G01C17/30

SEMICONDUCTOR DEVICE
20170098625 · 2017-04-06 · ·

A semiconductor device is provided. The semiconductor device can be manufactured with a reduced cost. The semiconductor device (1D) includes, a substrate (100D), which includes a main surface (101D) and a recess (108D) depressed from the main surface (101D), and includes a semiconductor material; a wiring layer (200D) in which at least a portion thereof is formed on the substrate (100D); one or more first elements (370D) accommodated in the recess (108D); a sealing resin (400D) covering at least a portion of the one or more first elements (370D) and filled in the recess (108D); and a plurality of columnar conductive portions (230D) penetrating through the sealing resin (400D) in the depth direction of the recess (108D), and respectively connected with the portion of the wiring layer (200D) that is formed at the recess (108D).

Semiconductor device
09559028 · 2017-01-31 · ·

A semiconductor device is provided. The semiconductor device can be manufactured with a reduced cost. The semiconductor device (1D) includes, a substrate (100D), which includes a main surface (101D) and a recess (108D) depressed from the main surface (101D), and includes a semiconductor material; a wiring layer (200D) in which at least a portion thereof is formed on the substrate (100D); one or more first elements (370D) accommodated in the recess (108D); a sealing resin (400D) covering at least a portion of the one or more first elements (370D) and filled in the recess (108D); and a plurality of columnar conductive portions (230D) penetrating through the sealing resin (400D) in the depth direction of the recess (108D), and respectively connected with the portion of the wiring layer (200D) that is formed at the recess (108D).

Semiconductor device
09559028 · 2017-01-31 · ·

A semiconductor device is provided. The semiconductor device can be manufactured with a reduced cost. The semiconductor device (1D) includes, a substrate (100D), which includes a main surface (101D) and a recess (108D) depressed from the main surface (101D), and includes a semiconductor material; a wiring layer (200D) in which at least a portion thereof is formed on the substrate (100D); one or more first elements (370D) accommodated in the recess (108D); a sealing resin (400D) covering at least a portion of the one or more first elements (370D) and filled in the recess (108D); and a plurality of columnar conductive portions (230D) penetrating through the sealing resin (400D) in the depth direction of the recess (108D), and respectively connected with the portion of the wiring layer (200D) that is formed at the recess (108D).

SPINNING FIELD CONCENTRATOR MAGNETIC COMPASS
20250251239 · 2025-08-07 ·

A high precision magnetic compass based on a stationary Hall probe and a spinning two-poles mu-metal field concentrator. The spinning poles lead to an oscillating magnetic field at the location of the Hall probe. The Hall probe sensitivity direction is oriented at an angle of 90 degrees to the rotation axis of the device. A second harmonic of oscillating component, or double frequency, of the signal from the probe, synchronized with the device rotation, is used to align the axis of rotation to be parallel to the magnetic field. The device does not require prior calibration. It is insensitive to drift of the probe parameters and can provide an angle with precision equal to or better than a 0.05 degree.

SPINNING FIELD CONCENTRATOR MAGNETIC COMPASS
20250251239 · 2025-08-07 ·

A high precision magnetic compass based on a stationary Hall probe and a spinning two-poles mu-metal field concentrator. The spinning poles lead to an oscillating magnetic field at the location of the Hall probe. The Hall probe sensitivity direction is oriented at an angle of 90 degrees to the rotation axis of the device. A second harmonic of oscillating component, or double frequency, of the signal from the probe, synchronized with the device rotation, is used to align the axis of rotation to be parallel to the magnetic field. The device does not require prior calibration. It is insensitive to drift of the probe parameters and can provide an angle with precision equal to or better than a 0.05 degree.

WEARABLE ELECTRONIC DEVICE AND OPERATING METHOD THEREFOR
20250271265 · 2025-08-28 ·

A wearable electronic device is provided. The wearable electronic device includes a display, a sensor configured to detect geomagnetism and acquire geomagnetic data, memory storing one or more computer programs, and one or more processors communicatively coupled to the display, the sensor, and memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the wearable electronic device to acquire an azimuth angle on the based on geomagnetic data, acquire a plurality of offsets based on the geomagnetic data when geomagnetic calibration is executed, acquire a reference azimuth angle based on the plurality of offsets, acquire an azimuth angle error based on a uniformity of the plurality of offsets, acquire a new reference azimuth angle by compensating for the azimuth angle error with the reference azimuth angle, and update the new reference azimuth angle in the memory.

WEARABLE ELECTRONIC DEVICE AND OPERATING METHOD THEREFOR
20250271265 · 2025-08-28 ·

A wearable electronic device is provided. The wearable electronic device includes a display, a sensor configured to detect geomagnetism and acquire geomagnetic data, memory storing one or more computer programs, and one or more processors communicatively coupled to the display, the sensor, and memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the wearable electronic device to acquire an azimuth angle on the based on geomagnetic data, acquire a plurality of offsets based on the geomagnetic data when geomagnetic calibration is executed, acquire a reference azimuth angle based on the plurality of offsets, acquire an azimuth angle error based on a uniformity of the plurality of offsets, acquire a new reference azimuth angle by compensating for the azimuth angle error with the reference azimuth angle, and update the new reference azimuth angle in the memory.