Various embodiments are described herein for a sensor device, a method of manufacturing said sensor device, and a camera device constructed using said sensor device. The sensor device includes: a readout integrated circuit; an array of electrical contacts mounted to the readout integrated circuit; a solution processed layer deposited on top of the array of electrical contacts; and a spectral band filter layer deposited on top of the solution processed layer, wherein the spectral band filter layer is optically aligned with the solution processed layer and wherein the readout integrated circuit, the array of electrical contacts and the solution processed layer form together a focal plane array for receiving light from a lens device.