stress mitigation to the target substrate includes obtaining an out-of-plane deformation (OPD) profile of the target substrate, causing a stress compensation layer (SCL) to be deposited on the target substrate, and exposing the SCL to a stress-mitigation beam. Settings of the SCL and/or the stress-mitigation beam are determined using the OPD profile of the target substrate.

Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate (e.g., wafer) by identifying, using optical inspection data, a profile of the OPD of the substrate and performing a polynomial decomposition of the profile to determine polynomial coefficients characterizing elemental deformation shapes of the substrate. The techniques further include identifying, based on the polynomial coefficients, characteristics of a stress-compensation layer (SCL) for the substrate and causing the SCL to be deposited on the substrate. The techniques further include performing statistical simulations to identify settings for a non-uniform stress-mitigation irradiation of the SCL, by sampling from one or more statistical distributions associated with previously performed stress-mitigation irradiations, and performing the non-uniform stress-mitigation irradiation of the SCL using the identified settings.

Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate. The techniques include obtaining, using optical inspection data, an OPD profile of the substrate and obtaining a polynomial representation of the OPD profile to determine a plurality of polynomial coefficients characterizing respective elemental deformation shapes of the substrate. The techniques further include identifying one or more cylindric decompositions of a quadratic part of the OPD profile and computing, using a selected cylindric decomposition of the one or more cylindric decompositions, one or more characteristics of a stress-compensation layer (SCL) for the substrate. The techniques further include causing the SCL to be deposited on the substrate and the SCL to be exposed to a stress-mitigation beam.

Disclosed systems and techniques are directed to correcting an out-of-plane (OPD) deformation of a substrate by causing a stress-compensation layer (SCL) to be deposited on the substrate, obtaining, using optical inspection data, a profile of the OPD of the substrate. The techniques further include obtaining a dataset with a representation of an influence function for the substrate, the influence function characterizing a deformation response of the substrate caused by a point-like mechanical influence. The techniques further include performing a regression computation to determine, based at least on the profile of the OPD of the substrate and the influence function, a distribution of a stress-mitigation irradiation of the SCL that mitigate the OPD of the substrate. The techniques further include performing, using the determined distribution of the stress-mitigation irradiation, a stress-mitigation irradiation of the SCL.

A method and a system for determining a displacement of an object are provided. The method includes: providing a predetermined modal power distribution characteristic; directing a light onto the object resulting in a reflected light; propagating the reflected light through different propagation modes, receiving a resulting modal power distribution characteristic; and comparing the resulting modal power distribution characteristic with the predetermined modal power distribution characteristic to determine the displacement of the object.

A defect detection method includes the following processes: a) stroboscopically illuminating the entire surface of an object within an examination area of the object while inducing a first elastic wave across the examination area on the object, and controlling the phase of the elastic wave and the timing of the stroboscopic illumination to collectively measure a back-and-forth displacement of each point within the examination area in at least three phases of the elastic wave; b) identifying a surface location which is the location of a defect on the examination area, based on the back-and-forth displacement of each point within the examination area in the at least three different phases; and c) injecting a second elastic wave into a region inside the surface location from a limited area including the surface location, and determining the location and/or size in the depth direction of the defect, based on a response wave.

An optical interferometer (1) is used to determine information about the position, gradient or motion of a surface of an object (2) at each of a plurality of points on the surface. An image is projected onto the surface of the object (2), such that, for each of the plurality of points, the intensity or spectrum of the projected image at that point depends on the determined information about the position, gradient or motion of the surface at that point.

A measurement, calibration and compensation system for machine tool includes a first positioning base; two first speckle image sensors for sensing speckle positions of an object holding unit at a first XY plane and a first XZ plane of the first positioning base before and after the machine tool is started for machining; a second positioning base; two second speckle image sensors for sensing speckle positions of a cutter holding unit at a second XY plane and a second YZ plane of the second positioning base before and after the machine tool is started for machining. Thus, the thermal expansion at all axes of the machine tool can be measured in a simplified and low-cost way, and the absolute positioning coordinates of all axes of the machine tool can be calibrated in real time to avoid reduced positioning accuracy due to the thermal expansion of the multi-axis machine tool.