A sensing panel and a manufacturing method of the same, and a method for pressure detection and temperature detection are disclosed in the present invention. The sensing panel comprises a scanning line, a first data line, a second data line, a first detection line, a second detection line, a pressure detecting unit, and a temperature detecting unit. The pressure detecting device is used to detect a pressure applied to the pressure detecting unit; the temperature detecting device is used to detect a temperature an object either near the temperature detecting unit or in contact with the temperature detecting unit. The present invention is able to detect the pressure and the temperature applied to the sensing panel.

A modular platform unit comprising a plurality of sensors for the combined sensing of pressure, temperature and humidity. In particular, the sensors are composed of a layer of metallic-capped nanoparticles (MCNP) casted on a flexible substrate or a rigid substrate. Integration of the platform unit for artificial or electronic skin applications is disclosed.

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

A method for producing a polysilicon resistor device may include: forming a polysilicon layer; implanting first dopant atoms into at least a portion of the polysilicon layer, wherein the first dopant atoms include deep energy level donors; implanting second dopant atoms into said at least a portion of said polysilicon layer; and annealing said at least a portion of said polysilicon layer.

An apparatus for thermal conductance measurement includes a first heater assembly having a beam, a platen disposed at an end of the beam, and a heating element and a Resistance Temperature Device (RDT) disposed on the platen. The embodiment further includes a second heater assembly having a second beam, a second platen disposed at an end of the second beam, and a second heating element and a second Resistance Temperature Device (RDT) disposed on the platen. A test rig is also included, and the first heater and second heater assembly are mated to the test rig and separated by a gap length.

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

A a modular platform unit comprising a plurality of sensors for the combined sensing of pressure, temperature and humidity. In particular, the sensors are composed of a layer of metallic-capped nanoparticles (MCNP) casted on a flexible substrate or a rigid substrate. Integration of the platform unit for artificial or electronic skin applications is disclosed.

A substrate and a display device are disclosed. The substrate includes: a base substrate; a first temperature sensing section disposed on the base substrate; and a first processing chip connected with the first temperature sensing section. The substrate includes a peripheral area and a central area; one part of the first temperature sensing section is disposed in the peripheral area of the substrate; another part of the first temperature sensing section is disposed in the central area of the substrate; and the first processing chip is configured to convert temperature sensing signals of the central area and the peripheral area of the substrate sensed by the first temperature sensing section into relevant control signals and output the signals. The above first temperature sensing section can more accurately measure the temperature difference between the peripheral area and the central area of the substrate.

A method for producing a polysilicon resistor device may include: forming a polysilicon layer; implanting first dopant atoms into at least a portion of the polysilicon layer, wherein the first dopant atoms include deep energy level donors; implanting second dopant atoms into said at least a portion of said polysilicon layer; and annealing said at least a portion of said polysilicon layer.

The present invention provides a modular platform unit comprising a plurality of sensors for the combined sensing of pressure, temperature and humidity. In particular, the sensors are composed of a layer of metallic-capped nanoparticles (MCNP) casted on a flexible substrate or a rigid substrate. Integration of the platform unit for artificial or electronic skin applications is disclosed.