A pressure sensor (100) includes a diaphragm (3); a semiconductor chip (1) that includes a plurality of resistors (R1 to R4) constituting a strain gauge and that has a square shape in plan view; four first structures (2a to 2d) each having one end joined to a region of the second main surface of the diaphragm that is deformed when a pressure is applied to a first main surface (1A) of the diaphragm and having other ends respectively connected to four corners of the semiconductor chip, the first structures extend downward to a second main surface (3B); and a second structure (2e) having one end joined to a center (30) of the diaphragm on the second main surface in plan view and having the other end joined to a center (10) of the semiconductor chip in plan view, the second structure extending downward to the second main surface.

A method for installing a sensor on a component is provided. The method includes attaching the sensor to a surface of the component. The method includes covering the sensor using a metal wire. The method includes applying a multilayer coating on the metal wire. Applying the multilayer coating includes applying a first coating. The first coating is capable of being machined. Applying the multilayer coating includes machining the first coating and applying a second coating over the first coating. The second coating is a ceramic oxide and the second coating is configured to serve as a thermal and dielectric barrier. Applying the multilayer coating also includes applying a third coating over the second coating. The third coating is configured to provide erosion resistance.

The invention relates to a device for determining the weight of a hydraulic accumulator (10) during the operation thereof in a hydraulic facility, where a pressurised liquid is introduced into a pressure vessel at least partially filled with a gas, said pressurised liquid compressing the gas and being stored in such a way that when it leaves the accumulator (10), hydraulic energy is emitted to the facility, and where the respective current weight of the hydraulic accumulator (10) is detected by means of a weighing device (14) applied to the hydraulic accumulator (10).

A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a back end of the strut, and located on the mesa; a strain gage on the strain structure to measure a deformation amount of the strain structure the mold cavity and transforming the deformation amount into deformation amount information; a temperature-sensing element in the strut to measure a temperature of the strut, and transforming the temperature into strut temperature information; and a processing unit to obtain the deformation amount information and the strut temperature information.

A pressure measurement pod for use in blood circuits includes a pressure sensing pod defining a chamber and having a rigid wall portion and an integral flexible wall portion forming a flexible, moveable, fluid-impermeable diaphragm with a first major side thereof facing an interior of the chamber and a second major side opposite the first major side. The second major side faces outwardly away from the chamber, and the pod has ports on sides of the chamber. The internal surfaces of the chamber and ports are shaped such that any contour following the internal surfaces to the outside of one of the ports traces only surfaces characterized by positive or neutral draft angles such that invasive mold portions may be withdrawn through the ports thereby permitting the pressure measurement pod to be molded in a single shot molding process.

In the pressure sensor of the present application, at least two resistors are simultaneously formed on the foldable portion and the fixed portion to ensure the uniformity and consistency of the resistance values of all the resistors, and at least one is a strain sensing resistor R1, the foldable portion is folded to the fixed portion, and the resistors are electrically connected to form a pressure measuring circuit. Connecting the pressure sensor to the desired panel can accurately detect the curved deformation of the panel. The resistors in a pressure measuring circuit are adjacently distributed, and the resistance value of the resistor changes with temperature at the same time, so that the influence of the temperature change on the pressure measuring circuit is very small, and the interference against the external environment is good.

Intelligent temperature and pressure gauge assemblies (52) for use with vessels (24) having pressurized hazard suppression materials therein include temperature and pressure sensors (136, 138) coupled with a digital processor (72) with associated memory for storing empirical temperature and pressure data. The data includes normalized linear temperature-pressure curves consistent with static or slowly changing temperature conditions experienced by the vessels (24), as well as nonlinear temperature-pressure curves consistent with rapidly changing temperature conditions. In use, the assemblies (52) repeatedly sense temperature and pressure conditions of the hazard suppression material and compare sensed values with stored values, and generate an output in conformance with the comparison. In this fashion, the assemblies (52) compensate for rapidly changing temperatures without generating false failure signals.

A pressure measurement pod for blood circuits can include a flexible, moveable, fluid-impermeable diaphragm and can be formed via either a one-shot or a two-shot molding process. A method of manufacturing a pressure measuring device can include providing first and second major mold parts having recesses defining major parts of a housing, and inserting pins in the first and second major mold parts, the pins being shaped to define a flow channel of a molded pressure measuring pod. One of the pins may have a major face that defines an internal surface of a diaphragm. The method may further include closing the first and second major mold parts with the pins therebetween and injection molding a pressure pod housing. Finally, the pressure pod is removed from the mold parts and the pins are withdrawn from the flow channel.

Provided is a pressure sensor capable of minimizing an influence of heat and accurately detecting a pressure of a high temperature pressure medium. The pressure sensor includes a housing including a tubular tip portion, a pressure measuring part including a piezoelectric substance while being accommodated in the housing, and a diaphragm including a flexible plate-shaped section fixed to an inner side of the tubular tip portion and a rod section interposed between the flexible plate-shaped section and the pressure measuring part, wherein a heat shield plate held on the inner side of the tubular tip portion to shield the diaphragm from a pressure medium is provided. Accordingly, an influence of heat can be minimized, and a pressure of a high temperature pressure medium can be accurately detected.

A method for installing a sensor on a component is provided. The method includes attaching the sensor to a surface of the component. The method includes covering the sensor using a metal wire. The method includes applying a multilayer coating on the metal wire. Applying the multilayer coating includes applying a first coating. The first coating is capable of being machined. Applying the multilayer coating includes machining the first coating and applying a second coating over the first coating. The second coating is a ceramic oxide and the second coating is configured to serve as a thermal and dielectric barrier. Applying the multilayer coating also includes applying a third coating over the second coating. The third coating is configured to provide erosion resistance.