A pressure sensor assembly includes a tube, wherein a membrane to which the pressure to be measured is applied is arranged in the cross-section of the tube, where the membrane has a high flexural rigidity in a central region and is mounted resiliently in the edge region in the tube via two limbs, and includes a device for detecting the axial displacement which is easily accessible from the outside on the outer side of the tube and is advantageously not in contact with the process medium, and where the pressure sensor assembly has a particularly simple structural configuration, and can be used advantageously in measurement transducers for process instrumentation.

Submersible transducer includes a transducer housing configured to be submerged within an aqueous liquid and a pressure sensor operable to obtain data for determining a pressure of the aqueous liquid. The pressure sensor may be disposed within the transducer housing. The submersible transducer also includes a submersible cable having an electrical conductor and a venting tube operably coupled to the pressure sensor. The pressure sensor uses an atmospheric pressure of an external environment that is detected through the venting tube to determine the pressure of the aqueous liquid. The submersible cable also includes a cable jacket and an inner layer that is surrounded by the cable jacket. The inner layer surrounds the electrical conductor and the venting tube. The inner layer includes a non-hygroscopic polymer that is more resistant to absorbing the aqueous liquid than the cable jacket.

A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.

A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing having a housing wall, a sensor element arranged in the housing, a ceramic substrate configured to serve as a support for the sensor element and an electrical connection thereof and a first heating element arranged in an interior of the housing or in the housing wall.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of vias, a signal transmitting portion, a heater and a sensing material. The plurality of vias penetrates the substrate, wherein each of the plurality of vias includes a conductive or semiconductive portion surrounded by an oxide layer. The signal transmitting portion is disposed in the substrate, wherein adjacent vias of the plurality of vias surrounds the signal transmitting portion. The heater is electrically connected to the signal transmitting portion, and the sensing material is disposed over the heater and electrically connected to the substrate. A method of manufacturing a semiconductor structure is also provided.

A method for expanding the dynamic range of a capacitive pressure sensor and a capacitive pressure sensor having an expanded dynamic range are provided. The capacitive pressure sensor may comprise capacitive plates. At least one plate may be contoured to increase a surface area exposed to the other of the capacitive plates. The capacitive pressure sensor may comprise a diaphragm that is movably responsive to pressure. The diaphragm may have a hollowed volume within an interior of the diaphragm operative to increase a flexibility of the diaphragm in response to the pressure. The capacitive pressure sensor may be one of a plurality of capacitive pressure sensors in a pressure sensing device. The capacitive pressure sensors may have different capacitive responses and may each output a pressure measurement, whereby the device may select a pressure measurement to output based at least in part on the capacitive responses.

The present disclosure includes a pressure transducer comprising: a frame; a cantilevered beam; a resilient beam portion; a signal processing circuit; a wiring terminal; and a support member. The resilient beam portion anchors the cantilevered beam to the frame. The cantilevered beam moves in response to a pressure-induced force applied to the cantilevered beam and the resilient beam portion bends producing a strain within the resilient beam portion. The support member comprises a cavity and the signal processing circuit is entirely installed inside the cavity. There is a strain gauge diffused into, implanted into, and/or affixed to the resilient beam portion. The cavity of the support member includes a first aperture disposed along the first surface of the support member and the inner surface of the frame covers the first aperture.

A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor mounted on the PCB, a side wall engaging the PCB, a membrane, a cavity defined by the membrane, the side wall and the PCB, and a gel or liquid filling the cavity. The pressure sensor assembly may include a fill-hole extending into the cavity through which the cavity may be filled with the gel or liquid. The fill-hole may extend through one or both of the PCB and/or the side wall. The cavity is defined in part by a septum that allows a needle to pierce the septum for filling the cavity with the gel or liquid. A method of forming the pressure sensor assembly may include filling a cavity of the pressure sensor assembly with a gel or liquid through a fill-hole and curing the gel or liquid once in the cavity.

A sensor element includes: a supporting body; and a sensor body, the sensor body being planar in shape, being made of an elastic material, and having a first surface and a second surface coated so as to be electrically conductive. The sensor body includes a measuring segment and a fastening segment. A layer thickness of the fastening segment is greater than a layer thickness of the measuring segment.