A device including a sensor is disclosed. In one embodiment, the sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology (also referred to as “TMOS”). The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor coupled to the sensor determines the temperature as well as presence.

A two-dimensional terahertz radiation detector includes a spectral conversion element, an array of microlenses, and a matrix image sensor. Such a detector can be particularly compact, light, and inexpensive. For some embodiments, it can be used to produce multispectral images of an external scene, from terahertz radiation that originates from the scene.

An optical sensing device includes a substrate, a sensing element layer, a first planarization layer, and a second planarization layer. The sensing element layer is located on the substrate and includes a plurality of sensing elements. The first planarization layer is located on the sensing element layer and has a first slit. The second planarization layer is located on the first planarization layer and has a second slit. An orthogonal projection of the first slit extending in a direction and located on the substrate is not overlapped with an orthogonal projection of the second slit extending in the same direction and located on the substrate, and the orthogonal projection of the second slit on the substrate has a curved pattern.

There is disclosed a structure and the manufacturing method for packaging for thermopile or equivalent thermal sensing elements of single orientation, 1D arrays and 2D arrays used for thermal or equivalent media sensing. The sensing core has a primary use as a detection core, and accessory use for improved thermal stability through maximizing the flow of heat energy, through the various packaging constituents to achieve a zero thermal gradient effect. The core package comprises of a substrate, a heat spreader for the thermal sensor, an external housing material manufactured from a wafer fabrication process, and an optics of a silicon wafer and other optical components that is attached to the external housing enclosure using wafer level processing. The external housing enclosure can be scaled to a layered architecture into distinct layers that are stacked vertically on top of each other to make for a multi-lens package.

There is disclosed a structure and the manufacturing method for packaging for thermopile or equivalent thermal sensing elements of single orientation, 1D arrays and 2D arrays used for thermal or equivalent media sensing. The sensing core has a primary use as a detection core, and accessory use for improved thermal stability through maximizing the flow of heat energy, through the various packaging constituents to achieve a zero thermal gradient effect. The core package comprises of a substrate, a heat spreader for the thermal sensor, an external housing material manufactured from a wafer fabrication process, and an optics of a silicon wafer and other optical components that is attached to the external housing enclosure using wafer level processing. The external housing enclosure can be scaled to a layered architecture into distinct layers that are stacked vertically on top of each other to make for a multi-lens package.

A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.

A lens allows infrared light to pass therethrough. An infrared sensor includes infrared detection elements arranged in two or more columns. The infrared sensor is rotated around a scan rotation axis that passes through part of the lens to scan a detection range, and outputs an output signal indicating a thermal image of the detection range. At least two infrared detection elements in the infrared sensor are located at positions displaced from each other with respect to the scan rotation axis. Among the infrared detection elements, the number of first infrared detection elements having a smaller half-width of a point spread function in a scan direction than that in the direction of the scan rotation axis is larger than the number of second infrared detection elements having a larger half-width of a point spread function in the scan direction than that in the direction of the scan rotation axis.

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.