Thermal camera assembly (1) comprising a thermal imaging detector (3) providing thermographic images and/or recordings, a protective casing (2) which houses the thermal imaging detector and includes a window (5) with a transparent screen (6), one or more sensors (15;16;20;32;33) arranged in the protective casing and providing signals indicative of a physical quantity or a state, one or more actuators (8;22;28) arranged in the protective casing, and a control unit (9) which is integrated in the protective casing. The control unit is directly connected to the thermal imaging detector to receive the thermographic images and/or recordings and transmit them to the outside, to the sensors to receive the relative signals, and to the actuators to control the latter according to the signals received. The control unit is able to manage and control the communication between all the components of the thermal camera and the outside. The thermal camera assembly is part of a control system for controlling an industrial production process and is used in a relative control method.

Thermal camera assembly (1) comprising a thermal imaging detector (3) providing thermographic images and/or recordings, a protective casing (2) which houses the thermal imaging detector and includes a window (5) with a transparent screen (6), one or more sensors (15;16;20;32;33) arranged in the protective casing and providing signals indicative of a physical quantity or a state, one or more actuators (8;22;28) arranged in the protective casing, and a control unit (9) which is integrated in the protective casing. The control unit is directly connected to the thermal imaging detector to receive the thermographic images and/or recordings and transmit them to the outside, to the sensors to receive the relative signals, and to the actuators to control the latter according to the signals received. The control unit is able to manage and control the communication between all the components of the thermal camera and the outside. The thermal camera assembly is part of a control system for controlling an industrial production process and is used in a relative control method.

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

An infrared sensor cover includes a decorative layer, a transparent first base, and a transparent second base. The decorative layer includes a first surface and a second surface opposite the first surface. The first base is made of a resin molded body and disposed on the first surface of the decorative layer. The second base is made of a resin molded body and disposed on the second surface of the decorative layer. An absolute value of a difference between refractive indices of a first resin material of the first base and a second resin material of the second base is less than or equal to 0.05. An absolute value of a difference between heat deflection temperatures of the first resin material and the second resin material is greater than or equal to 15 degrees.

The present invention relates to a light guiding arrangement (1) for transmitting electromagnetic radiation, in particular ultraviolet and/or infrared radiation, and a spark and/or flame detector that uses same. The light guiding arrangement (1) comprises a housing (10) and a light guiding rod (20), wherein the housing (10) has a light entrance opening (12) and a light exit opening (14) situated opposite, wherein the light guiding rod (20) is arranged in the housing (10) between the light entrance opening (12) and the light exit opening (14), wherein the light guiding rod (20) is mounted resiliently on at least one side in the housing (10).

Embodiments of the present disclosure relate to a flame detector. The flame detector comprises a light guide system including a first end and a second end opposite to the first end, a light path being formed between the first end and the second end and extending along an optical axis; a first hole disposed at the first end, extending along the optical axis and forming a part of the light path, the first hole being configured to receive light emitted by a flame to be detected; and a second hole disposed at the second end, extending along the optical axis and forming a part of the light path, sizes of the first and second holes and a length of the light path being configured such that a detection angle of the light guide system is between 0.5 degrees and 3 degrees.

Embodiments of the present disclosure relate to a flame detector. The flame detector comprises a light guide system including a first end and a second end opposite to the first end, a light path being formed between the first end and the second end and extending along an optical axis; a first hole disposed at the first end, extending along the optical axis and forming a part of the light path, the first hole being configured to receive light emitted by a flame to be detected; and a second hole disposed at the second end, extending along the optical axis and forming a part of the light path, sizes of the first and second holes and a length of the light path being configured such that a detection angle of the light guide system is between 0.5 degrees and 3 degrees.

An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.