Patent classifications
G01J5/068
Contact-type sensor
The present invention limits measurement error and sensor element damage. When a contact-type sensor (200) is placed in contact with skin (10), a gap (200a) is formed between the skin (10) and a sensor element (214). The contact-type sensor (200) is provided with a water-repellent resin base plate (212) and a water-absorbing sheet (211) that, together with the skin (10) and the sensor element (214), surround the gap (200a).
Radiometry device
The present invention separates radiation from an object by a polarization filter 3 into polarized light beams, causes one of the beams to enter a spectrum analyzer 7 through a first optical path, causes the other to enter the spectrum analyzer 7 through a second optical path, and measures the two-color ratio, while causes radiation of a blackbody 2 placed in a vacuum ultralow temperature thermostatic chamber 1 in a quasi-thermal equilibrium state at an ultralow temperature in vacuo to enter the polarization filter 3 through a third optical path, separates the radiation into polarized light beams, causes the beams to each enter the same optical paths as the respective optical paths for the radiation of the object, causes the beams to enter the spectrum analyzer 7, measures the two-color ratio, and accurately obtains the temperature of the object on the basis of these two two-color ratios.
Infrared detection circuit and infrared sensor
An infrared detection circuit includes an infrared sensor element, detects infrared rays and outputs a detection signal to an external detection circuit. The infrared detection circuit includes an impedance element connected between a ground of the infrared sensor element and a ground of the external detection circuit and including at least one of resistivity and inductivity. The impedance element blocks noise from outside. The ground of the infrared sensor element is connected to the impedance element via a ground of an internal substrate of the infrared detection circuit.
Blade driving device and infrared imaging device
The use of a blade driving device including a first plate wherein a first opening portion is formed; a blade formed so as to enable opening/closing of the first opening portion; a driving mechanism driving the blade; and a cover, wherein a second opening portion is formed so as to essentially overlap the first opening portion, and formed so as to cover the base plate and the driving mechanism portion. Because the base plate and driving mechanism portion are covered by the cover, when compared to the conventional structure, this enables the transmission, without variability, of heat in relation to the driving mechanism portion and the base plate.
Removal of interference of absorbers from intensity data
A method for thermal imaging includes extracting pixel intensity data from a plurality of images corresponding to electromagnetic radiation emitted from one or more targets, creating an array for each image pixel in the plurality of images, wherein each pixel array represents a distribution of intensity data from corresponding pixels in each of the images, removing from each pixel array an amount of intensity data such that a remaining amount of intensity data represents an approximate equivalent to a distribution of intensity data uncontaminated by interference; and generating a thermal image representing the one or more targets based on the remaining amount of intensity data in each pixel array.
Thermal infrared sensor array in wafer-level package
A thermal infrared sensor array in a wafer-level package includes at least one infrared-sensitive pixel produced using silicon micro mechanics, comprising a heat-isolating cavity in a silicon substrate surrounded by a silicon edge, and a thin membrane connected to the silicone edge by of thin beams. The cavity extends through the silicon substrate to the membrane, and there are slots between the membrane, the beams and the silicon edge. A plurality of infrared-sensitive individual pixels are arranged in lines or arrays and are designed in a CMOS stack in a dielectric layer, forming the membrane, and are arranged between at least one cover wafer which is designed in the form of a cap and has a cavity and a base wafer. The cover wafer, the silicon substrate and the base wafer are connected to one another in a vacuum-tight manner and enclosing a gas vacuum.
Infrared temperature measurement and stabilization thereof
Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. An overmolded sensor assembly may include an IR sensor, which may include a sensing element or IR element and a circuit or signal processor. The IR element may be thermally bonded with a frame or conductive top hat.
Removal of Interference of Absorbers from Intensity Data
A method for thermal imaging includes extracting pixel intensity data from a plurality of images corresponding to electromagnetic radiation emitted from one or more targets, creating an array for each image pixel in the plurality of images, wherein each pixel array represents a distribution of intensity data from corresponding pixels in each of the images, removing from each pixel array an amount of intensity data such that a remaining amount of intensity data represents an approximate equivalent to a distribution of intensity data uncontaminated by interference; and generating a thermal image representing the one or more targets based on the remaining amount of intensity data in each pixel array.
LIGHT DETECTOR
A light detector includes a light detecting element and a reference element. The reference element includes a second substrate and a second membrane disposed on a second surface so as to form a void space between the second membrane and the second surface of the second substrate. The second membrane includes a pair of second wiring layers facing each other with a second gap extending along a second line interposed therebetween and a second resistance layer electrically connected to each of the pair of second wiring layers and having an electrical resistance depending on a temperature. An outer shape of the second membrane when viewed from a direction perpendicular to the second surface is a polygonal shape. The second line extends between diagonals facing each other with a geometric center position of the second membrane interposed therebetween when viewed from a direction perpendicular to the second surface.
MULTILAYER PYROELECTRIC ELEMENT
A multilayer pyroelectric element includes: a laminate body constituted by multiple pyroelectric body layers laminated in their thickness direction; internal electrode layers which are provided between the pyroelectric body layers, and one ends of which extend to the outer peripheries of the adjoining pyroelectric body layers; and external electrodes that connect the alternate internal electrode layers together at the one ends, wherein x.sub.1>x.sub.3 AND x.sub.2>x.sub.3 are satisfied wherein x.sub.1 is a distance between a pair of first faces crossing at right angles with the laminating direction of the pyroelectric body layers, x.sub.2 is a distance between a pair of second faces crossing at right angles with the first faces and running parallel with the laminating direction of the pyroelectric body layers, and x.sub.3a is a distance between a pair of third faces crossing at right angles with the first faces and also with the second faces.