Patent classifications
G01K7/20
WIRING BOARD AND TEMPERATURE SENSING ELEMENT
A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.
System and method for thermal management guidance
The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.
SYSTEM AND APPARATUS FOR SUSTAINING PROCESS TEMPERATURE MEASUREMENT FOR RTD LEAD WIRE BREAK
Method and apparatus for sustaining process temperature measurement with respect to a lead wire break. A resistance temperature device can include a group of lead wire arms including lead wire arms of a first lead wire type and a second lead wire type. An operation can occur to automatically switch from a first lead wire type configuration to a second lead wire type configuration in the resistance temperature device having the plurality of lead wire arms including the first lead wire type and the second lead wire type, if one or more wire breaks occurs in one or more the lead wire arms.
Electronically controlled mechanical timepiece, control method of an electronically controlled mechanical timepiece, and electronic timepiece
Provided are a timepiece having a temperature compensator drivable by a low voltage with low current consumption, and a control method of a timepiece. The timepiece includes an arithmetic circuit, a first switch that controls connection of a temperature compensation table storage to a power supply circuit, and a second switch that controls connection of a device-difference compensation data storage to the power supply circuit. The arithmetic circuit calculates a compensation amount based on a temperature measured by a temperature detector, a temperature compensation data, a device-difference compensation data, and outputs to a frequency adjustment control circuit and a theoretical regulation circuit. The first switch is controlled to the connect state during a first power supply connection period including a temperature compensation data read period. The second switch is controlled to the connect state during a second power supply connection period including a device-difference compensation data read period.
TEMPERATURE INPUT UNIT, TEMPERATURE MEASURING DEVICE, AND RECORDING MEDIUM
A temperature input unit includes a disconnection detection circuit that measures a temperature of a measurement target with at least one of a thermocouple or a temperature measurement resistor and feeds a disconnection detection current for disconnection detection to the thermocouple and a compensating wire connected to the thermocouple. A controller controls, before measuring the temperature of the measurement target with the thermocouple, a terminal switch and an input circuit switch to connect the compensating wire to a temperature measurement resistor input circuit and an A/D converter, and calculates a predicted value of a voltage drop resulting from resistance of the compensating wire occurring in response to the disconnection detection current. The controller controls the terminal switch and the input circuit switch to connect the compensating wire to a thermocouple input circuit and the A/D converter, and subtracts the predicted value from a measured value of the thermoelectromotive force detected by the thermocouple input circuit to calculate a corrected measured value of the thermoelectromotive force.
TEMPERATURE INPUT UNIT, TEMPERATURE MEASURING DEVICE, AND RECORDING MEDIUM
A temperature input unit includes a disconnection detection circuit that measures a temperature of a measurement target with at least one of a thermocouple or a temperature measurement resistor and feeds a disconnection detection current for disconnection detection to the thermocouple and a compensating wire connected to the thermocouple. A controller controls, before measuring the temperature of the measurement target with the thermocouple, a terminal switch and an input circuit switch to connect the compensating wire to a temperature measurement resistor input circuit and an A/D converter, and calculates a predicted value of a voltage drop resulting from resistance of the compensating wire occurring in response to the disconnection detection current. The controller controls the terminal switch and the input circuit switch to connect the compensating wire to a thermocouple input circuit and the A/D converter, and subtracts the predicted value from a measured value of the thermoelectromotive force detected by the thermocouple input circuit to calculate a corrected measured value of the thermoelectromotive force.
CIRCUIT ARRANGEMENT AND METHOD OF FORMING THE SAME
Various embodiments may provide a circuit arrangement. The circuit arrangement may include an adjustable resistor bridge configured to receive a driving signal from an electronic device, and further configured to generate one or more intermediate signals based on the driving signal. The circuit arrangement may also include an amplifier stage configured to generate an amplified signal based on the one or more intermediate signals, and a scaler configured to generate an output signal based on the amplified signal. The adjustable resistor bridge may include at least one resistor of a first resistor type having a first coefficient of resistance with respect to an environmental condition, and at least one resistor of a second resistor type having a second coefficient of resistance with respect to the environmental condition different from the first coefficient. A resistance of the first resistor type may be adjustable by a resistor stage digital control signal.
CIRCUIT ARRANGEMENT AND METHOD OF FORMING THE SAME
Various embodiments may provide a circuit arrangement. The circuit arrangement may include an adjustable resistor bridge configured to receive a driving signal from an electronic device, and further configured to generate one or more intermediate signals based on the driving signal. The circuit arrangement may also include an amplifier stage configured to generate an amplified signal based on the one or more intermediate signals, and a scaler configured to generate an output signal based on the amplified signal. The adjustable resistor bridge may include at least one resistor of a first resistor type having a first coefficient of resistance with respect to an environmental condition, and at least one resistor of a second resistor type having a second coefficient of resistance with respect to the environmental condition different from the first coefficient. A resistance of the first resistor type may be adjustable by a resistor stage digital control signal.
Temperature control circuit, oscillation control circuit, and temperature control method
In-package temperature is controlled with higher accuracy. To this end, a temperature control circuit includes a temperature sensor arranged in a package and detecting temperature in the package, a heater current detection circuit detecting a driving amount of a heater, a target temperature generation circuit generating a target temperature from an intended temperature of a resonator and a detection value of the driving amount detected by the heater current detection circuit, a heater current driver controlling the heater so that the detection temperature detected by the temperature sensor coincides with the target temperature, and an Nth-order correction circuit receiving the detection value of the driving amount detected by the heater current detection circuit or a signal based on the target temperature and cancelling influence of a second or higher order fluctuation component generated in the heater current detection circuit on temperature of the resonator.
Enhanced Temperature Sensor
A calibration method of a temperature sensor is provided. The temperature sensor having a current source and a ring oscillator generating a square pulse signal with a temperature-dependent square pulse frequency. The acquisition of a first square pulse frequency measurement at a first temperature from the square pulse signal forms a first measurement point. A second square pulse frequency measurement at a second temperature from the second square pulse signal forms a second measurement point. The determination of the relation data being representative of an affine relation between square pulse frequency measurements and temperatures. The affine relation being defined by a used proportionality coefficient modified with respect to a measured proportionality coefficient of a measured affine relation linking the first measurement point and the second measurement point.