Aspects for active alignment for assembling optical imaging systems are described herein. As an example, the aspects may include aligning an optical detector with an optical component. The optical component is configured to alter a direction of one or more light beams emitted from an image displayed by an optical engine. The aspects may further include detecting, by the optical detector, a virtual image generated by the one or more light beams emitted by the optical engine; and adjusting, by a multi-axis controller, an optical path of the one or more light beams based on one or more parameters of the virtual image collected by the optical detector.

Systems and methods for alignment and testing of a photonic device include a light source, an interferometer, a detector, and a processing circuit. The processing circuit may generate control signal(s) for the light source to project a beam through the interferometer to a device under testing (DUT). The interferometer may receive an interference beam from an optical fiber of the DUT. The processing circuit may align optical fiber(s) for the DUT, determine one or more characteristics for the DUT, and so forth based on the interference beam and a reference beam generated by the interferometer.

The disclosure belongs to the technical field related to on-line measurement in manufacture of integrated circuit, which discloses a snapshot type overlay error measuring device and a measuring method thereof. The measuring method includes: the detection light is subjected to polarization and retardation in sequence to obtain measurement spectrum; Fourier analysis is performed on the measurement spectrum to obtain the frequency-domain signal of the measurement spectrum, and sub-channel frequency-domain analysis is performed on the frequency-domain signal to obtain the linear combination of the non-diagonal Mueller matrix elements of the overlay error sample to be tested; the linear combination of the non-diagonal Mueller matrix elements are processed to obtain the overlay error of the overlay sample under test. This disclosure does not need to measure all 16 Mueller matrix elements, the measurement is carried out on only a few non-diagonal Mueller matrix elements which are sensitive to overlay error.

Methods and systems for measuring a component of a drug delivery or storage device are described. The method comprises providing a light source in an opposing relationship with an optical imaging sensor; positioning a sample component on a positioning stage located between the at least one light source and at least one opposing optical imaging sensor; and illuminating, with the at least one light source, the sample component. The controller is operable to capture an image of the component, determine the location of a first outer edge point PI of the captured image; rotate the sample component relative to the optical image sensor, and collect n images separated from each other by x degrees of rotation, wherein n*x is ≥360 degrees. The controller may compare a measured position of the at least one outer edge point PI between the captured images to determine a degree or circular runout.

A sample mapping system includes a sample chuck including absolute reference marks, an imaging metrology tool to capture sets of alignment images at locations associated with sample marks on a sample on the sample chuck, and a controller. A particular set of alignment images at a particular location may include at least one alignment image associated with a particular sample mark and at least one alignment image associated with a particular portion of the absolute reference marks within a field of view of the imaging metrology tool visible through the sample. The controller may determine absolute coordinates of the sample marks based on the sets of alignment images. Determining the absolute coordinates of the particular sample mark may include determining the absolute coordinates of the particular sample mark based on a position of the particular sample mark relative to the particular portion of the absolute reference marks.

A backlight optical alignment system comprises an illumination system having an illumination pupil and an illuminator configured to generate an output, wherein the illumination system includes a rotationally symmetric illumination distribution having an illumination axis, an imaging system having an imaging sensor comprising at least one detector element, an imaging pupil, and an acceptance cone in object space of the imaging system having an optical axis, wherein at least a portion of the imaging pupil is filled by the illumination system output when a portion of the illumination distribution overlaps with the acceptance cone, and a first substrate disposed in object space between the illumination system and the imaging system, wherein the solid substrate is adjustable to generate a change in signal intensity from the imaging sensor when the illumination axis of the illumination distribution is misaligned with the optical axis of the acceptance cone.

Systems, devices, and methods to perform alignment in a projector are described. Laser light emitted is directed to at least one lens, which directs the laser light to a diffractive optical element (DOE), which produces a diffracted light. A sensor measures a property of the diffracted light, and a position of at least one lens adjusted to improve a quality of the diffracted light. The lens is fixed in position to the improvement in the quality of diffracted light achieving a defined threshold. The characteristic may include brightness.

Vehicle-based package delivery and alignment systems and methods are provided herein. An example method includes performing a first alignment of a delivery door of a vehicle with a receiving door of a package locker using location signals that are indicative of a location of the package locker, performing a second alignment of the delivery door with the receiving door based on camera images of an alignment target, and transferring a package from the vehicle to the package locker.

A coordinate measuring machine and a method for operating a coordinate measuring machine, and a rotary table module for a coordinate measuring machine with a rotary table for receiving a workpiece and a rotary table block are provided. The rotary table is supported on a rotary table side rotatably about a rotary table axis. The rotary table block has, opposite the rotary table side of the rotary table block, a bottom side with which the rotary table module can be supported on a measurement table of the coordinate measuring machine. The rotary table block has a further supporting side with which the rotary table block is supportable on the measurement table of the coordinate measuring machine and which differs from the bottom side in its alignment. The rotary table module includes a pose capturing device for the determination of whether the rotary table block is supported on the bottom side.

A lead frame includes a die pad that includes a mounting surface for a semiconductor chip, and a film-like member that is arranged on the mounting surface of the die pad. The die pad includes a through hole that is formed in an area that includes an outer periphery of the film-like member.