An aircraft engine pressure transducer includes a first pressure transducer channel and a second pressure transducer channel. The first pressure transducer channel is configured to sense a pressure of the aircraft engine over a first pressure range and a first temperature range. The second pressure transducer channel is configured to sense the pressure of the aircraft engine over a second pressure range and a second temperature range, the second pressure range being a subset of the first temperature range, and the second temperature range being a subset of the first temperature range.

Embodiments relate generally to systems and methods for adjusting a temperature coefficient of the offset voltage (TCO) for a pressure sensor, the method comprising assembling the pressure sensor, wherein the sensor comprises a plurality of resistive elements; determining the TCO distribution for the sensor; increasing the resistance of one of a stress induced resistor or a leadout resistor of a first resistor; and decreasing the resistance of one of the stress induced resistor or the leadout resistor of the first resistor to adjust the TCO of the sensor.

A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, including: a membrane; a first resistor connected between a first bias node and a first output node; a second resistor connected between the first bias node and a second output node; a first and second current source connected to the first resp. second output node for generating a differential voltage signal indicative of the external pressure to be measured. The resistors including piezo-resistive strips arranged in particular crystallographic directions. The circuit may have a third and four resistor pair for compensating package stress. The Piezo-resistive strips may be formed as p-doped regions within an n-well, the biasing node being electrically connected to the n-well.

Certain implementations of the disclosed technology may include systems, methods, and apparatus for a sealed transducer with an adjustment port. The sealed transducer may include one or more terminals. A first terminal may include electrical connections for connecting to an input voltage source, a ground, and for providing a transducer output signal. A second terminal, for example, may include an electrical port for connecting to an external and separately sealed adjustment network. In one example implementation, the adjustment network can include one or more components configured to couple with internal circuitry of the transducer to alter a response of the transducer.

A pressure sensor includes a diaphragm suspended across a cavity in a substrate. A first group of piezoresistors is provided in the diaphragm proximate a first outer edge of the diaphragm, the piezoresistors of the first group being coupled to one another to form a first Wheatstone bridge. A second group of piezoresistors is provided in the diaphragm proximate a second outer edge of the diaphragm, the piezoresistors of the second group being coupled to one another to form a second Wheatstone bridge. The first and second Wheatstone bridges exhibit mirror symmetry relative to one another. Output signals from each of the first and second Wheatstone bridges are processed at respective first and second differential amplifiers. The output signals from each of the first and second differential amplifiers are processed at a third differential amplifier to produce a pressure output signal with enhanced sensitivity and reduced impact from process variation.

The present invention is related to a sensor. In particular, the present invention is related to a dual-cavity pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a cap, a substrate and a base connected together. A recess is formed on the cap. The recess forms an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the upper sealed cavity. A recess is formed on the base. The recess forms a lower sealed cavity with the substrate. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

The present invention provides a self-heated pressure sensor assembly and method of utilizing the same. The self-heated pressure sensor assembly regulates and maintains the temperature of the pressure sensor, regardless of the external temperature environment, without an external heater as in prior art embodiments. Exemplary embodiments of the pressure sensor assembly incorporate a resistance heater that is built into the sensing chip of the pressure sensor assembly. The pressure sensor assembly also utilizes the resistance of the pressure sensing elements to monitor the temperature of the assembly, which works alongside the resistance heater to maintain a stable temperature within the pressure sensor assembly.

A sensor apparatus includes: a sensor that includes a resistor bridge circuit; a temperature detection circuit that provides a first path and a second path; a voltage measurement portion that measures a voltage of each of the differential output terminals; a controller that causes the voltage measurement portion to measure the voltage of each of the two differential output terminals; and a calculator that calculates a difference between the voltages of the two differential output terminals to acquire temperature information of the sensor.

A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.

A system is for detecting a location of a touch input on a surface of a propagating medium. The system includes a transmitter coupled to the propagating medium and configured to emit a signal. The signal has been allowed to propagate through the propagating medium and the location of the touch input on the surface of the propagating medium is detected at least in part by detecting an effect of the touch input on the signal that has been allowed to propagate through the propagating medium. The system includes a piezoresistive sensor coupled to the propagating medium. The piezoresistive sensor is configured to at least detect a force, pressure, or applied strain of the touch input on the propagating medium.