An infrared imaging unit. The infrared imaging unit includes an infrared detector and a heat insulation assembly, the heat insulation assembly being disposed on one side of the infrared detector, the heat insulation assembly being used to isolate a heat transfer in the infrared imaging unit to the infrared detector.

An infrared imaging unit. The infrared imaging unit includes an infrared detector and a heat insulation assembly, the heat insulation assembly being disposed on one side of the infrared detector, the heat insulation assembly being used to isolate a heat transfer in the infrared imaging unit to the infrared detector.

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

An ultra-small thermal imaging core, or micro-core. The design of the micro-core may include substrates for mounting optics and electronic connectors that are thermally matched to the imaging Focal Plane Array (FPA). Test fixtures for test and adjustment that allow for operation and image acquisition of multiple cores may also be provided. Tooling may be included to position the optics to set the core focus, either by moving the lens and lens holder as one or by pushing and/or pulling the lens against a lens positioning element within the lens holder, while observing a scene. Test procedures and fixtures that allow for full temperature calibration of each individual core, as well as providing data useful for uniformity correction during operation may also be included as part of the test and manufacture of the core.

A microbolometer for measuring thermal radiation comprises an electrical circuit on a perforated plastic substrate. The electrical circuit comprises at least one thermistor having a temperature dependent electric resistance, wherein the thermistor is arranged to receive the thermal radiation for changing its temperature depending on a flux of the received thermal radiation. The electrical circuit is configured to measure the electric resistance of the thermistor for calculating the thermal radiation. The microbolometer is configured to cause a gas flow through the perforations for improving thermal characteristics.

A microbolometer for measuring thermal radiation comprises an electrical circuit on a perforated plastic substrate. The electrical circuit comprises at least one thermistor having a temperature dependent electric resistance, wherein the thermistor is arranged to receive the thermal radiation for changing its temperature depending on a flux of the received thermal radiation. The electrical circuit is configured to measure the electric resistance of the thermistor for calculating the thermal radiation. The microbolometer is configured to cause a gas flow through the perforations for improving thermal characteristics.

An optically powered cryogenic FPA with an optical data link eliminates electrical penetrations of the cryogenic chamber for power delivery thereby reducing heat leaks into the cold volume by copper wires and EMI. An optical splitter receives and separates an optical input signal into an optical carrier signal, an optical Data IN signal and an optical power signal. An optical-to-electrical (O/E) converter converts the optical power signal into an electrical power signal, which is converted into a plurality of DC voltage signals to supply power within the chamber. An optical data link modulates the optical carrier signal with electrical signals from the ROIC to form and output an optical Data OUT signal.

An optically powered cryogenic FPA with an optical data link eliminates electrical penetrations of the cryogenic chamber for power delivery thereby reducing heat leaks into the cold volume by copper wires and EMI. An optical splitter receives and separates an optical input signal into an optical carrier signal, an optical Data IN signal and an optical power signal. An optical-to-electrical (O/E) converter converts the optical power signal into an electrical power signal, which is converted into a plurality of DC voltage signals to supply power within the chamber. An optical data link modulates the optical carrier signal with electrical signals from the ROIC to form and output an optical Data OUT signal.

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.

An infrared sensor comprises a base substrate including a recess, a bolometer infrared ray receiver, and a Peltier device. The bolometer infrared ray receiver comprises a resistance variable layer, a bolometer first beam, and a bolometer second beam. The Peltier device comprises a Peltier first beam formed of a p-type semiconductor material and a Peltier second beam formed of an n-type semiconductor material. The Peltier device is in contact with a back surface of the bolometer infrared ray receiver. One end of each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam is connected to the base substrate. The bolometer infrared ray receiver and the Peltier device are suspended above the base substrate. Each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam has a phononic crystal structure including a plurality of through holes arranged regularly.