Systems, methods, and computer readable medium are provided for automatically resetting a zero-offset calibration coefficient for a pressure transducer. Ambient pressure measurements from a first pressure sensor and a second pressure sensor can be received by a computing device and compared. Based on determining a difference in the received ambient pressure measurements, an updated zero-offset calibration coefficient can be generated. The updated zero-offset calibration coefficient can be transmitted to the first pressure sensor, which once received, causes the first pressure sensor to update a previously determined zero-offset calibration coefficient with the updated zero-offset calibration coefficient.

A microelectromechanical system (MEMS) sensor includes a substrate having a piezoelectric layer thereon; a MEMS piezoelectric resonator including a reference electrode on a first side of the piezoelectric layer, a first port (port 1) including a capacitor coupling electrode on a side of the piezoelectric layer opposite the first side, and a second port (port 2) for excitation signal coupling including another electrode on the side opposite the first side. The MEMS piezoelectric resonator has a natural resonant frequency. A variable capacitor on the substrate is positioned lateral to the MEMS piezoelectric resonator having a first and a second plate are connected to port 1. An antenna or an oscillator circuit is connected to port 2. Responsive to a physical parameter a capacitance of the variable capacitor changes which changes a frequency of the MEMS piezoelectric resonator relative to the natural resonant frequency to generate a frequency shift.

Resonating sensors for use in high-pressure and high-temperature environments are provided. In one embodiment, an apparatus includes a sensor with a double-ended tuning fork piezoelectric resonator that includes a first tine and a second tine. These tines are spaced apart from one another so as to form a slot between the first and second tines. The width of the slot from the first tine to the second tine varies along the lengths of the first and second tines. Various other resonators, devices, systems, and methods are also disclosed.

A vibrating wire piezometer pressure sensor system has (a) a vibrating wire connected to a pressure diaphragm; (b) a first electromagnetic coil (EMC) associated with the vibrating wire; (c) a second EMC associated with the vibrating wire; wherein the first EMC and the second EMC are wired in series and in parallel to a signal processor for converting an electrical signal to a pressure measurement.

Resonating sensors for use in high-pressure and high-temperature environments are provided. In one embodiment, an apparatus includes a sensor with a double-ended tuning fork piezoelectric resonator that includes a first tine and a second tine. These tines are spaced apart from one another so as to form a slot between the first and second tines. The width of the slot from the first tine to the second tine varies along the lengths of the first and second tines. Various other resonators, devices, systems, and methods are also disclosed.

A resonant pressure sensor with improved linearity includes: a substrate including a substrate-separated portion separated from a housing-fixed portion; a first resonator that: is disposed in the substrate-separated portion; and detects a change of a first resonance frequency based on a strain in the substrate caused by static pressure applied by a pressure-receiving fluid; a second resonator that: is disposed in the substrate; detects a change of a second resonance frequency based on the strain in the substrate; and has a pressure sensitivity of the second resonance frequency; and a processor that: measures the static pressure based on the detected change of the first resonance frequency; and corrects the static pressure according to internal temperature of the pressure sensor based on a difference between the second resonance frequency and the first resonance frequency.

Methods and devices are provided for processing image data on a sub-frame portion basis using layers of a convolutional neural network. The processing device comprises memory and a processor. The processor is configured to receive frames of image data comprising sub-frame portions, schedule a first sub-frame portion of a first frame to be processed by a first layer of the convolutional neural network when the first sub-frame portion is available for processing, process the first sub-frame portion by the first layer and continue the processing of the first sub-frame portion by the first layer when it is determined that there is sufficient image data available for the first layer to continue processing of the first sub-frame portion. Processing on a sub-frame portion basis continues for subsequent layers such that processing by a layer can begin as soon as sufficient data is available for the layer.

Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

There are disclosed pressure-sensitive acoustic resonators and remote pressure sensing systems and methods. A pressure-sensitive acoustic resonator includes a conductor pattern formed on a planar surface of a non-piezoelectric substrate, the conductor pattern including an interdigital conductor pattern (ICP); and a diaphragm, the diaphragm being a portion of a plate of single-crystal piezoelectric material, the diaphragm having a front surface exposed to an environment and a back surface facing, but not contacting, the ICP.

A vibrating wire piezometer pressure sensor system has (a) a vibrating wire connected to a pressure diaphragm; (b) a first electromagnetic coil (EMC) associated with the vibrating wire; (c) a second EMC associated with the vibrating wire; wherein the first EMC and the second

EMC are wired in series and in parallel to a signal processor for converting an electrical signal to a pressure measurement.