A semiconductor device includes: a silicon layer in which a trench is disposed; a surface structure portion disposed on the silicon layer at a position distant from the trench and having a surface provided by a metal layer; and a low electric conductivity portion disposed on the surface of the metal layer or in a part of the resist disposed on the trench side of the metal layer, and having an electric conductivity lower than at least a part of the metal layer covering a trench side portion of the surface of the metal layer.

A vibrator device includes a vibrator element, and a support substrate disposed so as to be opposed to the vibrator element. The support substrate includes a base configured to support the vibrator element, a support configured to support the base, a plurality of beams configured to couple the base and the support to each other, and a drive signal interconnection, a drive constant-potential interconnection, a detection signal interconnection, and a detection constant-potential interconnection each laid around the base and the support passing the beams, and in predetermined one of the beams, at least one of the drive constant-potential interconnection and the detection constant-potential interconnection is disposed on a surface on the vibrator element side, and the detection signal interconnection is disposed on a surface on the opposite side.

A vibrator device includes a vibrator element, and a support substrate disposed so as to be opposed to the vibrator element. The support substrate includes a base configured to support the vibrator element, a support configured to support the base, a plurality of beams configured to couple the base and the support to each other, and a drive signal interconnection, a drive constant-potential interconnection, a detection signal interconnection, and a detection constant-potential interconnection each laid around the base and the support passing the beams, and in predetermined one of the beams, at least one of the drive constant-potential interconnection and the detection constant-potential interconnection is disposed on a surface on the vibrator element side, and the detection signal interconnection is disposed on a surface on the opposite side.

A vibrator device includes a vibrator having a first and second electrode, and a circuit device having a drive circuit adapted to drive the vibrator, and an output circuit adapted to output a monitor signal corresponding to a vibration characteristic of the vibrator while driven by the drive circuit. The circuit device includes a first terminal electrically connected to the first electrode, and from which an output signal from the drive circuit to the vibrator is output, a second terminal electrically connected to the second electrode, and to which an input signal from the vibrator to the drive circuit is input, a third terminal electrically separated from the first electrode and the second electrode, and a monitor terminal from which the monitor signal is output. The vibrator is supported on an active surface side of the circuit device using conductive bumps respectively to the first, second, and third terminal.

A vibrator device includes a vibrator having a first and second electrode, and a circuit device having a drive circuit adapted to drive the vibrator, and an output circuit adapted to output a monitor signal corresponding to a vibration characteristic of the vibrator while driven by the drive circuit. The circuit device includes a first terminal electrically connected to the first electrode, and from which an output signal from the drive circuit to the vibrator is output, a second terminal electrically connected to the second electrode, and to which an input signal from the vibrator to the drive circuit is input, a third terminal electrically separated from the first electrode and the second electrode, and a monitor terminal from which the monitor signal is output. The vibrator is supported on an active surface side of the circuit device using conductive bumps respectively to the first, second, and third terminal.

A method for manufacturing a piezoelectric film deposition substrate (100) according to this present invention includes forming a piezoelectric film (3) on or above the lower electrode (2) with the mask (5) being attached on or above the lower electrode; forming an upper electrode (4) on the piezoelectric film with the mask being attached on or above the lower electrode; forming a the lower-electrode-exposed part (2a) by detaching the mask from the lower electrode; and subjecting the piezoelectric film to polarization by applying a voltage between the lower-electrode-exposed part and the upper electrode.

A sensor element includes a piezoelectric body and a plurality of electrodes. The piezoelectric body, when viewed on a plane, includes a base part and at least one arm part extending from the base part. The plurality of electrodes are located on a surface of the arm part. The piezoelectric body, when viewed on the plane, further includes a frame part which surrounds the base part and the at least one arm part and upon which the base part is bridged.

A sensor element includes a piezoelectric body and a plurality of electrodes. The piezoelectric body, when viewed on a plane, includes a base part and at least one arm part extending from the base part. The plurality of electrodes are located on a surface of the arm part. The piezoelectric body, when viewed on the plane, further includes a frame part which surrounds the base part and the at least one arm part and upon which the base part is bridged.

A piezoelectric body of a sensor includes a driving arm and detecting arm which extend from a base part in a y-axis direction. Excitation electrodes vibrate the driving arm in an x-axis direction. Detecting electrodes enable detection of a signal due to deformation in a z-axis direction of the detecting arm. The piezoelectric body has anisotropy causing vibration of torsional deformation when the driving arm vibrates in the x-axis direction. When the driving arm bends to a +x side, the base part flexes so that a connection position in the base part is displaced to one side in the z-axis direction. The cross-section of the driving arm perpendicular to the y-axis direction causes a bending stiffness to the +x side and to the other side in the z-axis direction is smaller than a bending stiffness to the +x side and to the one side in the z-axis direction.

A piezoelectric body of a sensor includes a driving arm and detecting arm which extend from a base part in a y-axis direction. Excitation electrodes vibrate the driving arm in an x-axis direction. Detecting electrodes enable detection of a signal due to deformation in a z-axis direction of the detecting arm. The piezoelectric body has anisotropy causing vibration of torsional deformation when the driving arm vibrates in the x-axis direction. When the driving arm bends to a +x side, the base part flexes so that a connection position in the base part is displaced to one side in the z-axis direction. The cross-section of the driving arm perpendicular to the y-axis direction causes a bending stiffness to the +x side and to the other side in the z-axis direction is smaller than a bending stiffness to the +x side and to the one side in the z-axis direction.