An atmosphere of ammonia that absorbs infrared light in a wavelength band overlapping with the measurement wavelength band of a radiation thermometer is formed in a chamber in which a semiconductor wafer is thermally treated. A filter that selectively transmits infrared light having a wavelength not overlapping with the absorption wavelength band of ammonia is installed between an optical lens system and a detector of the radiation thermometer to avoid influence of the infrared light absorption by ammonia. A conversion table corresponding to the installed filter is selected from a plurality of conversion tables representing a correlation between energy of infrared light incident on the radiation thermometer and temperature of a black body, and is used at the radiation thermometer. Accordingly, the temperature of the semiconductor wafer can be accurately measured in the atmosphere of ammonia.

An infrared imaging system includes a detector configured to detect a flame in a first infrared wavelength band and to detect a thermal image in a second infrared wavelength band, longer than the first infrared wavelength band; and an imaging circuit configured to output an image including the flame and the thermal image.

An imaging apparatus includes an imaging optical system that has a light transmission characteristic of transmitting near-infrared light in a near-infrared light wavelength range including 1550 nm, and an imaging sensor that outputs an imaging signal by imaging the near-infrared light transmitted through the imaging optical system, the imaging sensor has sensitivity to heat radiation from a subject, and the imaging signal includes information regarding a heat radiation image by the heat radiation.

A multi-color pyrometry imaging system for a high-temperature asset includes at least one viewing port in optical communication with at least one high-temperature component of the high-temperature asset. The system also includes at least one camera device in optical communication with the at least one viewing port. The at least one camera device includes a camera enclosure and at least one camera aperture defined in the camera enclosure, The at least one camera aperture is in optical communication with the at least one viewing port. The at least one camera device also includes a multi-color filtering mechanism coupled to the enclosure. The multi-color filtering mechanism is configured to sequentially transmit photons within a first predetermined wavelength band and transmit photons within a second predetermined wavelength band that is different than the first predetermined wavelength band.

A non-contact temperature measurement device includes: a matching processing unit to estimate a correspondence relationship of pixels between images; a positional relationship estimating unit to estimate a positional relationship between an infrared camera and an object on the basis of the correspondence relationship of the pixels; a luminance correcting unit to correct luminance corresponding to a temperature in a luminance image on the basis of the positional relationship; and an emissivity correcting unit to estimate emissivity using the correspondence relationship of the pixels and the luminance image and generate a temperature image on the basis of the emissivity, in which the matching processing unit estimates the correspondence relationship of the pixels between images captured by the infrared camera in the same light receiving sensitivity wavelength band, and the emissivity correcting unit estimates emissivity using images captured by the infrared camera in different light receiving sensitivity wavelength bands.