The temperature-dependent resistance of a MEMS structure is compared with an effective resistance of a switched CMOS capacitive element to implement a high performance temperature sensor.

The present invention relates a thermal sensor comprising an ionically conductive composition and a conductive layer, wherein said ionically conductive composition comprises an ionic liquid and a thermoplastic resin. The thermal sensor according to the present invention can be used for sensing a temperature from skin, a metal surface, and a conductive polymer.

The invention achieves a lower noise of a sense signal of a FET-type hydrogen sensor. For solving the above problem, one aspect of a sensor system of the invention includes a reference device and a sensor device configured using FETs on a substrate, and further, well potentials of the reference device and the sensor device are electrically isolated from each other.

A sensor assembly is provided that allows for a more rapid sensing of thermal changes. In preferred embodiments, the sensor assembly includes a housing, sensor package, bushing, coupling and gasket. The bushing is made from a conductive material like copper or silver and provides a conductive path from the bottom of the sensor package directly into the medium whose temperature is to be sensed or close thereto. A coupling is provided between the conductive bushing the metal housing to prevent heat exchange between the metal housing and the bushing. The gasket is placed in compression and provides a constant force holding the conductive bushing against the bottom of the sensor package.

A thermal sensing device comprises a substrate, a first insulating layer, at least one first sensing resistor, at least one second sensing resistor, a plurality of etching holes and a cavity. The first insulating layer is disposed on the substrate. The first sensing resistor is disposed above the first insulating layer. The second sensing resistor is disposed above the first insulating layer and isolated from the at least one first sensing resistor. The etching holes are disposed around the at least one first sensing resistor and the at least one second sensing resistor. The cavity is formed below the at least one first sensing resistor and the at least one second sensing resistor. The thermal sensing device is implemented in a measurement circuit to improve the problem that the signal becomes smaller when the sensing element is minimized.

Various examples of methods and systems related to thermistor sensing for measurement of respiration are shown. In one example, a breath sensing system includes a self-heating temperature sensor that can be positioned in respiratory air of a subject and processing circuitry that can monitor operation of the self-heating temperature sensor. Respiratory information associated with physical or physiological properties of the subject can be communicated to a remotely located computing device. Electronic switching circuitry can be included to change operation of the self-heating temperature sensor between a temperature sensing mode and a heated power dissipation sensing mode. The processing circuitry can control switching between the modes. In another example, a method includes monitoring operational conditions of a self-heating temperature sensor positioned in respired air and determining, e.g., breath velocity, breath period, breath volume, breath carbon dioxide level, and heart rate based at least in part upon the operational conditions.

In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.

A composite thermistor element is described. The element includes a sensor material that is disposed between a pair of electrodes. The sensor material includes particles in a dielectric matrix. Each of the particles have: a core having a temperature dependent resistance, and a cover layer of an inorganic material. The particles form an electron conducting pathway between the electrodes having a temperature dependent resistance and a base-line resistance. Further aspects relate to a method of manufacturing the thermistor, the coated particles, a composition for use in the manufacturing of composite thermistors that includes the particles, and to a temperature sensor including the thermistor described herein.

Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.

Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties.