In a method for noncontact, radiation thermometric temperature measurement, a short-circuit photocurrent that is proportional to a received radiant power is produced in a photodiode radiation detector that is operating photovoltaically without bias voltage. The photocurrent is processed in a current to voltage converter. Subsequently, a temperature signal corresponding to the radiant power is generated. A corrective current, dependent on a temperature of the photodiode radiation detector, is added to the short-circuit photocurrent to compensate a fault current, wherein the fault current is based on an input bias current and an input offset voltage of the current to voltage converter across a temperature-dependent shunt resistance of the photodiode radiation detector. A device with a corrective current source controlled by a microcontroller is provided that can be used to perform the method.

The present invention discloses an automatic calibration method of a sensor, including the following steps of: (A1) setting a default trigger value; (A2) sampling a signal and accumulating a signal value to perform signal judgment; (A3) determining whether a trigger condition is met or not; (A4) if yes, recording an accumulated signal value meeting the trigger condition, and if not, returning to step (A2); and (A5) analyzing and updating the default trigger value.

An arrangement for sensing temperatures on a surface includes a thermal/infrared array sensor having a field of view. The thermal/infrared array sensor is positioned such that the surface is within the field of view. A benchmark object has a known temperature. The benchmark object is disposed within the field of view of the thermal/infrared array sensor. An electronic processor is communicatively coupled to the thermal/infrared array sensor and receives a signal from the thermal/infrared array sensor. The signal includes a temperature measurement of the surface and a temperature measurement of the benchmark object. A difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object is calculated. A temperature of the surface is calculated based on the temperature measurement of the surface and the difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object.

A system and method for detecting medical conditions in individuals in crowded settings is described, including methods and approaches for addressing confounding issues such as variation due to external factors.

A live detection system, a thermal infrared (IR) imager and a method for power grid equipment are provided. The system includes an environmental parameter module for acquiring environmental temperature, humidity and wind speed data; a ranging module for measuring a linear distance to the power grid equipment; an equipment type recognition module for acquiring an image of the power grid equipment, and recognizing a type of the power grid equipment; an equipment material determination module for determining a material type of the power grid equipment; an emissivity setting module for setting an emissivity; an temperature measurement module for obtaining a temperature of the power grid equipment by focusing on positions of the power grid equipment which need temperature measurement; and a report generation module for selecting a corresponding diagnostic model, displaying a temperature measurement position and a temperature value, drawing a conclusion, and generating a report.

A system and method for measuring the temperature of cookware to be induction-heated, using an infrared temperature sensor. An induction heater countertop may include a viewing window between the infrared temperature sensor and the cookware. Various algorithms may be applied to the sensed temperature, to adjust it to account for the presence of the viewing window, as well as variations in the cookware material.

A sensor device, a method for operating a sensor device and an electronic assembly comprising a sensor device are disclosed. In an embodiment a sensor device includes a first sensor unit and a second sensor unit in a common housing, wherein each of the first and second sensor units comprises a heater element and a temperature sensor element, wherein the housing comprises a cover element having an opening, the cover element covering the first sensor unit, and wherein the opening is arranged over the second sensor unit.

Improved techniques for thermal imaging and gas detection are provided. In one example, a system includes a first set of filters configured to pass first filtered infrared radiation comprising a first range of thermal wavelengths associated with a background portion of a scene. The system also includes a second set of filters configured to pass second filtered infrared radiation comprising a second range of thermal wavelengths associated with a gas present in the scene. The first and second ranges are independent of each other. The system also includes a sensor array comprising adjacent infrared sensors configured to separately receive the first and second filtered infrared radiation to capture first and second thermal images respectively corresponding to the background portion and the gas. Additional systems and methods are also provided.

A flame sensor apparatus includes a sensor assembly. The sensor assembly includes a photodiode for sensing characteristics of a flame. The photodiode outputs an electrical photocurrent. The sensor assembly includes an electrical assembly that is electrically remote from the sensor assembly. The sensor assembly includes an electric cable assembly extending from the sensor assembly to the electrical assembly. The electric cable assembly includes an electrical cable to electrically convey the photocurrent to the electrical assembly. At least the sensor assembly is configured and constructed to experience and continue to operate at a temperature at or greater than 200 C.

An infrared detection circuit includes an infrared sensor element, detects infrared rays and outputs a detection signal to an external detection circuit. The infrared detection circuit includes an impedance element connected between a ground of the infrared sensor element and a ground of the external detection circuit and including at least one of resistivity and inductivity. The impedance element blocks noise from outside. The ground of the infrared sensor element is connected to the impedance element via a ground of an internal substrate of the infrared detection circuit.