An infrared sensor includes: a package; an infrared detecting element formed on the package, the infrared detecting element including a thermal detector and an absorber formed on the thermal detector which is configured to absorb infrared light rays of a specific wavelength that are detected by conversion of the infrared light rays into heat; and a cap formed on the package to cover the infrared detecting element, the cap including: a body having front and rear surfaces, through which the infrared light rays transmit; and a shielding film, with a window formed therein, provided on at least one of the front and rear surfaces of the body, the infrared light rays being reflected by the shielding film other than a portion of the shielding film having the window, and every one of the infrared light rays passing through the window of the cap impinging on the absorber.

The present invention discloses a surface covering device comprising a tile, a base assembly, a plurality of tile connectors located between the tile and the base assembly for releasably connecting the tile to the base assembly, at least one capacitive sensor located on the tile, wherein the capacitive sensor is configured to detect changes in capacitive data indicative of the presence of activity within a predetermined range of the capacitive sensor; an infrared sensor configured to receive infrared data; a capacitive controller communicatively coupled to an infrared controller configured for receiving the capacitive data and the infrared data from the capacitive sensor and infrared sensor respectively; a mesh controller configured to receive the capacitive data and the infrared data from the capacitive controller and infrared controller respectively, and a wireless transceiver in data communication with the capacitive controller and the infrared controller, wherein the wireless transceiver is configured to transmit the capacitive data and the infrared data to a data analysis server, wherein the data analysis server is configured to determine an event based on the capacitive data and the infrared data.

Described herein are techniques for reducing spike noise arising in pyroelectric infrared sensors due to charge build up. The sensors developed by the inventors and described herein rely on the use of dummy elements positioned to prevent or limit charge build-up in the unused space. A first sensing element comprises a first portion of the first layer of conductive material, a first portion of the layer of pyroelectric material, a first portion of the second layer of conductive material and a first absorption region coupled to the first portion of the first layer of conductive material. A dummy element comprises a second portion of the first layer of conductive material, a second portion of the layer of pyroelectric material and a second portion of the second layer of conductive material. The first layer of conductive material defines a first gap between the first portion of the first layer of conductive material and the second portion of the first layer of conductive material.

A motion sensor includes an infrared detector with a first set of detector elements and a second set of detector elements. The motion sensor also includes an optical system to direct electromagnetic energy from a first set of monitored volumes spaced at a pitch in a first direction onto the first set of detector elements and to direct electromagnetic energy from a second set of monitored volumes spaced at the pitch in the first direction onto the second set of detector elements. The second set of monitored volumes have an offset from the first set of monitored volumes in the first direction.