Device and method of forming a device are disclosed. The device includes a substrate with a transistor component disposed in a transistor region and a micro-electrical mechanical system (MEMS) component disposed on a membrane over a lower sensor cavity in a hybrid region. The MEMS component serves as thermoelectric-based infrared sensor, a thermopile line structure which includes an absorber layer disposed over a portion of oppositely doped first and second line segments. A back-end-of-line (BEOL) dielectric is disposed on the substrate having a plurality of inter layer dielectric (ILD) layers with metal and via levels. The ILD layers include metal lines and via contacts for interconnecting the components of the device. The metal lines in the metal levels are configured to define a BEOL or an upper sensor cavity over the lower sensor cavity, and metal lines of a first metal level of the BEOL dielectric are configured to define a geometry of the MEMS component.

Aspects and examples described herein provide a lightweight radiation shielding structure for infrared cameras. In one example, a top radiation shielding element and a bottom radiation shielding element are placed as close as possible to an infrared detector to minimize excess weight added to the infrared camera while providing optimal radiation shielding. Such aspects and examples provide important functionality for numerous weight-sensitive applications in high-radiation environments.

Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.

A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermosensors. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.

Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.

There is provided a fiber optic temperature probe having a base, a first tube connected to the base, a second tube provided coaxially within the first tube, a probe tip extending through an opening in a distal end of the first tube; and an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube. There is also provided a fiber optic temperature probe having a base, a first tube connected to the base, a probe tip extending through an opening in a distal end of the first tube, an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube, and a first lens positioned between the probe tip and the optical fiber.

Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

A temperature sensing apparatus may include a body, a tube combined with the body, and a temperature sensor. The temperature sensor is configured to measure a temperature of an object, in the tube, without being in contact with the object. The body may include an air chamber formed adjacent to a temperature sensing region of the object.

An infrared thermometer, having an upper shell, a lower shell, an ear temperature probe, and a forehead temperature head; the ear temperature probe is provided with an infrared sensor, an infrared sensor copper sleeve and a probe body; a piece of flat and smooth transparent glass is provided between an end of the probe body having a smaller inner diameter and the infrared sensor copper sleeve, so that the end of the ear temperature probe inserted into the ear canal is configured as a flat surface by the transparent glass.

A thermal imaging system is provided. The thermal imaging system includes an explosion-proof housing with an optical window configured to contain an explosive pressure. The optical window allows electromagnetic thermal energy to pass. A thermal imaging sensor is disposed within the explosion-proof housing. Thermal imaging electronics are coupled to the thermal imaging sensor and configured to provide at least one thermal image based on a signal from the thermal imaging sensor. A lens assembly is disposed at least in front of the optical window external to the explosion-proof housing. A composite optical window for thermal imaging is also provided. In another embodiment, a thermal imaging system includes an explosion-proof housing having an optical window configured to contain an explosive pressure. An infrared (IR) camera is disposed within the explosion-proof housing. A reflector reflects electromagnetic thermal energy to the IR camera, but prevent an object from impacting the optical window.