A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.

A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

A silicon sensor device includes a plurality of metal layers and a plurality of dielectric layers. The plurality of metal layers include: a first metal layer comprising a plurality of transmitter electrodes and a plurality of receiver electrodes; a second metal layer disposed beneath the first metal layer, wherein the second metal layer comprises a plurality of routing traces for the plurality of transmitter electrodes; and one or more circuit layers disposed beneath the second metal layer. A respective routing trace for a respective transmitter electrode is configured to shield respective portions of the plurality of receiver electrodes which correspond to a width of the respective transmitter electrode from energy and/or noise originating from the one or more circuit layers. The plurality of metal layers and the plurality of dielectric layers are disposed on a same die.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

A pressure sensor includes a first pressure sensing portion and a second pressure sensing portion, each including a first rigid electrode, a second rigid electrode, and a deflectable membrane structure, wherein the second rigid electrode is between the first rigid electrode and the deflectable membrane structure, and wherein the first rigid electrode, the second rigid electrode and the deflectable membrane structure are in a vertical configuration, and wherein the first and second rigid electrode of the first pressure sensing portion form a reference capacitor, and wherein the second rigid electrode and the deflectable membrane structure of the first pressure sensing portion form a sensing capacitor, and wherein the first and second rigid electrode of the second pressure sensing portion form a reference capacitor, and wherein the second rigid electrode and the deflectable membrane structure of the second pressure sensing portion form a sensing capacitor.

A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

A pressure detector includes a first board with a first pressure inlet, a first groove, and a first board electrode; a second board with a second pressure inlet, a second groove, and a second board electrode; and a sensing unit arranged therebetween with a diaphragm. The first groove is in communication with the first pressure inlet so as to prevent the formation of a closed space between the first board and the diaphragm when they contact with each other. The second groove is in communication with the second pressure inlet so as to prevent the formation of a closed space between the second board and the diaphragm when they contact each other.

A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.