Various surface and structural defects are currently inspected visually. This method is labor intensive, requiring large maintenance man hours, and is prone to errors. To streamline this process, herein is described an automated inspection system and apparatus based on several optical technologies that drastically reduces inspection time, provides accurate detection of defects, and provides a digital map of the location of defects. The technology uses a sensor that includes a pattern projection generator for generating a pattern image on the structural surface and a camera for detecting the pattern image generated by the pattern projection generator on the structural surface. Furthermore, the technology utilizes an image processing and correction apparatus for performing a pattern image and structural surface defect map correction and generate a distortion corrected defect map for a surface scan area on the structure that is incident on the sensor.

A projector projects a first image onto a projection surface to thereby display a first projected image on the projection surface, acquires first imaging data obtained by capturing the first projected image, determines, based on the first imaging data, a type of a three-dimensional shape on the projection surface, projects a second image including a plurality of points onto the projection surface to thereby display a second projected image on the projection surface, acquires second imaging data obtained by capturing the second projected image, specifies, based on the second imaging data and the type of the three-dimensional shape on the projection surface, positions of the respective plurality of points on the projection surface, generates, based on the positions of the respective plurality of points, and correction data for correcting distortion of an image projected onto the projection surface, corrects, based on the correction data, image data input to the projector.

The disclosure provides an improvement to digital fringe projection techniques in which the optimal focal length settings are automatically determined for reconstructing a 3D profile. In a pre-calibration phase, geometric parameters of the system are calibrated using a few discrete focal length settings. These discretely calibrated geometric parameters are fitted onto a continuous function model. In a 3D autofocusing phase, a set of optimal focal length settings for a scene are determined using a 2D autofocusing technique. Calibrated geometric parameters for each optimal focal length setting are automatically calculated using the continuous geometric parameter model. Finally, a 3D profile of objects in the scene is reconstructed using the calibrated geometric parameters for each optimal focal length setting.

Apparatuses and methods for scanning a flow of parts or products of many various types and formats. The apparatus comprises a plurality of light sources and a plurality of detectors located around a scanning volume to observe build parts or products in the scanning volume from different observation angles, the light sources each to direct light of separate wavelengths over a respective field of view. Each detector has at least one filter to isolate at the detector light from one of the light sources from light from the other of the light sources. The apparatus also includes a controller to operate a plurality of the light sources, detectors and filters to form measurement groups to scan the observable surface of objects in the scanning volume simultaneously from different observation angles, to obtain scanning data for generating a 3D model. Once a given part or product is in position in the field of scan the apparatus may perform its scanning without any kinematic movement involved neither for the part nor from any of the system components thus avoiding the movement of functional part sub-components that may occur in between various scans.

An example apparatus includes: a controller configured to: generate a symbol pattern as a result of placing symbols based on epipolar lines; instruct an SLM to project the symbol pattern; obtain an image of a reflection of the symbol pattern; determine a first location of a symbol in the image; determine a second location of the symbol in the image; and determine a depth of the symbol as based on the first location, the second location, and an essential matrix.

The present disclosure proposes an apparatus for determining a first three-dimensional shape of an object. The apparatus includes a first light source configured to irradiate first pattern lights to the object, first image sensors configured to capture first reflected lights generated by reflecting the first pattern lights from the object, a second light source configured to sequentially irradiate second pattern lights having one phase range, a beam splitter and lenses configured to change optical paths of the second pattern lights, a second image sensor configured to capture second reflected lights generated by reflecting the second pattern lights from the partial region, and a processor configured to determine the first three-dimensional shape of the object based on the first reflected lights and the second reflected lights.

A three-dimensional (3D) sensing system for determining a 3D profile of an object and a method are provided. The 3D sensing system includes a liquid crystal lens, a structure light source and a control circuit. The structure light source is configured to emit a structure light pattern with a plurality of dots on the object through the liquid crystal lens. The control circuit is configured to control the liquid crystal lens to separate the plurality of dots under a separating mode, and the control circuit is configured to control the liquid crystal lens to overlap the plurality of dots under an overlapping mode.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

In alternative embodiments, provided are moiré profilometry methods for analyzing a topography of an object comprising use of dual patterns that are simultaneously projected onto a surface of the object from two symmetric directions. In alternative embodiments, the projected dual patterns superimpose and generate a fringe pattern that contains a moiré pattern, the moiré pattern having a phase that is modulated according to the topography of the object. In alternative embodiments, the moiré pattern is extracted from the fringe pattern using a spatial or temporal method, and the phase is demodulated from the extracted moiré pattern using a spatial or temporal method.

A three-dimensional shape measuring method includes: projecting a first grid pattern based on a first light and a second grid pattern based on a second light onto a target object in such a way that the first grid pattern and the second grid pattern intersect each other, the first light and the second light being lights of two colors included in three primary colors of light; picking up, by a three-color camera, an image of the first grid pattern and the second grid pattern projected on the target object, and acquiring a first picked-up image based on the first light and a second picked-up image based on the second light; and performing a phase analysis of a grid image with respect to at least one of the first picked-up image and the second picked-up image and calculating height information of the target object.