Methods and systems for performing non-contact temperature measurements of optical elements with long wavelength infrared light are described herein. The optical elements under measurement exhibit low emissivity to long wavelength infrared light and are often highly reflective or highly transmissive to long wavelength infrared light. In one aspect, a material coating having high emissivity, low reflectivity, and low transmission at long wavelength IR wavelengths is disposed over selected portions of one or more optical elements of a metrology or inspection system. The locations of the material coating are outside the direct optical path of the primary measurement light employed by the metrology or inspection system to perform measurements of a specimen. Temperature measurements of the front and back surfaces of an IR-transparent optical element are performed with a single IR camera. Temperature measurements are performed through multiple optical elements in an optical path of a primary measurement beam.

A system and method for calibrating an imaging system includes a shutter that is moveable in to the optical path of the imaging system to generate an image of the shutter surface, which is flat and uniform. The shutter can be moved in and out of the optical path between first and second positions. The shutter is heated while in the second position and then returned to the first position. Data sets generated at two different temperatures enable the image generated by the imaging system in normal use to be to be adjusted for responsivity and variation in DC offset of the specific pixel array.

Various techniques are provided for calibrating a thermal imaging device using a non-contact temperature sensor. In one example, a method includes capturing a thermal image of a scene. The thermal image comprises a plurality of pixel values. The method also includes detecting, by a non-contact temperature sensor, a temperature value associated with a portion of the scene corresponding to a subset of the pixel values. The method also includes comparing the subset of pixel values with the detected temperature value. The method also includes generating a correction term based on the comparing. The method also includes applying the correction term to at least the subset of pixel values to radiometrically calibrate the subset of pixel values. Related systems and alignment processes are also provided.

A shield plate is a shield plate related to non-contact measurement of temperature of a semiconductor apparatus, and includes a base of which temperature is adjustable, in which the amount of thermal radiation of a blackbody surface located on one side of the base is larger than the amount of thermal radiation of a reflective surface located on a side opposite to the blackbody surface, and the blackbody surface is a blackbody surface that emits infrared rays.

A shield plate that is used for non-contact measurement of a temperature of a measurement target is provided. The shield plate includes a base of which a temperature is adjustable. The base includes a central shield portion that is formed in the shield plate, an opening that is formed around the central shield portion, and a blackbody surface that is formed on one surface of the base to include a portion opposite to the opening with the central shield portion interposed therebetween and to radiate infrared rays.

Provided is a measuring method capable of accurately measuring the surface temperature of a surface to be measured, uninfluenced by the emissivity distribution of the surface to be measured. A surface to be measured having an emissivity distribution, a radiometer that measures a radiance distribution of the surface to be measured, and an auxiliary heat source installed in a specular reflection position from the radiometer with respect to the surface to be measured are prepared, radiances of two places having different emissivities of the surface to be measured are measured at two different auxiliary-heat-source temperatures, a reflectance ratio of the two places having the different emissivities is calculated on the basis of two measured radiances of the two places having the different emissivities, and temperature of the surface to be measured is obtained using reflectance ratio and measured radiances of the two places having different emissivities.

Methods and systems for performing non-contact temperature measurements of optical elements with long wavelength infrared light are described herein. The optical elements under measurement exhibit low emissivity to long wavelength infrared light and are often highly reflective or highly transmissive to long wavelength infrared light. In one aspect, a material coating having high emissivity, low reflectivity, and low transmission at long wavelength IR wavelengths is disposed over selected portions of one or more optical elements of a metrology or inspection system. The locations of the material coating are outside the direct optical path of the primary measurement light employed by the metrology or inspection system to perform measurements of a specimen. Temperature measurements of the front and back surfaces of an IR-transparent optical element are performed with a single IR camera. Temperature measurements are performed through multiple optical elements in an optical path of a primary measurement beam.

A calibration system for a passive millimeter-wave (PMMW) camera. The calibration system includes a thermal calibrator having a first thermally conducting body, a second thermally conducting body, a first black body target mounted to a front surface of the first conducting body, a second black body target mounted to a front surface of the second conducting body, and a thermo-electric (TE) cooling device having a hot side and a cold side. The hot side of the TE cooling device is thermally attached to the first conducting body and the cold side of the TE cooling device is thermally attached to the second conducting body.

A temperature-controlled calibration source for thermal imaging that provides for extremely inexpensive, mass producible, field deployable thermal calibration in specific, relatively low temperature ranges, and in particular temperatures near nominal human body temperature. A calibration source suitable for such applications may be implemented primarily as a suitable designed Printed Circuit Board (PCB), packaged in a thermally isolating housing and powered of commonly available power sources such as USB chargers.

Systems, methods, and devices for in-situ calibration of a second sensor use a first sensor, with the two sensors operating in different optical regimes and/or based on different optical effects. In some embodiments, the methods employ a reference wafer having two regions that have different optical properties to calibrate a temperature sensor. Prior to the in-situ calibration, the first sensor is calibrated over a range of temperatures. During the in-situ calibration, the first sensor reads a first spot in the first region of the reference wafer and a second sensor reads a second spot in the second region that is close to the first spot.