Bolometers and methods of forming the same are provided. A bolometer that includes a substrate, a support structure comprising at least one SiGe layer and at least one Si layer, an absorber comprising reduced graphene oxide, and a thermistor comprising partially reduced graphene oxide are described. Also described are methods for forming bolometers and the parts contained therein.

A light detector includes: a support substrate; a light transmission substrate which forms an accommodation space along with the support substrate; a light detection element which is located in the accommodation space and includes a bolometer layer; a first base layer which includes a first corner portion; a second base layer which includes a second corner portion; a solder layer which is disposed between the first base layer and the second base layer, fixes the support substrate and the light transmission substrate to each other, and air-tightly seals the accommodation space; and a reinforcement portion which is integrally formed with the solder layer by the same material as that of the solder layer, in which the reinforcement portion reaches at least one of the first surface side and the second surface side inside the first corner portion and the second corner portion.

A method for manufacturing a device (1) for detecting electromagnetic radiation. The method comprises the steps of: supplying a first substrate (400) comprising a reading circuit (340), at least two first contact plugs (343, 344) and at least one first annular bonding element (345) surrounding the first contact plugs (343, 344); supplying a second substrate comprising a cap (210), an annular side wall forming with the cap (210) a cavity filled with a sacrificial material and a detection structure (100) housed in the cavity. The method further comprising the steps of bonding the second substrate (200) on the first substrate (400); arranging at least one opening (212) in the second substrate (200); selective elimination of the sacrificial material; and closing the opening (212) under at least a primary vacuum.

A device may include a filter array disposed on a substrate. The filter array may include a first mirror disposed on the substrate. The filter array may include a plurality of spacers disposed on the first mirror. A first spacer, of the plurality of spacers, may be associated with a first thickness. A second spacer, of the plurality of spacers, may be associated with a second thickness that is different from the first thickness. A first channel corresponding to the first spacer and a second channel corresponding to the second spacer may be associated with a separation width of less than approximately 10 micrometers (?m). The filter array may include a second mirror disposed on the plurality of spacers.

A method for manufacturing a device (1) for detecting electromagnetic radiation. The method comprises the steps of: supplying a first substrate (400) comprising a reading circuit (340), at least two first contact plugs (343, 344) and at least one first annular bonding element (345) surrounding the first contact plugs (343, 344); supplying a second substrate comprising a cap (210), an annular side wall forming with the cap (210) a cavity filled with a sacrificial material and a detection structure (100) housed in the cavity. The method further comprising the steps of bonding the second substrate (200) on the first substrate (400); arranging at least one opening (212) in the second substrate (200); selective elimination of the sacrificial material; and closing the opening (212) under at least a primary vacuum.

A device may include a filter array disposed on a substrate. The filter array may include a first mirror disposed on the substrate. The filter array may include a plurality of spacers disposed on the first mirror. A first spacer, of the plurality of spacers, may be associated with a first thickness. A second spacer, of the plurality of spacers, may be associated with a second thickness that is different from the first thickness. A first channel corresponding to the first spacer and a second channel corresponding to the second spacer may be associated with a separation width of less than approximately 10 micrometers (?m). The filter array may include a second mirror disposed on the plurality of spacers.

A sensor configured to sense heat or infrared light including a substrate includes a plurality of recess portions; a cavity inside the substrate along a bottom surface and opposing side surfaces of the substrate; a lower reflective layer disposed on at least one of an upper surface of the bottom surface of the substrate, a lower surface of the bottom surface of the substrate, and a surface opposite to the lower surface of the bottom surface of the substrate; a first electrode and a second electrode disposed inside both side surfaces of the recess portion and facing each other; a pixel structure configured to sense heat or infrared light inside the recess portion and embedded in the substrate; and a planarization layer covering the entire upper portion of the substrate.

Disclosed herein are thermal sensor devices including TMOS devices with a mass suspended over a cavity by springs extending between a frame and the mass. The thermal sensor devices include stoppers that limit upward and/or downward movement of the springs and therefore the mass. These stoppers are formed from sidewalls supporting a top cap over the frame, springs, and mass. The stoppers are constructed by using various overlapping metal layers during fabrication. Details of forming the stoppers using these overlapping metal layers are contained here.

An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.