Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.

A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

A capacitive pressure sensor (10) is disclosed comprising a membrane (21) including a second electrode (23) spatially separated by a cavity (20) from a substrate (11) including a first electrode (13) opposing the second electrode; and a central pillar (22) extending from the membrane to the substrate such that the cavity is an annular cavity enveloping said central pillar. Also disclosed is an invasive medical instrument comprising such a capacitive pressure sensor and a method of manufacturing such a capacitive pressure sensor.

Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

In a sensor chip junction structure, if a moving distance of a tip of a press jig is any of 50 m and 30 m, for example, a characteristic line of a load (shearing force) (N) applied to an adhesive layer formed on a glass pedestal and having a thickness set in a range from 0.3 mm to 2.5 mm is either located on any of a characteristic line Lt1 (y=1.3889x.sup.3) and a characteristic line Lt2 (y=0.463x.sup.3) or located in a region above zero and equal to or below any of the characteristic line Lt1 and the characteristic line Lt2.

An apparatus in the field of optics technology, can include a reflector, a reflector substrate, and an extinction component. The reflector can be mounted on the reflector substrate. The extinction component can be arranged on a front surface of the reflector substrate. The reflector can be configured to reflect incident light signals. The extinction component can be configured to reduce the scattered light produced by the incident light signal on the reflector substrate. An optical scanning device (for example, lidar) having such features may greatly reduce the scattered light inside the lidar, reduce the detection blind area caused by the stray light, and greatly improve the receiving and detecting capabilities of the lidar.

A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A MEMS pressure sensor includes a first plate with a hole on a diaphragm bonded to the first plate around its rim with the diaphragm positioned over the hole. An isolation frame is bonded to the diaphragm and a second plate with a pillar is bonded to the isolation frame around its rim to form a cavity such that the end of the pillar in the cavity is proximate a surface of the diaphragm. The diaphragm and second plate form a capacitive sensor which changes output upon deflection of the diaphragm relative to the second plate.