A device for determining an angle between two workpiece surfaces, comprising a transmitter for producing a light beam, a continuously rotating directional rotor for emitting the produced light beam in a rotating emission direction perpendicular to an axis of rotation of the directional rotor, a receiver for receiving a reflected light beam when the emitted light beam is reflected antiparallel to the emission direction by one of the two workpiece surfaces, an emission angle sensor unit for determining emission angles of the emitted light beam at which the receiver receives the reflected light beam, a calibrating unit for determining at least calibration parameters, a memory unit for storing the calibration parameters and an error model, and an evaluation unit configured to determine the angle as a function of the determined emission angles of the light beam emitted by the directional rotor, the stored calibration parameters and the stored error model.

Embodiments provide measurement systems having a coordinate measuring machine, a workpiece storage apparatus, and a robot for delivering workpieces from the workpiece storage apparatus to the coordinate measuring machine, and methods for orienting and operating such systems. Illustrative embodiments employ a reference geometry tool on the robotic arm, and kinematic locators on the coordinate measuring machine and/or on the workpiece storage apparatus to define a coordinate system common to the coordinate measuring machine, the workpiece storage apparatus, and the robot.

There is provided a probe unit correction method for correcting linear expansion of a probe unit to obtain an accurate measurement value. First, a probe offset value is calculated as a model. Then, a probe unit correction method includes a temperature data acquisition step of acquiring a temperature difference between a temperature at a time of calibration and a temperature of a current measurement environment, a reference tip coordinate correction step of calculating, as a reference tip correction coordinate value, a correction value of a reference tip coordinate value to which linear expansion is added, and a probe offset correction step of calculating, as a probe offset correction value, a correction value of a probe offset value to which the linear expansion is added.

A film thickness measuring system measures thicknesses of first films of respective first substrates by spectroscopy, captures first image data of surfaces of second substrates each having a second film to acquire first color information of the surfaces of the second substrates, and calculates a correlation between a thickness of the second film and color information of the surface of the second substrate by using the measured thickness of the first films and the first color information. When estimating a thickness of a third film of a third substrate, the film thickness measuring system acquire second color information of the surface of the third substrate by using captured image data of the third substrate, and estimates a thickness of the third film in the second region, by using the calculated correlation and the second color information.

Embodiments of present disclosure relates to an apparatus and a method for calibrating a laser displacement sensor for use with a robot. The apparatus comprises an auxiliary object arranged in a work space of the robot or held by the robot and comprising a planar surface adapted to be detected by the laser displacement sensor; and a controller configured to: determine a characteristic point on the planar surface of the auxiliary object based on a detection result from the laser displacement sensor; cause the laser displacement sensor to point at the characteristic point for plural times with the same angle and different distances to obtain an orientation of the laser displacement sensor; and cause the laser displacement sensor to point at the characteristic point for plural times with different angles and the same distance to obtain a relative position relationship between the laser displacement sensor and the robot.

Provided are a surface grid scanning and display method, system and apparatus. The method comprises: calibrating all scanning devices located in a same three-dimensional space environment; scanning the three-dimensional space environment by the scanning devices, and generating three-dimensional scanning data corresponding to the scanning devices; obtaining pose information of each frame of the three-dimensional scanning data relative to the three-dimensional space environment; obtaining, based on the pose information and the three-dimensional scanning data, a first sparse 3D surface grid, corresponding to each scanning device, of the three-dimensional space environment; obtaining a second sparse 3D surface grid, corresponding to each scanning device, of a three-dimensional space environment outside a current scanning environment area; and rendering and displaying a combination of the first sparse 3D surface grid and the second sparse 3D surface grid by the scanning device corresponding to the first sparse 3D surface grid.

In an embodiment, a method for automatically generating object inspections includes generating a preliminary list of inspection directions for an object to be inspected. The method also includes checking a compatibility of the preliminary list of inspection directions with each of a plurality of surfaces of the object. The method also includes creating a master set of direction-surface pairs responsive to the checking. The method also includes selecting candidate inspection points for each direction-surface pair in the master set of direction-surface pairs. The method also includes, responsive to a determination that the plurality of surfaces each have at least one compatible inspection direction indicated in the master set of direction-surface pairs, generating an optimized set of direction-surface pairs using a minimization algorithm. The method also includes returning the optimized set of direction-surface pairs and corresponding inspection points.

A control may obtain first data related to a plurality of positions of an implement of a work machine during a first time period and may determine, based on the first data, a first noise value related to at least one velocity of the implement for the first time period. The control device may obtain second data related to a plurality of positions of the implement during a second time period and may determine, based on the second data, a second noise value related to at least one velocity of the implement for the second time period. The control device may determine, based on the first noise value and the second noise value, a start of motion of the implement. The control device may cause, based on determining the start of motion of the implement, the implement to be calibrated.

A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.

The method includes detecting a COP in a surface of a reference wafer with a laser surface inspection apparatus to be calibrated and an apparatus for calibration that obtains an X coordinate position and a Y coordinate position of the COP; determining a COP that is detected as the same COP with a determination criterion that a positional difference between a detected position obtained by the laser surface inspection apparatus to be calibrated and a detected position obtained by the apparatus for calibration on the reference wafer surface is within a threshold range; and calibrating the coordinate position identification accuracy of the laser surface inspection apparatus to be calibrated by adopting the X and Y coordinate positions obtained by the apparatus for calibration as true values of the X and Y coordinate positions.