A range appliance and sensor assembly are provided herein. The range appliance may include a top panel, a backsplash, an acoustic wave reader, and a surface acoustic wave (SAW) temperature sensor. The top panel may support a cooking utensil. The top panel may include a top surface and a bottom surface. The backsplash may extend above the top surface along a vertical direction. The acoustic wave reader may be mounted to the backsplash. The SAW temperature sensor may be disposed above the top surface along the vertical direction. The SAW sensor may be in operable communication with the acoustic wave reader.

A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

An oven appliance and method of operation are provided herein. The oven appliance may include a cabinet defining an oven cavity, a heat source disposed within the oven cavity, an acoustic wave reader, a surface acoustic wave (SAW) temperature sensor receivable within the oven cavity, and a controller in operable communication with the acoustic wave reader. The controller may be configured to initiate a sensor protection sequence. The sensor protection sequence may include initiating a preset oven cycle of the heat source, and monitoring the oven cavity for a condition signal in response to the initiated oven cycle. The sensor protection sequence may further include determining a state of the SAW temperature sensor based on the monitoring, and halting the preset oven cycle based on a determined cavity-enclosed state of the SAW temperature sensor within the oven cavity.

Embodiments disclosed herein include sensor devices. In an embodiment, a sensor device comprises a substrate, a first sensor of a first type on the substrate, where a catalytic layer is provided as at least part of the first sensor, a second sensor of the first type on the substrate and adjacent to the first sensor, and a lid over the substrate, where an opening through the lid is provided over the first sensor and the second sensor.

A system includes a core temperature probe and a microwave cooking device. The core temperature probe includes a temperature sensor to determine a temperature information, a coaxial line including a lambda/4 line resonance element adjusted to a microwave frequency, and a signal transmission antenna connected to the temperature sensor via the coaxial line and adapted to emit the temperature information at a signal transmission frequency that differs from the microwave frequency. The system is hereby constructed to transmit a signal at the signal transmission frequency wirelessly between the signal transmission antenna of the core temperature probe and a signal transmission antenna of the microwave cooking appliance.

An arrangement is disclosed for measuring an environment parameter at a rotor of a rotary machine; according to some embodiments, the parameter to be measured is temperature and the machine to monitor is a turbomachine. The arrangement includes at least: a SAW or BAW device electrically coupled with an antenna, a parameter-sensitive impedance device, and two identical cables electrically coupling the SAW or BAW device respectively with the impedance device and a short-circuit or an open-circuit or a matching impedance device. The SAW or BAW device is located in a first zone of the rotor, while the parameter-sensitive impedance device is located in a second zone of the rotor remote from the first zone of the rotor. An interrogator can obtain environment parameter values by sending RF signals to the SAW or BAW device through the antenna.

A sensor assembly that includes a surface acoustic wave (SAW) sensor. The SAW sensor is adapted to measure a first environmental condition in response to receiving an RF signal. The SAW sensor includes a substrate having a layer of piezoelectric material. The SAW sensor further includes a interdigitated transducer (IDT) formed on the piezoelectric material. The IDT includes two comb-shaped electrodes having interlocking conducting digits in a first arrangement. The interlocking conducting digits in the first arrangement generates a first signal modulation of an RF signal received by the first IDT. The first signal modulation identifies the first SAW sensor.

As a temperature measurement apparatus using a surface acoustic wave of a piezoelectric substrate that performs temperature measurement wirelessly and without power supply, the temperature measurement apparatus accurately measures the temperature of the thermocouple tip end by analyzing the frequency characteristics of the surface acoustic wave propagating on the piezoelectric substrate and including temperature information of the piezoelectric substrate, and detecting change in propagation time of the surface acoustic wave of the piezoelectric substrate that is changed by the electromotive force of the thermocouple.

A measurement method performed by a semiconductor manufacturing apparatus including a chamber is provided. In the measurement method, first measurement data including a signal of a resonance frequency of the chamber is acquired as reference data, in response to transmitting an electrical signal into the chamber while a jig capable of performing wireless communication is not placed in the chamber. Subsequently, second measurement data including the signal of the resonance frequency of the chamber and including a signal of a resonance frequency of a sensor installed in the jig is acquired, in response to transmitting an electrical signal into the chamber while the jig is placed in the chamber. By subtracting the reference data from the second measurement data, third measurement data is calculated.

Provided are a sensor package and a sensor package module. The sensor package includes: a substrate including a sensing area; a terminal portion disposed on a side of the sensing area of the substrate and including at least one terminal connected to the outside; a first outer wall disposed on the substrate and including a main wall surrounding at least some outer portions of the sensing area; at least one wire patterned and disposed on the substrate and configured to connect the sensing area and the terminal portion to each other; and a cover disposed on the first outer wall to correspond to the sensing area. Part of the main wall is disposed between the sensing area and the terminal portion, and the main wall includes an opening through which the at least one wire passes.