An electronic device may have light-based components. The light-based components may include light sources, light detectors, and image sensors. The light-based components may be aligned with a window in the device. The window may be formed within an inactive area of a display or within other device structures. The window may have one or more window members mounted within an opening in a display layer in the inactive area. Visible light blocking material such as chalcogenide glass may be incorporated into the window to provide the window with an opaque appearance that matches the opaque appearance of surrounding portions of the inactive portion of the display. In configurations in which the light-based components include a visible image sensor or other visible light detecting component, the window may be provided with a portion that is transparent at visible wavelengths.

Infrared cloud detector systems and methods for detecting cloud cover conditions.

A method of resolving a number of photons received by a photon detector includes optically coupling a waveguide to a superconducting wire having alternating narrow and wide portions; electrically coupling the superconducting wire to a current source; and electrically coupling an electrical contact in parallel with the superconducting wire. The electrical contact has a resistance less than a resistance of the superconducting wire while at least one narrow portion of the superconducting wire is in a non-superconducting state. The method includes providing to the superconducting wire, from the current source, a current configured to maintain the superconducting wire in a superconducting state in the absence of incident photons; receiving one or more photons via the waveguide; measuring an electrical property of the superconducting wire, proportional to a number of photons incident on the superconducting wire; and determining the number of received photons based on the electrical property.

A silicon-on-insulator (SOI) substrate includes a silicon dioxide layer and a silicon layer. A detection region receives a detected optical mode coupled to an incident optical mode defined by an optical waveguide in the silicon layer. The detection region consists essentially of an intrinsic semiconductor material with a spacing structure surrounding at least a portion of the detection region, which comprises p-type, n-type doped semiconductor regions adjacent to first, second portions, respectively, of the detection region. A dielectric layer is deposited over at least a portion of the spacing structure. The silicon layer is located between the dielectric layer and the silicon dioxide layer. First, second metal contact structures are formed within trenches in the dielectric layer electrically coupling to the p-type, n-type doped semiconductor regions, respectively, without contacting any of the intrinsic semiconductor material of the detection region.

A motor vehicle comprising a translucent front panel, an infrared component configured to receive and/or transmit radiation in the infrared range, a coating arranged on a main surface of the front panel, wherein the infrared component is arranged on the main surface of the front panel in a component region, the coating is arranged between the front panel and the infrared component and is arranged both in the component region and outside the component region, and the coating is transmissive to radiation in the infrared range and has a predefined color locus is disclosed. A motor vehicle comprising an apparatus is also disclosed.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

A method of patterning lithographic substrates that includes using a free electron laser to generate EUV radiation and delivering the EUV radiation to a lithographic apparatus which projects the EUV radiation onto lithographic substrates. The method further includes reducing fluctuations in the power of EUV radiation delivered to the lithographic substrates by using a feedback-based control loop to monitor the free electron laser and adjust operation of the free electron laser accordingly, and applying variable attenuation to EUV radiation that has been output by the free electron laser in order to further control the power of EUV radiation delivered to the lithographic apparatus.

A packaged optical device includes a light source device emitting light to an object surface, a sensor chip receiving reflective light reflected from the object surface, and a non-lens transparency layer located in front of the sensor chip. The light and the reflective light have a first main optic axis and a second main optic axis, respectively, and the first main optic axis and the second main optic axis are configured to form the specular reflection configuration, thereby enhancing images received by the sensor chip. The non-lens transparency layer has a zone passed through by the second main optic axis, and transmittance of the zone is lower than that of other zones of the non-lens transparency layer, thereby preventing the sensor chip from being saturated.

An electronic device including an optical component and an enclosure comprising a glass ceramic region is disclosed. The optical properties of the glass ceramic region and the positioning of the glass ceramic region with respect to the optical component can affect the performance of the optical component, the visual appearance of the optical component, or both.

An anti-dazzle imaging camera is provided that includes a photorefractive crystal that is wavelength-agnostic. The photorefractive crystal is configured to receive an optical beam. When the optical beam includes no laser, the photorefractive crystal is configured to pass the optical beam unchanged to an imaging detector. When the optical beam includes a laser, the photorefractive crystal is configured to attenuate the laser to generate a modified optical beam and to pass the modified optical beam to the imaging detector.