An optical sensor package includes an IC die including a light sensor element, an output node, and bond pads including a bond pad coupled to the output node. A leadframe includes a plurality of leads or lead terminals, wherein at least some of the plurality of leads or lead terminals are coupled to the bond pads including to the bond pad coupled to the output node. A mold compound provides encapsulation for the optical sensor package including for the light sensor element. The mold compound includes a polymer-base material having filler particles including at least one of infrared or terahertz transparent particle composition provided in a sufficient concentration so that the mold compound is optically transparent for providing an optical transparency of at least 50% for a minimum mold thickness of 500 μm in a portion of at least one of an infrared frequency range and a terahertz frequency range.

Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

According to one embodiment of the present disclosure, there is provided an ultraviolet detector, including: an ultraviolet ray transmitting part configured to transmit ultraviolet ray contained in incident light; a wavelength conversion part configured to convert the ultraviolet ray transmitted through the ultraviolet ray transmitting part into visible light; and a visible light receiving part configured to detect the visible light obtained by the wavelength conversion part.

A gas sensing device, that may include a suspended gas sensing element, a frame that supports the suspended gas sensing element, and one or more traps for trapping at least one out of Siloxane and silicon dioxide. The suspended gas sensing element may include a gas reactive element that has a gas dependent temperature parameter, and a semiconductor temperature sensing element that is thermally coupled to the gas reactive element, and is configured to generate detection signals that are responsive to a temperature of the gas reactive element. The gas reactive element and the semiconductor temperature sensing element are of microscopic scale.

An electronic device is disclosed herein, including: a substrate, an optical sensor device including at least one light-emitting element and a light-receiving element, the optical sensor device mounted on the substrate, and an injection-molded lens coupled to the substrate and covering the optical sensor device, wherein the injection-molded lens is spaced apart from the optical sensor device by a set distance, wherein patterns are integrally formed in at least a portion of the injection-molded lens, the patterns affecting transmission of light of at least one wavelength band to improve an optical efficiency of the transmitted light.

According to one embodiment of the present disclosure, there is provided an ultraviolet detector, including: an ultraviolet ray transmitting part configured to transmit ultraviolet ray contained in incident light; a wavelength conversion part configured to convert the ultraviolet ray transmitted through the ultraviolet ray transmitting part into visible light; and a visible light receiving part configured to detect the visible light obtained by the wavelength conversion part.

An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.

Described herein is a detector for detecting optical radiation, especially within the infrared spectral range, specifically with regard to sensing at least one of transmissivity, absorption, emission and reflectivity, being capable of avoiding or diminishing a cross detection between sensor areas, specifically between adjacent sensor areas, thus, avoiding or diminishing a deterioration of a measurement based on the at least one sensor signal.

A microbolometer detector for detecting electromagnetic radiation is disclosed. The microbolometer detector includes a substrate, a vacuum package, and an array of microbolometers disposed on the substrate inside the vacuum package. Each microbolometer includes a platform supported above the substrate, a thermistor disposed on the platform and having an electrical resistance that varies with its temperature, and an optical absorber including a frequency-selective surface and configured to absorb the electromagnetic radiation to generate heat and change the temperature of the thermistor. The microbolometer detector also includes a reflector disposed on the substrate under the array of microbolometers, and an optical window configured to allow the electromagnetic radiation to pass therethrough and reach the optical absorbers. The optical window is spaced apart from the reflector to form therebetween an optically resonant cavity. The resonant cavity is tuned to an absorption band of the optical absorbers.

A gas sensing device, that may include a suspended gas sensing element, a frame that supports the suspended gas sensing element, and one or more traps for trapping at least one out of Siloxane and silicon dioxide. The suspended gas sensing element may include a gas reactive element that has a gas dependent temperature parameter, and a semiconductor temperature sensing element that is thermally coupled to the gas reactive element, and is configured to generate detection signals that are responsive to a temperature of the gas reactive element. The gas reactive element and the semiconductor temperature sensing element are of microscopic scale.