An electronic device for measuring an ambient temperature (T.sub.air) of the environment of an electronic device is described. It comprises at least one integrated infrared sensor, a blinded window preventing infrared radiation to directly impinge on the integrated infrared sensor and being in thermal contact with the environment as well as with a cover of the device resulting in the blinded window being at a surface temperature (T.sub.surface). The at least one integrated infrared sensor is adapted for sensing the temperature of the blinded window (T.sub.surface). The device also comprises at least one absolute temperature sensor for measuring a temperature of the at least one infrared sensor (T.sub.sensor) itself, and a processing means for determining a temperature difference (T) between the sensed surface temperature (T.sub.surface) and the temperature of the infrared sensor (T.sub.sensor) and for calculating based thereon the ambient temperature (T.sub.air).

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

An electrical inspection method includes: a step of preparing a wafer in which a plurality of Fabry-Perot interference filter portions is formed, each of the plurality of Fabry-Perot interference filter portions in which a distance between a first mirror portion and a second mirror portion facing each other varies by an electrostatic force; and a step of inspecting electrical characteristics of each of the plurality of Fabry-Perot interference filter portions.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A non-contact type infrared temperature sensor module according to an embodiment of the present invention can comprise: a case of which a portion of an upper surface is opened and having an accommodation space formed therein; a base having an upper surface coupled to the case; a cover window provided on the upper surface of the case and sealing the opened portion of the case; an infrared temperature sensor provided on the upper surface of the base and sensing the temperature of an object by receiving light transmitted from the cover window; and a first capping unit coupled to an upper portion of the infrared temperature sensor and blocking heat transmitted from the accommodation space.

A cold stage actuation system employs an optical assembly having an adapter ring mounted to a flange connected to a cold finger which extends into a dewar. The flange supports a detector array. A resilient cold shield extends from the adapter ring to a lens holder, the lens holder connected to the resilient cold shield distal from the adapter ring. The lens holder supports a lenslet array. An optical light shield extends from the lens holder oppositely from the resilient cold shield to proximate a window in the dewar. A motor is supported within the dewar. An insulating translation arm connects the motor to the optical light shield, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis.

Embodiments of the present disclosure relate to a flame detector. The flame detector comprises a light guide system including a first end and a second end opposite to the first end, a light path being formed between the first end and the second end and extending along an optical axis; a first hole disposed at the first end, extending along the optical axis and forming a part of the light path, the first hole being configured to receive light emitted by a flame to be detected; and a second hole disposed at the second end, extending along the optical axis and forming a part of the light path, sizes of the first and second holes and a length of the light path being configured such that a detection angle of the light guide system is between 0.5 degrees and 3 degrees.

An infrared sensor including a plurality of infrared cameras is described. Each infrared camera includes an infrared detector and imaging optics. The imaging optics are arranged to image infrared light onto the infrared detector, the imaging optics having a field of view with a center optical axis, and field of view boundary lines bounding the field of view on sides of the field of view. The infrared cameras are arranged such that the center optical axes of the field of views intersect each other, and the fields of view overlap each other.

An infrared camera assembly for a vehicle. The assembly includes: a vehicle component having a front surface; a shutterless far-infrared (FIR) camera mounted within the vehicle component, wherein the shutterless FIR camera is utilized to output at least one thermal video stream processed by the autonomous vehicle system; and a protective window disposed on at least a portion of the front surface of the vehicle component, where the protective window is positioned to be aligned with a lens of the FIR camera, so as to allow the shutterless FIR camera to capture images therethrough.

A thermal infrared sensor with a mount so that it can be fixed onto infrared windows to provide a solution for performing continuous thermal monitoring of equipment that is provisioned with one or more infrared windows. The IR mount can be made out of any material or combination thereof. The mount can be attached in any possible form to the Infrared window or enclosure surrounding the Infrared window. The mount can fully or partially cover the Infrared window to be monitored. Depending on its implementation it could also fully or partially cover more than just one infrared window. The mount can be a mount made specifically for one or more types of Infrared windows or a generic mount. It could be an existing mount that could be used in such a way that when combined with the second element it enables the presented invention.