Provided is a differential pressure sensor capable of improving joining stability of a filter. The differential pressure sensor includes: a sensor module configured to detect a pressure difference between an atmospheric pressure and a pressure of a measured medium; a case body, which is configured to contain the sensor module, and in which an atmosphere introducing hole for introducing atmospheric air into the case body is formed; and a filter provided from inside the case body to cover the atmosphere introducing hole, the case body having a protrusion, which protrudes to an inside of the case body, the atmosphere introducing hole being formed in the protrusion, the filter being joined to the protrusion.

A sensor device includes a pressure-temperature detection unit and a signal processing circuit. The sensor device is configured to detect abnormalities by changing a supply voltage supplied to the pressure-temperature detection unit and to the signal processing circuit, and by monitoring changes in a pressure signal and in a temperature signal caused by changing the supply voltage.

The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.

To provide a pressure sensor that has high pressure resistance performance, small measurement error by suppressing hysteresis with respect to pressure, and high sensitivity and high productivity, a pressure sensor includes a diaphragm unit with a first main surface that receives a measurement target fluid's pressure and a second main surface located on the opposite side of this first main surface, a housing, and a sensing unit that outputs the diaphragm unit's deformation as an electric signal, in which at least part of the diaphragm unit has a multi-layer structure in which a plurality of thin plate members are stacked, and the plurality of thin plate members are deformed independently of each other while at least part of the plurality of thin plate members is in press-contact to each other in a pressure receiving state in which the measurement target fluid's pressure is applied to the first main surface.

A pressure sensor configured to prevent tearing or cracking of an insulating film for insulating between a stem and a detection circuit from occurring. A stem having a planar outer bottom surface, an outer side surface intersecting the outer bottom surface, and a pressure receiving inner surface that is the opposite surface to the outer bottom surface and receives pressure from a fluid to be measured; and a detection circuit provided to the outer bottom surface with an insulating film interposed therebetween. The stem has a foot part that: is formed to surround the outer bottom surface; consists of a surface which, when observed parallel to the outer bottom surface, faces a direction different from the direction of the outer bottom surface and the outer side surface; and connects between the outer bottom surface and the outer side surface. The insulating film covers a portion of the foot part.

A semiconductor package includes a first substrate and a first semiconductor device. The first semiconductor device is bonded to the first substrate and includes a second substrate, a plurality of first dies and a second die. The first dies are disposed between the first substrate and the second substrate. The second die is surrounded by the first dies. A cavity is formed among the first dies, the first substrate and the second substrate, and a gap is formed between the second die and the first substrate.

A semiconductor device includes a sensor structure body, a gas conduit that extends from a surface of the sensor structure body toward a hollow space in the sensor structure body to introduce a gas into the hollow space from outside, a pressure sensor that is formed inside the sensor structure body and has a membrane which is able to vibrate by actions of the gas, an acceleration sensor that is formed inside the sensor structure body to detect an acceleration that has acted on the sensor structure body, and a sealing resin that covers the sensor structure body, in which the gas conduit includes an inner end portion on the hollow space side and an outer end portion on the end surface side of the sensor structure body, and the outer end portion of the gas conduit is opened on an end surface of the sealing resin.

A pressure sensor includes a movable electrode formed in a movable region of a diaphragm, and a fixed electrode formed opposite to the movable electrode. A pressure receiving surface of the diaphragm is held in an inactive state. The inactive pressure receiving surface of the diaphragm is in a state in which molecules of gas to be measured are hard to absorb onto the pressure receiving surface. The pressure receiving surface of the diaphragm can be made inactive by predetermined surface treatment. A layer for making the pressure receiving surface of the diaphragm inactive is formed by the surface treatment, and the pressure receiving surface of the diaphragm is held inactive with the presence of the layer.

According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.

A pressure sensor assembly, which includes a pressure sensing element having a diaphragm, a plurality of piezoresistors connected to the diaphragm, and at least one layer of sealing glass connected to the diaphragm. The pressure sensor assembly also includes a base, a layer of sealing glass is connected to the base, and is configured to maximize the sensitivity of the plurality of piezoresistors via tailoring the side surfaces of the glass surface to control the deformable diaphragm. The layer of sealing glass includes a first recess portion, and a second recess portion formed as part of the layer of sealing glass on the opposite side of the layer of sealing glass as the first recess portion. One of the plurality of piezoresistors is partially surrounded by the first recess portion, and another of the plurality of piezoresistors is partially surrounded by the second recess portion.