An apparatus includes a header containing a sensor configured to measure pressure and a sensor body connected to the header, where the sensor body and the header form a pressure vessel configured to receive an input pressure. The header is connected to the sensor body such that the input pressure received on an inner surface of the header is substantially equal to the input pressure received on an outer surface of the header. A lowest connection point of the header to the sensor body may be located at or above a highest point at which the input pressure extends into the header. A lower portion of the header may be unconnected to the sensor body and extend into an interior volume of the sensor body. The header may include a vent configured to expose the sensor to atmospheric pressure or a lower-pressure input pressure.

An apparatus includes a sensor body and a sensor configured to measure pressure. The apparatus also includes at least one pressure input in or on the sensor body, where the at least one pressure input is configured to provide at least one input pressure to the sensor. The apparatus further includes multiple fluid passages configured to convey the at least one input pressure from the at least one pressure input to the sensor using a fill fluid. The multiple fluid passages are configured to both (i) transport the fill fluid and (ii) absorb thermal energy in a flame created by the sensor before the flame exits the sensor body. The fluid passages can include long and narrow straight passages, long and narrow curved or helical passages, and turns or bends. The fluid passages can have small cross-sections relative to their lengths.

A differential pressure measuring pickup comprises a measuring pickup body and a differential pressure sensor. The measuring pickup body has a process interfacing surface with a first pressure input opening and a second pressure input opening. The differential pressure sensor can be loaded with a first pressure through the first pressure input opening and with a second pressure through the second pressure input opening. The first pressure input opening is closed by way of a first separating diaphragm and the second pressure input opening is closed by way of a second separating diaphragm. The first separating diaphragm is sealed with respect to the surroundings by way of a first seal, and wherein the second separating diaphragm is sealed with respect to the surroundings by way of a second seal. The differential pressure measuring pickup is tensioned during measuring operation with the process interfacing surface thereof against a process interfacing flange, wherein at least one plate-shaped spacer element with plane-parallel surfaces is clamped in between the process interfacing flange and the process interfacing surface, which spacer element defines the spacing between the process interfacing surface and the process interfacing flange and limits clamping of the seals between the process interfacing surface and the process interfacing flange.

A diaphragm seal assembly, which includes a measuring instrument, a pressure being transmitted from a process side to be monitored, via an arrangement of two diaphragms having an evacuated intermediate space disposed therebetween, to the measuring instrument, reliably separated from the process side, the fatigue strength of the diaphragm seal assembly under extreme application conditions being improved.

A pressure sensor includes: a first substrate having first and second diaphragms on one surface provided by first and second recesses on another surface; first and second detecting elements on the first and second diaphragms; a second substrate providing a first reference pressure chamber with the one surface of the first substrate; a third substrate providing a second reference pressure chamber sealing the second recess; and a calculator calculating an offset value by a difference between a reference signal and an inspection signal and detecting a pressure of a measurement medium by a difference between a detection signal and the offset value. The first detecting element outputs the detection signal or the inspection signal according to a pressure difference between a first reference pressure or a reference medium pressure and a measurement medium pressure in the first recess. The second detecting element outputs the reference signal according to a difference between the first reference pressure and and a second reference pressure.

A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.

A differential pressure sensor includes a first sensor housing member having a first fluid inlet port for receiving a first fluid at a first pressure and a second sensor housing member having a second fluid inlet port for receiving a second fluid at a second pressure. A pressure-sensing subassembly includes a semiconductor pressure-sensing die having a sensitive diaphragm for sensing pressure. The pressure-sensing subassembly is configured for insertion into the differential pressure sensor such that once inserted the first fluid inlet port is in fluid communication with a first surface of the sensitive diaphragm and the second fluid inlet port is in fluid communication with a second surface of the sensitive diaphragm.

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.

A process fluid pressure transmitter includes a pressure sensor body containing a pressure sensor that has an electrical characteristic that changes in response to applied pressure. An isolation diaphragm is configured to be exposed to process fluid. A fill fluid fluidically couples the isolation diaphragm to the pressure sensor. A weld ring is welded to the isolation diaphragm at a first weld. A barrier metal is disposed on at least one surface of the isolation diaphragm such that the barrier metal extends over the first weld. The weld ring is welded to the pressure sensor body at a second weld that is spaced from the barrier metal.

A pressure transmitter is disclosed. A pressure measuring portion pressurized by a target fluid that is a target of a pressure measurement and a reference pressure measuring portion pressurized by an external fluid outside a pipe are provided. In addition, a part of the pressure measuring portion that is pressurized by the target fluid and a part of the reference pressure measuring portion that is pressurized by the external fluid are provided inside one thermally conductive member. Accordingly, at the portion pressurized by the target fluid and at the portion pressurized by the external fluid, a difference in temperature between the pressure measuring portion and the reference pressure measuring portion may be insignificantly small. As a result, an accuracy of an operation of correcting an error that may be generated by thermal expansion of the medium fluid in the pressure measuring portion can be improved.