Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

An acoustic wave sensor device comprises a first interdigitated transducer, a first reflection structure, a second reflection structure, a first resonance cavity comprising a first upper surface and formed between the first interdigitated transducer and the first reflection structure, and a second resonance cavity comprising a second upper surface and formed between the first interdigitated transducer and the second reflection structure. At least one of the first and second upper surfaces is covered at least partly by a metalization layer or a passivation layer. The present invention relates also to an acoustic wave sensor assembly.

A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.

An acoustic wave sensor device comprises a quartz material layer surface; arranged along a first axis, a first interdigitated transducer disposed over the planar surface of the quartz material layer, a first reflection structure disposed over the planar surface of the quartz material layer, and a second reflection structure disposed over the planar surface of the quartz material layer; and arranged along a second axis, a second interdigitated transducer disposed over the planar surface of the quartz material layer, a third reflection structure disposed over the planar surface of the quartz material layer, and a fourth reflection structure disposed over the planar surface of the quartz material layer; and wherein the first axis and the second axis are inclined to each other by a finite angle.

A method for measuring a temperature inside a kitchen appliance, in particular a temperature of an item to be cooked, inside a kitchen appliance, includes: transmitting an electromagnetic excitation signal using a transmission-receiving device, receiving the excitation signal by a temperature sensor, which is arranged in the kitchen appliance, in particular in the item to be cooked, transmitting a temperature-dependent response signal by the temperature sensor, receiving the response signal by the transmission-receiving device, determining the current temperature by comparing the response signal to temperature-dependent reference signals. To also provide for an interaction between a plurality of kitchen appliances, the transmission-receiving device transmits the response signal or partial information of the response signal and/or the value of a current temperature, which is determined by the transmission-receiving device, to a control device of a further kitchen appliance or to an external processor. In addition, a system carries out the method.

The invention relates to a magnetic stirrer (1) having a stirrer drive (2), a heating plate (3) serving as a surface on which a stirring vessel (4) is positioned, and a stirring rod (6) which can be introduced into the stirring vessel (4), can be or is driven by the stirrer drive (2) and comprises a magnet (6a), the stirring rod (6) and/or the magnet (6a) having and/or containing at least one SAW sensor (7) (surface acoustic wave sensor).

An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.

A sensor system includes one or more rotor antennas on a shaft that moves within a stator bracket one or more of around an axis of the sensor system or along the axis of the sensor system, the one or more rotor antennas configured to communicate sensed data with one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other. The one or more rotor antennas are configured to extend one or more of radially around an outer surface of the shaft of a sensor or along the outer surface of the shaft of the sensor.

A system includes a core temperature probe and a microwave cooking device. The core temperature probe includes a temperature sensor to determine a temperature information, a coaxial line including a lambda/4 line resonance element adjusted to a microwave frequency, and a signal transmission antenna connected to the temperature sensor via the coaxial line and adapted to emit the temperature information at a signal transmission frequency that differs from the microwave frequency. The system is hereby constructed to transmit a signal at the signal transmission frequency wirelessly between the signal transmission antenna of the core temperature probe and a signal transmission antenna of the microwave cooking appliance.

An apparatus and method for real-time in-situ simultaneous measurement of temperature and mechanical parameters can include a charge type vibration sensing module having a temperature compensation function and a temperature/vibration coplanarly-integrated wireless surface acoustic wave (SAW) sensing module are controlled by a processing module in which a full-range temperature-vibration composite parameter compensation decoupling method is implanted, which can detect a vibration signal in a variable temperature environment. Moreover, temperature and vibration multi-parameter testing of static components in a high-temperature, narrow and closed environment can be implemented by arranging the charge type vibration sensing module having a temperature compensation function, and the temperature/vibration coplanarly-integrated wireless SAW sensing module implements health monitoring of moving components in a high-temperature and high-rotation environment.