An inertial force sensor includes: an acceleration detection element; a temperature sensor that detects an ambient temperature of the acceleration detection element; a bridge circuit that processes an output signal from the acceleration detection element; an AD converter that converts an analog signal output from the bridge circuit into a digital signal, and outputs the digital signal; a calculation circuit that performs calculation on the output signal from the AD converter; and a storage that stores correction data for correcting a variation in the output signal from the AD converter due to a temperature change. The correction data are coefficients of a formula expressed by a calibration curve that is a quadratic or higher-degree curve, and the storage stores, as the correction data, the coefficients of the calibration curve of each of a plurality of patterns that differ between a predetermined temperature or more and less than the predetermined temperature.

To improve durability against impact, a quartz crystal resonator element includes a recess in a plan view. The quartz crystal resonator element further includes a first principal surface and a second principal surface that are front and rear surfaces facing away from each other and a side surface disposed between the first principal surface and the second principal surface, and the side surface is formed of flat surfaces and curved surfaces formed by dry etching and alternately arranged. The quartz crystal resonator element preferably has a base and at least one resonating arm extending from the base.

To improve durability against impact, a quartz crystal resonator element includes a recess in a plan view. The quartz crystal resonator element further includes a first principal surface and a second principal surface that are front and rear surfaces facing away from each other and a side surface disposed between the first principal surface and the second principal surface, and the side surface is formed of flat surfaces and curved surfaces formed by dry etching and alternately arranged. The quartz crystal resonator element preferably has a base and at least one resonating arm extending from the base.

A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.

A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.

A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.

A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.

A sensor device includes a semiconductor substrate and multiple sensing portions that are placed on one side of the semiconductor substrate and convert a physical quantity into an electrical signal. The one side is parallel to a reference plane defined by an X-direction and a Y-direction perpendicular to each other. The semiconductor substrate has a center point that is both a geometric center and a center of mass. The semiconductor substrate is axisymmetric with respect to each of a first reference line passing through the center point and parallel to the X-direction and a second reference line passing through the center point and parallel to the Y-direction. Each of the sensing portions is axisymmetric with respect to each of the first reference line and the second reference line.

A sensor device includes a semiconductor substrate and multiple sensing portions that are placed on one side of the semiconductor substrate and convert a physical quantity into an electrical signal. The one side is parallel to a reference plane defined by an X-direction and a Y-direction perpendicular to each other. The semiconductor substrate has a center point that is both a geometric center and a center of mass. The semiconductor substrate is axisymmetric with respect to each of a first reference line passing through the center point and parallel to the X-direction and a second reference line passing through the center point and parallel to the Y-direction. Each of the sensing portions is axisymmetric with respect to each of the first reference line and the second reference line.

The present disclosure relates to an inertia measurement module for an unmanned aircraft, which comprises a housing assembly, a sensing assembly and a vibration damper. The vibration damper comprises a first vibration-attenuation cushion; and the sensing assembly comprises a first circuit board, a second circuit board and a flexible signal line for connecting the first circuit board and the second circuit board. An inertia sensor is fixed on the second circuit board, and the first circuit board is fixed on the housing assembly. The inertia measurement module further comprises a weight block, and the second circuit board, the weight block, the first vibration-attenuation cushion and the first circuit board are bonded together. The present disclosure greatly reduces the influence of the operational vibration frequency of the unmanned aircraft on the inertia sensor and improves the measurement stability of the inertia sensor.