A double-membrane capacitive pressure sensor comprising a glass substrate, wherein a shallow groove is formed in the center of the glass substrate; a shallow groove through-hole is formed in the center of the shallow groove, and the shallow groove through-hole extends from the bottom surface of the shallow groove to the bottom surface of the glass substrate; a capacitor C1 capable of measuring the low-pressure difference and a capacitor C2 capable of measuring the high-pressure difference are arranged above the shallow groove; the capacitor C1 capable of measuring the low-pressure difference comprises a bottom electrode plate and a thin pressure sensitive membrane, and the capacitor C2 capable of measuring the high-pressure difference comprises a thick pressure sensitive membrane and a top electrode plate.

An infusion arrangement for administering a medical fluid includes a pump apparatus with an elastomeric membrane which forms a pump volume. The elastomeric membrane is elastically extended in a fill state, filled at least partially with medical fluid, of the pump volume and produces a delivery pressure on the pump volume. An infusion line is connected to the pump volume and provided with a patient access for fluid-conducting connection. A main fluid channel transfers medical fluid from the pump volume to the patient access. A monitoring device is connected to the infusion line and configured for monitoring the pump apparatus. The monitoring device has a differential pressure-measuring element connected to the main fluid channel and designed such that differential pressure formed along a channel portion of the main fluid channel can be detected by the differential pressure-measuring element and a delivery rate of the medical fluid can be indicated.

A chip that constitutes a pressure-sensitive sensor and an enclosure are provided. The enclosure is formed with a sensor placement chamber in which the chip is placed. In the sensor placement chamber in which the chip is housed, a first pipe connecting a first communication channel on the side of the sensor placement chamber to a first pressure introduction portion and a second pipe connecting a second communication channel on the side of the sensor placement chamber to the second pressure introduction portion are provided. A side surface of the first pipe and a side surface of the second pipe are disposed out of contact with an inner wall of the sensor placement chamber.

A pressure sensor includes a MEMS pressure transducer with a pressure sensing diaphragm and sensor elements, an isolator diaphragm spaced apart from the pressure sensing diaphragm, and a ceramic header body. The ceramic header body has an electrical conductor and transducer aperture with the MEMS pressure transducer supported therein. The isolator diaphragm is coupled to the to the MEMS pressure transducer by a fluid and is sealably fixed to the ceramic body. The ceramic header body bounds the fluid and the electrical conductor electrically connects the MEMS pressure transducer with the external environment. Differential pressure sensors and methods of making pressure sensors are also described.

The invention relates to a pressure sensor (10) comprising a cavity (12) containing a liquid, said cavity (12) being closed at a first end by a first diaphragm (20a) and at a second end by a second diaphragm (20b), and a measuring body (30) which comprises a strain gauge (31) positioned inside said cavity (12), characterized in that the measuring body (30) is mechanically connected only to one diaphragm among the first diaphragm (20a) and the second diaphragm (20b) by a connection member (50), the measuring body (30) comprising a shape having central symmetry and the connection member (50) being fastened to the center of symmetry of said measuring body (30).

In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

An industrial process differential pressure sensing device includes a housing having first and second isolation cavities that are respectively sealed by first and second diaphragms, a differential pressure sensor, a static pressure sensor, an eddy current displacement sensor, and a controller. The static pressure sensor is configured to output a static pressure signal that is based on a pressure of fill fluid in the first isolation cavity. The differential pressure sensor is configured to output a differential pressure signal that is indicative a pressure difference between the first and second isolation cavities. The eddy current displacement sensor is configured to output a position signal that is indicative of a position of the first isolation diaphragm relative to the housing. The controller is configured to detect a loss of a seal of the isolation cavity based on the position signal, the static pressure signal and the differential pressure signal.

A sensor chip of a sensor element includes a diaphragm for measuring a differential pressure between a first pressure and a second pressure, a diaphragm for measuring an absolute pressure or a gauge pressure of the second pressure, a first pressure introduction path that transmits the first pressure to the diaphragm for measuring a differential pressure, and a second pressure introduction path that transmits the second pressure to the diaphragms. When the transmission of the first pressure or the second pressure to the diaphragms is indicated by an equivalent circuit, a path for transmitting the first pressure and a path for transmitting the second pressure are symmetrically formed.

A sensor element includes a first diaphragm for measuring differential pressure between first pressure and second pressure and a second diaphragm for measuring absolute pressure or gage pressure of the second pressure. The sensor element has a first pressure introduction path (through holes, a groove, and a depression) through which the first pressure is transmitted to the first diaphragm. The sensor element has a second pressure introduction path (through holes, grooves, and depressions) through which the second pressure is transmitted to the first and second diaphragms. The sensor element has a liquid amount adjustment chamber (depression) configured to make an amount of a first pressure transmission medium filled in the first pressure introduction path and an amount of a second pressure transmission medium filled in the second pressure introduction path to be equal to each other.

A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.