Patent classifications
G01L7/082
ROBOTS HAVING A LIFT ACTUATOR AND A TILT STRUCTURE FOR LIFTING AND SUPPORTING LARGE OBJECTS
A robot includes a rail system, a body structure coupled to the rail system, a first arm coupled to a first side of the body structure, one or more first arm actuators providing the first arm with multiple degrees of freedom, a second arm coupled to a second side of the body structure, one or more second arm actuators providing the second arm with multiple degrees of freedom, a lift actuator operable to move the body structure along the rail system, and a tilt structure coupled to the body structure. The first arm actuators and the second arm actuators are operable to wrap the first arm and the second arm around an object and hold the object against the body structure. The tilt structure is operable to tilt the body structure. The lift actuator is operable to move the body structure such that the object is lifted.
LIFTING ROBOTS
Robots for lifting objects are disclosed. In one embodiment, a robot includes a rail system, a body structure coupled to the rail system, a first arm coupled to a first side of the body structure, one or more first arm actuators providing the first arm with multiple degrees of freedom, a second arm coupled to a second side of the body structure, one or more second arm actuators providing the second arm with multiple degrees of freedom, and a lift actuator operable to move the body structure along the rail system. The one or more first arm actuators and the one or more second arm actuators are operable to wrap the first arm and the second arm around an object and hold the object against the body structure. The lift actuator is operable to move the body structure such that the object is lifted on the rail system.
STRUCTURES AND SENSOR ASSEMBLIES HAVING ENGAGEMENT STRUCTURES FOR SECURING A COMPLIANT SUBSTRATE ASSEMBLY
Structures and sensor assemblies having engagement structures for securing a compliant substrate assembly are disclosed. In one embodiment, a sensor assembly includes a compliant substrate assembly having a base layer, and a deformable layer heat-sealed to the base layer such that the base layer and the deformable layer define at least one inflatable chamber. The sensor assembly further includes a first member proximate to a first edge of the compliant substrate assembly, a second member proximate to a second edge of the compliant substrate assembly, wherein the second edge is opposite the first edge, and at least one pressure sensor fluidly coupled to the at least one inflatable chamber and operable to produce a signal indicative of a pressure within the at least one inflatable chamber.
Pressure sensors and methods of manufacturing a pressure sensor
A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.
MEDIA-RESISTANT PRESSURE SENSOR FOR LARGE PRESSURE RANGES
A pressure sensor comprises a housing, a flexible membrane which, together with the housing, forms a hermetically closed cavity, a sensor element arranged in the cavity, and a gaseous medium in the cavity.
Resonant pressure sensor and manufacturing method therefor
A resonant pressure sensor includes a first substrate and a resonator. The first substrate includes a diaphragm and a projection disposed on the diaphragm. The resonator is disposed in the first substrate, a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate. The first substrate is an SOI substrate in which a silicon dioxide layer is inserted between a silicon substrate and a superficial silicon layer. The intermediate level of the first substrate is disposed in the silicon substrate, and the resonator is disposed in the projection included in the superficial silicon layer.
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING PRODUCTION METHOD
A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.
Membrane, Pressure Sensor System and Method for Producing the Pressure Sensor System
A membrane, a pressure sensor system and a method for producing the pressure sensor system are disclosed. In an embodiment a pressure sensor system includes a housing, at least one media supply line and a pressure-sensitive element including at least one membrane with a hydrophobic region.
Process variable sensor testing
A process transmitter includes a process variable sensor, a test circuit, a switch and a controller. The process variable sensor includes a sensor output that is indicative of a sensed process variable. The test circuit is configured to detect a condition of the process variable sensor. The switch is configured to selectively connect the test circuit to the process variable sensor and disconnect the test circuit from the process variable sensor. The controller is configured to obtain a measurement of the process variable, control the switch, detect a condition of the process variable sensor by comparing the sensor output when the test circuit is connected to the process variable sensor to the sensor output when the test circuit is disconnected from the process variable sensor, and communicate the condition in the measurement to an external control unit.
PRESSURE SENSOR
To manage the effect of disturbance on the reliability of a pressure measurement value, a pressure sensor includes a cylindrical housing in which a through-hole is formed, a diaphragm that has a peripheral edge portion fixed to the housing to block the through-hole and has a first surface in contact with a fluid to be measured, a strain sensor, provided on a second surface on the opposite side of the first surface of the diaphragm, that detects the deformation of the diaphragm, a dummy diaphragm that has a peripheral edge portion fixed to the housing and does not make contact with the fluid, and another strain sensor, provided on a first surface or a second surface of the dummy diaphragm, that detects the deformation of the dummy diaphragm.