The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.

The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.

A method for manufacturing a piezoelectric film deposition substrate (100) according to this present invention includes forming a piezoelectric film (3) on or above the lower electrode (2) with the mask (5) being attached on or above the lower electrode; forming an upper electrode (4) on the piezoelectric film with the mask being attached on or above the lower electrode; forming a the lower-electrode-exposed part (2a) by detaching the mask from the lower electrode; and subjecting the piezoelectric film to polarization by applying a voltage between the lower-electrode-exposed part and the upper electrode.

A mechanical coupling device coupling in movement two elements able to move in translation along a first direction, configured to impose thereon movements in phase opposition, the coupling device including two arms rotationally articulated about a second out-of-plane direction, each arm to be connected to one of the movable elements, a coupling element to which the two arms are connected by elements having high rigidity in a third direction, the coupling element being configured to move in translation along the third direction, first and second devices for suspending the coupling element configured to guide the coupling element in translation along the third direction and to limit rotational movement thereof about the second direction.

A mechanical coupling device coupling in movement two elements able to move in translation along a first direction, configured to impose thereon movements in phase opposition, the coupling device including two arms rotationally articulated about a second out-of-plane direction, each arm to be connected to one of the movable elements, a coupling element to which the two arms are connected by elements having high rigidity in a third direction, the coupling element being configured to move in translation along the third direction, first and second devices for suspending the coupling element configured to guide the coupling element in translation along the third direction and to limit rotational movement thereof about the second direction.

An unmanned aircraft includes a circuit board with an inertia sensor, a vibration damper configured to attenuate vibration of the inertia sensor, a weight block configured to provide support for positioning the circuit board, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The vibration damper includes a first vibration-attenuation cushion and a second vibration-attenuation cushion bonded respectively to a first side and a second side of the circuit board. The weight block is disposed between the first vibration-attenuation cushion and the circuit board.

An unmanned aircraft includes a circuit board with an inertia sensor, a vibration damper configured to attenuate vibration of the inertia sensor, a weight block configured to provide support for positioning the circuit board, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The vibration damper includes a first vibration-attenuation cushion and a second vibration-attenuation cushion bonded respectively to a first side and a second side of the circuit board. The weight block is disposed between the first vibration-attenuation cushion and the circuit board.

A vibrator device includes a vibrator element, and a support substrate disposed so as to be opposed to the vibrator element. The support substrate includes a base configured to support the vibrator element, a support configured to support the base, a plurality of beams configured to couple the base and the support to each other, and a drive signal interconnection, a drive constant-potential interconnection, a detection signal interconnection, and a detection constant-potential interconnection each laid around the base and the support passing the beams, and in predetermined one of the beams, at least one of the drive constant-potential interconnection and the detection constant-potential interconnection is disposed on a surface on the vibrator element side, and the detection signal interconnection is disposed on a surface on the opposite side.

A processing mark that is thinned or removed in a thickness direction of a vibration arm is formed at a weight provided at a drive vibration arm of a vibration element, and including a pair of weight ends aligned in an extending direction of the vibration arm. The processing mark includes a first processing end and a second processing end aligned in the extending direction of the vibration arm, the first processing end overlaps one weight end of the weight in plan view in the extending direction of the vibration arm, and a width of the first processing end is smaller than a width of the second processing end.

A processing mark that is thinned or removed in a thickness direction of a vibration arm is formed at a weight provided at a drive vibration arm of a vibration element, and including a pair of weight ends aligned in an extending direction of the vibration arm. The processing mark includes a first processing end and a second processing end aligned in the extending direction of the vibration arm, the first processing end overlaps one weight end of the weight in plan view in the extending direction of the vibration arm, and a width of the first processing end is smaller than a width of the second processing end.