A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

A measurement control device includes: a sensing unit that outputs a signal according to an air flow rate; a pulsation state calculation unit that calculates a pulsation state of pulsation generated in the air flow rate using an output value of the sensing unit; and a pulsation error correction unit that corrects the air flow rate. The pulsation state calculation unit has an upper extreme value determination unit and a frequency calculation unit. The upper extreme value determination unit cancels the upper extreme value that has presently appeared, when the output value remains to be more than a predetermined lower threshold. The upper extreme value determination unit updates the lower threshold on a basis of at least one of air flow rate, pulsation frequency, or pulsation amplitude specified on the basis of the output value.

A thermal control apparatus including a body defining a centerline axis extended along a height and a circumferential direction extended relative to the centerline axis. The body forms a flow circuit therethrough, an inlet opening, and an outlet opening each in fluid communication with the flow circuit. The flow circuit is extended in parallel flow arrangement along the circumferential direction from the inlet opening to the outlet opening. A cavity is extended at least partially through the body along the centerline axis. A thermal control system includes the thermal control apparatus, a fluid flow device configured to provide a flow of heat transfer fluid to the apparatus through the inlet opening and to receive the flow of heat transfer fluid from the outlet opening of the apparatus, and a flow conduit providing fluid communication of the flow of heat transfer fluid between the fluid flow device and the apparatus.

An air sensor system including a pressure or airflow sensor, a filter housing that defines an air flow path to the air pressure sensor, and a filter in the air flow path. The filter includes a micro filter and a hydrophobic membrane. The hydrophobic membrane is downstream of the micro filter in the air flow path to the pressure or airflow sensor.

A thermal type sensor molded from a mold resin having an opening has a problem in that the residual stress of the mold resin in the opening causes peeling at the interface having poor adhesion. A physical quantity sensor has a construction having a semiconductor chip having a detector unit 3, a frame 8a on which the semiconductor chip is mounted, a mold resin portion 10 which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layer 6 which is formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and which is formed from a metal material that absorbs a stress from the end.

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

A thermal, flow measuring device for determining and/or monitoring a mass flow of a measured medium, comprising a sensor element (1, 11, 21) having a measuring tube (2, 12, 22) with a tube wall (7, 17, 27) and with at least a first and a second temperature sensor element, which are especially embodied as resistance thermometers (3, 13, 23, 33), wherein at least one of the temperature sensor elements is heatable, wherein the measuring tube (2, 12, 22) has a longitudinal axis (A) and a tube contour (8, 18, 28) with a first tube cross section in the end regions of the measuring tube (2, 12, 22), wherein the measuring tube (2, 12, 22) includes a narrowing having a second tube cross section, which differs in form and/or area from the first tube cross section, wherein the narrowing is divided into at least two segments (6, 16, 26), wherein at least one of the segments (6, 16, 26) is angled relative to the longitudinal axis (A) of the measuring tube (2, 12, 22) by an angle (α) of at least 5° and wherein, in each case, one of the temperature sensor elements is arranged in a respective one of the two segments (6, 16, 26) externally on the tube wall (7, 17, 27) of the measuring tube (2, 12, 22) and is located in thermal contact with the measured medium.

An outlet of a sub passage that returns measured gas, which has passed through a flow sensor, from the sub passage to a main passage opens on an outer wall of a housing toward a downstream side in a reference direction. The outer wall of the housing includes a protrusion on the downstream side of the outlet. When the outlet and the protrusion are projected onto a projection plane perpendicular to the reference direction, the outlet and the protrusion partly overlap with each other on the projection plane. A relationship of θ1<θ2<90° is satisfied, where: θ1 is assumed to be an angle formed between a direction from an upstream end to a top, and the reference direction; and θ2 is assumed to be an angle formed between a direction from a downstream end to the top, and the reference direction.

Methods, apparatuses and systems for providing dehumidification providing dehumidification for gas detecting components are disclosed herein. An example apparatus may comprise: a flow sensing component configured to detect a flow rate associated with a flowing media in a flow channel of the apparatus; and a controller component in electronic communication with the flow sensing component that is configured to receive a flow rate indication from the flow sensing component, and in response to determining that the flow rate indication satisfies a null condition threshold, apply an exponential smoothing function with a variable alpha value to condition an output signal of the apparatus.

An electronic utility gas meter using MEMS thermal time-of-flight flow sensor to meter gas custody transfer mass flowrate and an additional MEMS gas sensor to measure the combustion gas composition for the correlations to the acquisition of gas high heat value simultaneously is disclosed in the present invention. The meter is designed for the applications in the city utility gas consumption in compliance with the current tariff while metering the true thermal value of the delivered gases for future upgrades. Data safety, remote data communication, and other features with state-of-the-art electronics are also included in the design.