G01K11/265

POWER POLE SYSTEM
20200370323 · 2020-11-26 ·

An energy transmission system comprising a pole, at least one wire, a sensing system coupled to the pole for monitoring pole temperature, dynamic pole loading, external impact on the pole, vibration of the pole, and wires that are downed, at least one line sensor coupled to the wire and at least one powered data integrator. The sensing system comprises at least one dynamic pole loading sensor and a three-dimensional accelerometer. The dynamic pole loading sensor can be coupled to the lower portion of the pole above ground level but not more than 10 feet above ground level. Optionally there are two dynamic pole loading sensors, the first sensor having a longitudinal axis parallel to a longitudinal axis of the pole, and the second sensor having a longitudinal axis perpendicular to the longitudinal axis of the pole.

Temperature measurement in switchgear stations

The invention relates to a device for measuring temperature in a high-voltage portion of a switchgear station, characterised in that it comprises: at least one temperature sensor (21, 22, 23, 24) located at a point on the high-voltage portion of which the temperature is to be monitored, at least one antenna (25) connected to the at least one temperature sensor, a control module (26) located in a low-voltage portion of the switchgear station, and at least one antenna (27) connected to the control module. The at least one temperature sensor (21, 22, 23, 24) is suitable for transmitting a signal representative of a temperature measurement and the control module (26) is suitable for receiving the representative signal, via the antennas, and for processing said signal in order to produce a message.

SENSOR DEVICE
20200326313 · 2020-10-15 ·

Disclosed is a sensor device (1) comprising a piezoelectric transducer (3) and a base member (2). The piezoelectric transducer comprises a piezoelectric member with at least one excitation electrode (37, 38) connected to a first face thereof and having a thickness (h) between the first face and a second face. The piezoelectric transducer (3) is attached to a supporting face of the base member (2) with the second face of the piezoelectric transducer adjacent the supporting face of the base member. The base member comprises at least one acoustic wave reflecting tag (21) distant from the piezo-electric member.

Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof

An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.

Rotor assembly sensor system with interference isolation
10749612 · 2020-08-18 · ·

A sensor system includes a rotor antenna, a radio frequency (RF) sensor, a stator antenna, and one or more frequency selective structures. The rotor antenna and the RF sensor are disposed on an outer surface of a shaft and are conductively connected to each other. The RF sensor generates measurement signals as the shaft rotates. The stator antenna is mounted separate from the shaft and positioned radially outward from the rotor antenna. The stator antenna wirelessly receives the measurement signals from the rotor antenna across an air gap. The one or more frequency selective structures are disposed on the outer surface of the shaft and configured to dissipate electromagnetic current that is conducted along the shaft to alleviate interference of the measurement signals.

Temperature information assembly for a cooking hob

The present invention relates to a temperature information assembly for a cooking hob (18). The temperature information assembly comprises at least one SAW (surface acoustic wave) temperature sensor (10) permanently or removably attached or attachable at or in a cooking pot (24), at least one sensor antenna (12) permanently or removably attached or attachable at the cooking pot (24) and electrically connected to the SAW temperature sensor (10), at least one reader (14) permanently or removably attached or attachable in or on the cooking hob (18), and at least one reader antenna (16) permanently or removably attached or attachable in or on the cooking hob (18) and electrically connected to the reader (14). The SAW temperature sensor (10) is wireless connected or connectable to the reader (14) via the sensor antenna (12) and the reader antenna (16). The reader (14) is electrically connected or connectable to a control unit (22) of the cooking hob (18) in order to control the cooking process. Further, the present invention relates to a cooking hob (18) with the temperature information assembly. Moreover, the present invention relates to a cooking pot (24) with the SAW temperature sensor (10) and the sensor antenna (12) or prepared for receiving said SAW temperature sensor (10) and sensor antenna (12).

Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonator

An acoustic wave filter having thermal sensing acoustic wave resonator comprises a substrate, a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. The thermal sensing acoustic wave resonator is one of a series acoustic wave resonator and a shunt acoustic wave resonator. Thereby the thermal sensing acoustic wave resonator plays dual roles of thermal sensing and acoustic wave filtering.

POWER CABLE CONNECTOR, ELECTRICAL SYSTEM AND METHOD FOR ASSEMBLING POWER CABLE CONNECTOR
20200203896 · 2020-06-25 ·

Embodiments of present disclosure relate to a power cable connector, an electrical system and a method for assembling a power cable connector. The power cable connector comprises a housing comprising a first portion adapted to contain a conductive plug inserted therethrough. The power cable connector also comprises a first layer arranged on at least a part of an inner wall of the housing. The power cable connector further comprises a second layer arranged on the first layer so that the first layer is at least partially located between the inner wall of the housing and the second layer. The power cable connector further comprises a passive wireless measuring apparatus embedded into the second layer, wherein in the case that the conductive plug is inserted into the first portion, a surface of the passive wireless measuring apparatus is coupled to the conductive plug. According to embodiments of the present disclosure, the on-line monitoring of the temperature of the conductive plug can be obtained and the power failure can be detected in advance.

Surface acoustic wave device

Provided is a surface acoustic wave device using a novel and steadily suppliable piezoelectric material that is resistant to a high-temperature environment and enables the surface acoustic wave device to use a 2 GHz to 2.5 GHz band or higher. The surface acoustic wave device includes: a piezoelectric substrate formed from a monocrystal of gehlenite (CAS: Ca2Al(AlSi)O7); and interdigital transducers formed on a surface acoustic wave propagation plane of the piezoelectric substrate.

SENSOR SYSTEM AND METHOD

A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.